Intel® Server System M70KLP4S2UHH
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'21
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Marketing Status
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Discontinued
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Expected Discontinuance
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2022
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EOL Announce
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Monday, March 7, 2022
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Last Order
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Friday, May 6, 2022
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Last Receipt Attributes
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Tuesday, July 5, 2022
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Limited 3-year Warranty
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Yes
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Chassis Form Factor
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2U Rack
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Chassis Dimensions
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841 mm x 435 mm x 87 mm
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Board Form Factor
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610mm x 424mm, Thickness 2.34mm
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Rack Rails Included
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Yes
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Socket
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P+
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TDP
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250 W
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Heat Sink
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(2) 2U Front CPU Heatsink
(2) 2U Rear CPU Heatsink |
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Mainstream
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Rack-Friendly Board
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Yes
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Power Supply
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2000 W
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Power Supply Type
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AC
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# of Power Supply Included
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2
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Redundant Fans
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Yes
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Redundant Power Supported
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Yes
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Backplanes
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Included
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Included Items
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(1) Intel® Server Chassis M70KLP2UCHHH
(1) Intel® Server Board M70KLP2SB (1) 2U PCIe Riser M.2 Connector KLP2UM2RISER (1) SlimSAS M.2 Cable KLPCBLSSM2 (1) 2U 8x2.5" SAS/NVME Hot-Swap Backplane KLP08HSBP (1) DC Power Cable Mid-HSBP KLPCBLDCPM - 230mm (1) Comm Cable HSBP-Mid KLPCBLCOM224M - 820mm (6) 2U Fan Kit KLP2UFAN (1) Fan Bracket (8) 2.5" Hot-Swap Drive Carrier KLP25HSCAR (2) 2000W AC Common Redundant Power Supply KLP2000CRPS (1) 2U Rail Kit (Full Extension) KLPRAILK (1) Front I/O Panel assembly (VGA+1x USB 3.0+1x USB 2.0) installed (1) 2U Server airduct (48) Blank DIMM slots (4) CPU heat sink + CPU Clips (2) Front Panel 8 Drive Filler Plate (1) PDB (1) PDB Cable Note: Risers supporting additional PCIe 3.0 cards, drive carriers and backplanes (for (16) or (24) 2.5” drive support) sold separately. |
Supplemental Information
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Description
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Integrated 2U server system supporting
(4) 3rd Generation Intel® Xeon® Processors. (8) 2.5” drives (2) x16 Half Height Half Length PCIe 3.0 cards (4) x8 Half Height Half Length PCIe 3.0 cards. |
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Memory & Storage
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Storage Profile
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Hybrid Storage Profile
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Memory Types
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DDR4, RDIMMs, LDRIMMs and Intel® Optane™
Persistent Memory. 15 TB with Intel® Optane™ Persistent Memory |
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# of Memory Slots
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48
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Max Memory Size (dependent on memory type)
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6 TB
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Max Storage Capacity
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192 TB
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# of Front Drives Supported
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24
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Front Drive Form Factor
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Hot-swap 2.5"
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# of Internal Drives Supported
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2
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Internal Drive Form Factor
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M.2 SSD
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Intel® Optane™ Persistent Memory Supported
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Yes
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Expansion Options
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PCIe x8 Gen 3
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4
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PCIe x16 Gen 3
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2
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PCIe Slimline Connectors
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8x8
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Connector for Intel® Integrated RAID Module
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1
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Riser Slot 1: Total # of Lanes
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40
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Riser Slot 1: Included Slot Configuration(s)
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2x PCIe Gen3 x16 + 1x PCIe Gen3 x8
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Riser Slot 2: Total # of Lanes
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24
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Riser Slot 2: Included Slot Configuration(s)
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3x PCIe Gen3 x8
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I/O Specifications
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Open Compute Port (OCP) Support
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1x 3.0 slot
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# of USB Ports
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5
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Total # of SATA Ports
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1
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USB Configuration
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One USB 2.0 port on front panel
One USB 3.0 port on front panel Two USB 3.0 port on rear panel One USB 2.0 port on board |
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Max # of UPI Links
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6
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RAID Configuration
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1, 5, 6, and 10
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# of Serial Ports
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2
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Package Specifications
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Max CPU Configuration
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4
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® On-Demand Redundant Power
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.