Product Collection
Status
Launched
Launch Date
2012
Lithography
28 nm

Resources

Logic Elements (LE)
110000
Adaptive Logic Modules (ALM)
41509
Adaptive Logic Module (ALM) Registers
166036
Fabric and I/O Phase-Locked Loops (PLLs)
6
Maximum Embedded Memory
6.191 Mb
Digital Signal Processing (DSP) Blocks
112
Digital Signal Processing (DSP) Format
Variable Precision
Hard Processor System (HPS)
Dual-core Arm* Cortex*-A9
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR2, DDR3, LPDDR2

I/O Specifications

Maximum User I/O Count
288
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL, HiSpi, SLVS, Sub-LVDS
Maximum LVDS Pairs
144
Maximum Non-Return to Zero (NRZ) Transceivers
9
Maximum Non-Return to Zero (NRZ) Data Rate
6.144 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F896

Supplemental Information

Additional Information