Product Collection
Status
Launched
Launch Date
2013
Lithography
28 nm

Resources

Logic Elements (LE)
462000
Adaptive Logic Modules (ALM)
174340
Adaptive Logic Module (ALM) Registers
697360
Fabric and I/O Phase-Locked Loops (PLLs)
14
Maximum Embedded Memory
25.478 Mb
Digital Signal Processing (DSP) Blocks
1090
Digital Signal Processing (DSP) Format
Variable Precision
Hard Processor System (HPS)
Dual-core Arm* Cortex*-A9
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
540
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
256
Maximum Non-Return to Zero (NRZ) Transceivers
30
Maximum Non-Return to Zero (NRZ) Data Rate
10.3125 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F896, F1152, F1517

Supplemental Information

Additional Information