Product Collection
Status
Launched
Launch Date
2012
Lithography
28 nm

Resources

Logic Elements (LE)
360000
Adaptive Logic Modules (ALM)
135840
Adaptive Logic Module (ALM) Registers
543360
Fabric and I/O Phase-Locked Loops (PLLs)
20
Maximum Embedded Memory
23.385 Mb
Digital Signal Processing (DSP) Blocks
1044
Digital Signal Processing (DSP) Format
Variable Precision
Hard Memory Controllers
No
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
414
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
207
Maximum Non-Return to Zero (NRZ) Transceivers
24
Maximum Non-Return to Zero (NRZ) Data Rate
12.5 Gbps
Transceiver Protocol Hard IP
PCIe Gen2, PCIe Gen3

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
H780, F1152

Supplemental Information

Additional Information