Product Collection
Status
Launched
Launch Date
2012
Lithography
28 nm

Resources

Logic Elements (LE)
450000
Adaptive Logic Modules (ALM)
169800
Adaptive Logic Module (ALM) Registers
679200
Fabric and I/O Phase-Locked Loops (PLLs)
24
Maximum Embedded Memory
39.306 Mb
Digital Signal Processing (DSP) Blocks
1139
Digital Signal Processing (DSP) Format
Variable Precision
Hard Memory Controllers
No
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
674
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
334
Maximum Non-Return to Zero (NRZ) Transceivers
36
Maximum Non-Return to Zero (NRZ) Data Rate
12.5 Gbps
Transceiver Protocol Hard IP
PCIe Gen2, PCIe Gen3

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F1152, F1517

Supplemental Information

Additional Information