Product Collection
Status
Launched
Launch Date
2011
Lithography
28 nm

Resources

Logic Elements (LE)
156000
Adaptive Logic Modules (ALM)
58900
Adaptive Logic Module (ALM) Registers
235600
Fabric and I/O Phase-Locked Loops (PLLs)
10
Maximum Embedded Memory
11.471 Mb
Digital Signal Processing (DSP) Blocks
396
Digital Signal Processing (DSP) Format
Variable Precision
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
416
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
150
Maximum Non-Return to Zero (NRZ) Transceivers
9
Maximum Non-Return to Zero (NRZ) Data Rate
10.3125 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F672, F896

Supplemental Information

Additional Information