Product Collection
Marketing Status
Launched
Launch Date
2011
Lithography
28 nm

Resources

Logic Elements (LE)
242000
Adaptive Logic Modules (ALM)
91680
Adaptive Logic Module (ALM) Registers
366720
Fabric and I/O Phase-Locked Loops (PLLs)
12
Maximum Embedded Memory
15.108 Mb
Digital Signal Processing (DSP) Blocks
800
Digital Signal Processing (DSP) Format
Variable Precision
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
544
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
256
Maximum Non-Return to Zero (NRZ) Transceivers
18
Maximum Non-Return to Zero (NRZ) Data Rate
10.3125 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F896, F1152

Supplemental Information