Product Collection
Marketing Status
Launched
Launch Date
2013
Lithography
20 nm

Resources

Logic Elements (LE)
320000
Adaptive Logic Modules (ALM)
118730
Adaptive Logic Module (ALM) Registers
474920
Fabric and I/O Phase-Locked Loops (PLLs)
16
Maximum Embedded Memory
19.8 Mb
Digital Signal Processing (DSP) Blocks
985
Digital Signal Processing (DSP) Format
Multiply, Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Processor System (HPS)
Dual-core Arm* Cortex*-A9
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR4, DDR3, QDR II, QDR II+, QDR IV, LPDDR3, DDR3L

I/O Specifications

Maximum User I/O Count
484
I/O Standards Support
3.0 V LVTTL, 1.2 V to 3.0 V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
168
Maximum Non-Return to Zero (NRZ) Transceivers
24
Maximum Non-Return to Zero (NRZ) Data Rate
17.4 Gbps
Transceiver Protocol Hard IP
PCIe Gen3

Advanced Technologies

FPGA Bitstream Security
Yes

Package Specifications

Package Options
F672, F780, F1152

Supplemental Information