Product Collection
Status
Launched
Launch Date
2013
Lithography
20 nm

Resources

Logic Elements (LE)
900000
Adaptive Logic Modules (ALM)
339620
Adaptive Logic Module (ALM) Registers
1358480
Fabric and I/O Phase-Locked Loops (PLLs)
48
Maximum Embedded Memory
56.2 Mb
Digital Signal Processing (DSP) Blocks
1518
Digital Signal Processing (DSP) Format
Multiply, Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR4, DDR3, QDR II, QDR II+, RLDRAM 3, HMC, MoSys, QDR IV, LPDDR3, DDR3L

I/O Specifications

Maximum User I/O Count
768
I/O Standards Support
3.0 V LVTTL, 1.2 V to 3.0 V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
384
Maximum Non-Return to Zero (NRZ) Transceivers
96
Maximum Non-Return to Zero (NRZ) Data Rate
17.4 Gbps
Transceiver Protocol Hard IP
PCIe Gen3

Advanced Technologies

FPGA Bitstream Security
Yes

Package Specifications

Package Options
F1152, F1517, F1932

Supplemental Information

Additional Information