Product Collection
Status
Launched
Launch Date
2013
Lithography
20 nm

Resources

Logic Elements (LE)
160000
Adaptive Logic Modules (ALM)
61510
Adaptive Logic Module (ALM) Registers
246040
Fabric and I/O Phase-Locked Loops (PLLs)
12
Maximum Embedded Memory
10 Mb
Digital Signal Processing (DSP) Blocks
156
Digital Signal Processing (DSP) Format
Multiply, Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR4, DDR3, QDR II, QDR II+, RLDRAM 3, HMC, MoSys, QDR IV, LPDDR3, DDR3L

I/O Specifications

Maximum User I/O Count
288
I/O Standards Support
3.0 V LVTTL, 1.2 V to 3.0 V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
120
Maximum Non-Return to Zero (NRZ) Transceivers
12
Maximum Non-Return to Zero (NRZ) Data Rate
17.4 Gbps
Transceiver Protocol Hard IP
PCIe Gen3

Advanced Technologies

FPGA Bitstream Security
Yes

Package Specifications

Package Options
U484, F672, F780

Supplemental Information

Additional Information