Product Collection
Status
Launched
Launch Date
Q3'19
Lithography
14 nm

Resources

Logic Elements (LE)
1325000
Adaptive Logic Modules (ALM)
449280
Adaptive Logic Module (ALM) Registers
1797120
Fabric and I/O Phase-Locked Loops (PLLs)
16
Maximum Embedded Memory
114 Mb
Digital Signal Processing (DSP) Blocks
2592
Digital Signal Processing (DSP) Format
Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Processor System (HPS)
Quad-core 64-bit ARM* Cortex*-A53
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR, DDR2, DDR3, DDR4, Intel® Optane™ Persistent Memory, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
528
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
264
Maximum Non-Return to Zero (NRZ) Transceivers
32
Maximum Non-Return to Zero (NRZ) Data Rate
28.9 Gbps
Maximum Pulse-Amplitude Modulation (PAM4) Transceivers
8
Maximum Pulse-Amplitude Modulation (PAM4) Data Rate
57.8 Gbps
Transceiver Protocol Hard IP
PCIe Gen3, PCIe Gen4, 10/25/100G Ethernet

Advanced Technologies

Hyper-Registers
Yes
FPGA Bitstream Security
Yes

Package Specifications

Package Options
F1760

Supplemental Information

Additional Information