Offerings
Offering
Radar app/Intel/Supermicro/HCL/Visibility installed at strategic points in the city ,connected to the police and the monitoring center, which contributes to the generation of data and the continuous improvement of public services, while generating connectivity for all citizens, because it includes an Internet connection and a MESH WIFI 6 network camera with artificial intelligence with spot processing with Intel® chips. Smart microphones with high range. Mega spot data processor. WIFI 6 antennas for private and public network. LED light on pole. Radar app for the whole city. Social security network.
Offering
Supermicro’s Intelligent Retail Edge is a complete edge computing platform which provides a reliable, flexible, and secure infrastructure solution for retailers, restaurants, and hotels. As local compute across distributed locations becomes increasingly critical for retail operations, these platforms must be deployed, managed, maintained, and secured on a mass scale.
Offering
Artificial intelligence (AI), internet of things (IoT), data security, and use cases inmanufacturing, health care, transportation, retail, and others rely on ultra-low-latencycomputing to generate and process data to meet the needs of real-time applications.For example, in manufacturing, data from sensors analyzed in near–real time can helpenable robots to more efficiently run a production line. In health care operations, suchdata can help medical professionals improve how they share and collaborate on datafor patient care and make faster decisions to support positive outcomes. Intransportation, real-time data can help enable better flow of traffic and help improvethe safety of road conditions. In retail, checkout-free stores or drive-up windows enablea more personalized customer experience. The use cases for low-latency computing are wide and vast.
Offering
Edge computing allows the cloud and physical world to integrate, providing this next generation, digital-ready infrastructure to support speed to market delivering digital and immersive experiences in your stores, restaurants and branches. The Supermicro/Reliant Edge Computing platform is a pre-configured, hardened platform for the retail and hospitality industry that includes leading tools for virtualization, containerization, monitoring, security for sensitive data, and centralized controls to manage a scalable infrastructure supporting legacy and next generation applications, IoT, operating systems, and devices across thousands of geographically dispersed locations.
Offering
Intel® Xeon D Ice Lake 4/8/16/20 Cores Processor Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 512GB 1 x IPMI dedicated LAN ;4 x GbE ; 2x 10GbE; 2 x 25G SFP28 2x USB 3.0 type A; 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 2 SATA/U.2 2.5” drives Motherboard: X12SDV-4C/8C/16C/20C-SPT8F(7.5”x 8.5”) 1U Chassis: 515M-R804/515M-R601 W17.2” x D15.7” x H1.7” (437x399x43mm) Applications: Networking Application, Firewall, uCPE, Telecom Application
Offering
Highly Modular Multi-Node Systems with Tool-Less DesignSupermicro ® X12 BigTwin ® systems provide superior performance and serviceabilitywith dual 3rd Gen Intel Xeon Scalable processors per node and hot swappable tool-lessdesign.Superior modular mid-plane design with PCI-E Next Gen Storage Controller Options.Multi-node BigTwins with shared components can be more cost effective thanstandard 1U servers.Highly configurable 2U 4-node and 2U 2-node systems3rd Gen Intel® Xeon® Scalable processors, 2 per node, up to 270W TDPAll-hybrid hot-swappable drive bays - NVMe, SAS or SATA (2.5” or 3.5” drives) - Up to 12 NVMe drives per node.16 DIMMs + 4 Intel Optane Persistent Memory 200 series per nodePCI-E 4.0 AIOM (OCP 3.0 compliant) networking - 1 per node
Offering
Supermicro offers 100% cloud-based edge management total solution. The solution connects Apps to Network, Cloud, Data Center or other Edge Gateway through a platform providing a consistent, automated, hardware agnostic, and secure operating model for mass-deployed edge devices and applications. Customers can benefit from highly efficient management by one-click for hundreds of units full stack provisioning.
Offering
Cost-Effective 2U 4-Node Rackmount ServerTwinPro® systems are designed for simplified deployment and maintenance, and assembled with the highest quality to ensure continuous operation even at maximum capacity.Optimized thermal design for maximum power efficiencyDual socket supported. TDP up to 185W, 2 UPI16 DIMM slots. Up to 4TB ECC RDIMM/LRDIMM DDR4-3200MHzSupport up to 6 hot-swappable SAS/SATA and 2 internal M.2 NVMe SSDs per nodeOnboard dual 10GbE RJ45 ports with Intel® X710-AT2 controller2 PCI-E 4.0 x16 LP expansion slots and 1 PCI-E 4.0 x8 (M.2)2 Redundant 2200W Titanium Level (96%) power supplies
Offering
Best-in-class Performance and Flexibility Rackmount ServerUltimate Configurability for Enterprise and Telco ApplicationsThe all-new Hyper series represents the latest generation of Supermicro rackmount servers built with the highest performance features to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit to your application needs.Telco optimized configurations include short depth, carrier grade (NEBS Level 3) Hyper-E servers with AC & DC power options.Maintenance-friendly design innovations to eliminate the need for tools when servicing the system.High performance 1U & 2U systems with rear I/O and front I/O configurations to meet today’s data center requirementsDual 3rd Gen Intel® Xeon® Scalable processors up to 270W and 32 DIMM slots for maximum memory capacityLightning-fast storage with the latest generation PCI-E 4.0 NVMe SSDs and networking flexibility with AIOM (OCP 3.0 compliant) NIC supportTool-less system design features intended to simplify field serviceability and lower maintenance time
Offering
Advanced Multi-node 4U Twin Architecture with 8 and 4 Nodes Innovative Twin Architecture to Maximize Serviceability and Reliability The FatTwin® architecture provides flexibility and system accessibility for unique data center requirements. Unique one-half width nodes provides for 2 nodes per rack unit, which allows for modularized left and right nodes with redundant power supplies for maximum reliability. Highly modular multi-node systems with tool-less design. Each node supports dual 3rd Gen Intel Xeon Scalable processors for improved performance
Offering
Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual GbE LAN with Intel® i210-AT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0 1 HDMI, 1 VGA, 1 48-bit LVDS, Intel® HD Graphic 3 independent displays 1 USB 3.1 Gen2 Type-C port, 2 USB 3.0 ports, 4 USB 2.0 ports, 4 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports on board TPM 2.0 Supports 12V DC power input The A2SAN and X11SAN motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAN and X11SAN delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAN-H/-E/-L and X11SAN resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.
Offering
Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual LAN with Intel® Ethernet Controller I210-IT 1 M.2 B-Key 2242/3042, 1 Half size Mini-PCI-E 1 HDMI, 1 48-bit LVDS, Intel® HD Graphic 2 independent displays Extension I/O (1 DP/HDMI, 2 PCI-E x1, 2 USB2.0, LPC, SATA, SMBus, Power) 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers), 2 COM ports (via headers) Supports 12V DC power input Wide temperature support from -30°C to 75°C The A2SAP-H/-E/-L motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAP-H/-E/-L delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAP-H/-E/-L resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.
Offering
Intel ® Ice Lake-D 4/8/10 Cores Processor Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 256GB 1 x IPMI dedicated LAN; 2x 25G SFP28; 4x GbE 2x USB 3.0 type A; 3x M.2 (M/B/E-Key) 2x SATA SSD 2.5” drives Applications: Retail Application, Firewall, Gateway, uCPE