Offerings
Offering
ADLINK’s MXM-AXe MXM (R3.1) Type A discrete GPU module based on Intel® Arc™ GPU are packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in sectors such as commercial / casino gaming, healthcare, media processing, and transportation. ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at max. 50W TGP and the industry’s first full AV1 hardware encoding. Boosting graphics rendering significantly, the module is your key to suiting next-gen graphics workloads. The MXM-AXe leverages Intel’s well-established graphics ecosystems, such as OpenVINO™ for AI and Intel® OneAPI management tools that edge developers have enjoyed and relied on for years. More than a new line of GPUs, but one that makes your migration from integrated to discrete graphics seamless as ever. Supporting Intel® Deep Link technology, MXM AXe can be paired with 12th and 13th Gen Intel® Core™ processors for even elevated performance and power efficiency by automated workload allocation between integrated GPU, discrete GPU, and CPU.
Offering
ADLINK’s Express-ID7 COM Express Type 7 basic size module is based on the Intel® Xeon® D processor, and is supporting up to 10-cores CPU and 128GB DDR4 2933 MT/s memory for high performance edge computing and Intel® Xeon® processor-class reliability, availability, and serviceability (RAS). The modules provide support for 16 lanes PCIe 4.0 and 16 lanes PCIe 3.0, 4x 10GBASE-KR Ethernet with industrial-class reliability and extended temperature ratings for embedded and rugged applications.The Express-ID7 features Intel® Deep Learning Boost (VNNI) and Intel® AVX-512 instructions, support for hard-real-time workloads, and up to 10 CPU cores make these modules ideal for workload consolidation, running multiple virtual machines, or creating more-robust systems for critical applications in high-bandwidth storage/analytics, manufacturing, and aerospace.
Offering
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D processor, and is the first COM-HPC Server Type module to support advanced architecture with up to 20-cores and 256GB DDR4 2933 MT/s memory for high performance edge computing and Intel® Xeon® processor-class reliability, availability, and serviceability (RAS). The modules provide support for 32 lanes PCIe 4.0 and 16 lanes PCIe 3.0, max. 8x ETH_KR (PHY on carrier required, except KR backplane) with 10G/25G per port, IPMB remote management with industrial-class reliability and extended temperature ratings for embedded and rugged applications. The COM-HPC-sIDH features Intel® Deep Learning Boost (VNNI) and Intel® AVX-512 instructions, support for hard-real-time workloads, and up to 20 CPU cores make these modules ideal for workload consolidation, running multiple virtual machines, or creating more-robust systems for critical applications in high-bandwidth video storage/analytics, manufacturing, and aerospace.
Offering
ADLINK and Intel® have created an automated weld-defect detection solution based on ADLINK’s EOS vision system with ADLINK Edge IoT software and the Intel® Distribution of OpenVINO™ toolkit action recognition model, capable of automatically detecting porosity defects from video frames in a way not possible with the human eye. Using a neural network–based inference engine, the solution can not only detect defects in real time but also automatically stop the welding process via robot actuation before the defect is prolonged and the part is damaged beyond repair. The model can also be retrained to detect additional types of defects in the welding process. This innovative solution supports a smarter factory, helping to create production lines that are built for Industry 4.0.The solution consists of a pretrained machine learning model from Intel on the ADLINK EOS-1620 machine vision platform featuring Intel® Core™ i7 processors and Intel® Movidius™ Myriad™ X VPUs. Integrated ADLINK Edge IoT software supports the seamless integration of systems and equipment to capture, stream, process, understand, and act on vision data. The VPU-accelerated machine vision platform runs the ADLINK Edge implementation of the Intel® Distribution of OpenVINO™ toolkit, incorporating its inference engine into the ADLINK Data River data-sharing platform. This allows analysis and inference capabilities for compute-intense vision workloads from multiple machine vision streams. In order to deliver the right machine vision data to the right place at the right time, the Data River platform supports the ability to plug in modular software and hardware anywhere at the edge to facilitate north-south and east-west data flow.
Offering
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
Offering
Features● Single Intel® Ice Lake D LCC family processor● 3x DDR4 RDIMM memory sockets● Storage interfaces: 2x 2.5” & 2x M.2 (2242/2280)● Intel® eASIC by card for FEC acceleration● Built-in Intel® QAT: SSL (20G), Compression (15G)● Flexible platform to meet 5G BBU demands• Clock sync with GPS/Beidou, IEEE 1588v2 and RS422• PCIe expansion: 1x PCIe x16 Gen3 & 1x PCIe x (8+8) Gen3 FHFL● Advanced chassis management, IPMI v2.0 compliant
Offering
COM Express Type 10 Mini size Computer-on-Module. ADLINK nanoX-EL supports 6th generation Intel Atom® x6000 processors combined with Intel® UHD graphics at low power envelope and high speed interfaces. nanoX-EL modules support In-Band ECC dual channel DDR4 memory up to 16GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
Offering
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
Offering
ADLINK Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000 processors and octa-core (8-core) performance. Intel® UHD Graphics and Intel® AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high speed video encoding and streaming, medical ultrasound, predictive traffic analysis and other demanding applications. Additional 8C at 25 Watt TDP with ECC memory feature and on-board NVMe storage make it suitable for space constrained applications. AI, machine learning and internet of things (IoT) devices increase demand for real-time processing—from the edge to the cloud. The Express-TL module offers advanced tuning controls, immersive graphics, and unmatched connectivity, which allows new possibilities for AI, workload consolidation, and other intensive computing demands. The integrated Intel® UHD Graphics core can be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP).
Offering
The Express-CFR is a COM Express® COM.0 R3.0 Basic Size Type 6 module supporting Hexacore 9th Generation Intel® Core™ and Xeon® and Celeron® processors (codename "Coffee Lake Refresh") with Intel® QM370, HM370, CM246 Chipset.Express-CFR supports Hexacore at 45W and Hexacore at 25W for more flexibility in system integration. DDR4 dual-channel memory up 2400 MHz with ECC/non-ECC support determined by CPU/chipset combination to provide excellent overall performance.
Offering
Key Features6th gen. Intel Core Processor (formerly codenamed Skylake)Up to 8GB DDR4-ECC soldered memory3x DDI channels, 1x micro HDMI, 1x mini DP and 1x 18/24 bit single channel LVDS4x PCIe x1 and 1x PCIe x 16 (PEG) configurable as 1x PCIe x16 or 2x PCIe x8 or 1x PCIe x8 + 2x PCIe x42x GbE LAN, 2x SATA 6Gb/s, 1x USB 3.1, 6x USB 2.0, 2x COM, 8x GPIOSupports Smart Embedded Management Agent (SEMA®) functionsExtreme Rugged operating temperature -40°C to +85°C variantThe CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.Integrated Intel® Generation 9 Graphics includes features such as OpenGL 5.x, OpenCL 2.x, DirectX 2015, DirectX 12, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full HEVC/VP8/VP9/AVC/MPEG2 hardware codec. Graphics outputs include single-channel 18/24-bit LVDS (eDP x4 lanes optional) and three DDI ports supporting HDMI/DVI/DisplayPort.The CMx-SLx is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.The CMx-SLx features one mini DisplayPort (DDI1), one micro HDMI port (DDI2), and one single channel 18/24-bit LVDS port (eDP), two Gigabit Ethernet ports, four USB 2.0 ports, two COM ports, eight GPIOs (from BMC), two SATA 6Gb/s ports, and one onboard SATA SSD supporting SLC (up to 32GB) and MLC (up to 64GB). The module is equipped with an SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as fail safe BIOS, remote console, CMOS backup, hardware monitor, and watchdog timer.The CMx-SLx is capable of working in the temperature ranges of 0C~60C (standard) and -40C~85C (extended).
Offering
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.ADLINK AI Plug-and-Play (PnP) EOS-i6000-M Series is designed for deep-learning inference AI GigE Vision Systems. The pre-installed AI development component reduces testing and integration time, saves personnel costs, and speeds up your time to market.EOS-i6000-M Series passed an extreme validation process to provide high reliability in power consumption, thermal control, and compatibility; therefore, there is no need to worry about the integration of hardware and software. The compact EOS-i6000-M Series supports up to 4x Intel® Movidius™ Myriad™, thus being ideal for object classification and detection application with deep learning.ADLINK provides optimized imaging hardware/firmware/software performance tuning based on 20-years’ expert experience in machine vision to find the best configuration and provide best service.Pre-installed AI development component reduces testing and integration efforts thus accelerating time-to-marketHigh product reliability guaranteed by well-validated power consumption, thermal design, and compatibilityOptimized hardware design and performance tuning for AI vision applicationsLeverages up to 4x Intel® Movidius™ Myriad™ X VPUs to empower a wide variety of deep-learning applications
Offering
ADLINK Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel® Core™ and Xeon® processor E3 with Mobile Intel® QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. The Express-KL/KLE has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC/non-ECC memory. I/O features include a single onboard GbE port, one PCIe x16, eight PCIe x1 Gen3 lanes, USB 3.0 and 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup.
Offering
ADLINK cExpress-EL supports 6th generation Intel Atom® x6000 processors combined with Intel® UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
Offering
ADLINK cExpress-TL is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth compared to prior generations COM Express modules. Two other important improvements are: support for 2.5 GbE Ethernet, and support for four USB 3.2 Gen 2 ports with transfer rates of up to 10Gb/s. Both high speed interfaces are highly suited to serve as camera input ports in AI related applications. 11th Gen Intel® Core™ processors have a configurable power range of 15 to 28 watts, which makes them ideally suited for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. The integrated Intel® Iris® Xe Graphics core provides 96 EUs and can be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP).
Offering
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge. cExpress-WL modules are equipped with the 8th generation Intel® Core™ processor and Celeron® processor. These quad-core processors support up to 8 threads and an impressive turbo boost of up to 4.8 GHz, delivering 40% performance at increase at 15 watt of thermal design power (TDP) at a similar cost. ADLINK’s cExpress-WL provides standard support for up to 64GB non-ECC DDR4 in two SO-DIMMs, while still fully complying with PICMG COM.0 mechanical specifications. The cExpress-WL supports a maximum of 5 PCIe devices through 8 high-speed PCIe lens Gen3 interfaces and 4 USB 3.0 Gen2 at 10 Gbps, allowing fast data transmissions among the Compact COM Express modules and peripheral devices and sensors. The cExpress-WL supports up to three independent displays via a wide range of interfaces including DisplayPort, HDMI, DVI, and LVDS. ADLINK also offers eDP and analog VGA as build options by customer request. Additionally, cExpress-WL modules support 12 voltage power supply and available with the optional 5-12V power range to offer extra tolerance for voltage fluctuation challenging battery-powered applications.
Offering
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor with Mobile Intel® QM370, HM370, CM246 Chipset. These Hexa-core processors support up to 12 threads (Intel® Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution. The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Intel® Xeon® processor and CM246 Chipset support both ECC and non-ECC SODIMMs. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel® Optane™ memory, allowing applications access to the highest speed storage solutions and include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer. Key Features PICMG COM.0 R3.0 Type 6 module with Hexa core Intel® 8000 series and Xeon® E-2000 series processors Up to 48GB Dual Channel DDR4 at 2133/2400MHzThree DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays One PCIe x16 (Gen3), Eight PCIe x1 (Gen3) (supporting Intel® Optane™ Memory Technology) GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0Supports Smart Embedded Management Agent (SEMA) functions
Offering
Features● 7th Generation Intel® Core™ and Intel® Celeron® Processors● Up to 32GB Dual Channel DDR4 at 1867/2133MHz● Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP● GbE, up to 6 PCIe x1 (build option)● Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0● Supports Smart Embedded Management Agent (SEMA) functions● Extreme Rugged operating temperature: -40°C to +85°C (build option)
Offering
ADLINK new NEON-1021-M Intel Atom® E3845 processor based ready-to-go smart camera with MVTec MERLIC. Equipping its state-of-the-art quad-core smart camera with an easy-to-use machine vision software, the NEON-1021-M significantly increases competitive advantage, exceeding basic smart camera advantages for machine vision development.ADLINK' s NEON-1021-M features high performance quad-core Intel Atom® processors, speedy multi-ROI image capture, 2MP global shutter image sensors, and PWM lighting control support. High-speed multi-barcode capture by multi-ROI function shortens image processing cycle time, and optimized I/O includes one additional slave GigE Vision camera connection, 4x isolated input, 4x isolated output, and VGA output for maximized integration with external devices. Rugged construction with IP67-rated housing and M12 connectors enables the NEON-1021-M to withstand the harshest industrial environments.MVTec MERLIC is an all-in-one tool for quickly building machine vision applications with no programming requirement. Based on MVTec's extensive machine vision expertise and combining reliable, fast performance with ease of use, the PC-based complete software solution features an image-centric user interface, intuitively guiding the user through the application. Similar to a WYSIWYG editor (what-you-see-is-what-you-get), developers can focus on the imagebased display rather than complex lines of code or parameter lists. MERLIC is particularly suited to operations that favor a clear, graphical user interface for configuring imaging functions.ADLINK's NEON-1021-M smart camera series and the integration of the easy-to-use machine vision software MERLIC makes it a simple matter for system integration to fulfill a wide variety of inspection application needs.
Offering
Equipped with Intel® Atom® x7-E3950/x5-E3930 processors (formerly Apollo Lake-I)Compact fanless design: 140(W) x 110(D) x 58(H) mmRich I/O & expansion:1x DisplayPort, 2x USB 2.0, 2x USB 3.0, 2x GbE ports, 2x COM ports (RS-232/422/485)2x mPCIe slots, 1x USIM slot, 1 x mSATA, 1x Micro SD slotOptional1 x 2.5 " SATA SSD by storage kiteSIM support (by project)Built-in ADLINK SEMA management solution
Offering
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIex16 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely costeffective price point.The MVP-6010/6020 Series supports dual-channel DDR4 memory for more powerful computing and the Intel® HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications. Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform.
Offering
Dual or quad-core Intel® Atom® E3900 Series or Pentium® N4200 or Celeron® N3350 Processor SoCUp to 8 GB DDR3L at 1867 MT/sTriple display supportDual channel LVDS (18/24-bit)HDMI/DP++DP++2x MIPI CSI camera (2/4 lanes)1x GbE with IEEE15881x SATA 3.0Onboard eMMC
Offering
Features Intel Atom® E3900 Series, Pentium® and Celeron® SoC Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHzNewest Intel® Gen9 Low Power graphics, Up to 4k resolution and H.265 codec Four PCIe x1 Gen2 (configurable to x2, x4), GbE Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0 (build option) Supports Smart Embedded Management Agent (SEMA®) functions Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs) The ADLINK nanoX-AL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The nanoX-AL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.
Offering
The VPX3020 Series is available in rugged conduction and air cooled versions with conformal coating, making it ideal for mission critical applications in radar; intelligence, surveillance and reconnaissance (ISR); and UAV/UGV platforms.
Offering
ADLINK MVP-6100 Series of fanless embedded computing platforms with 2-slot or 4-slot expansion, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-6100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
Offering
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation Intel® Core™ processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
Offering
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.The MXE-5500 series accommodates rich I/O capabilities in a compact system size, with two DisplayPort, one DVI-I (supporting both DVI and VGA signals), four GbE by Intel® network interface controllers, four each USB 2.0 and USB 3.0, eight isolated DI/O, and six COM ports, four of which are BIOS-configurable among RS-232/422/485. In addition, with dual hot-swappable 2.5 SATA drive bays, one CFast port and one M2.2280, providing versatile storage options to a wide range of applications. Dual mini PCIe slots and USIM sockets empower the MXE-5500 as a communications hub for a variety of wireless connections, such as BT 4.0/WiFi and 3G.Leveraging proprietary mechanical engineering, the MXE-5500 series continues to offer all the popular features of the popular Matrix E series, including cable-free construction, wide operating temperature ranges, and 5 Grms vibration resistance, having undergone, like all ADLINK Matrix devices, rigorous testing for operational verification.Combining superior processor performance, wireless capability, and rich, scalable I/O in a compact and robust package, the ADLINK MXE-5500 is an ideal choice for a wide range of applications supporting intelligent transportation, in-vehicle multimedia & surveillance and factory automation applications.ADLINK's Matrix MXE-5500 Series rugged fanless embedded computers support Intel® Solid State Drive (SSD) E 5400s Series, offering a power-conserving solution with superior durability, performance and security across a variety of applications.
Offering
The DMI-1210 is a 12.1” Driver Machine Interface panel PC designed specifically for the railway industry, equipped with Intel Atom® x5-E3930 processor (formerly Apollo Lake), resistive touch, and MVB interface. It can be applied as an HMI unit for driver’s desks, control panel for passenger information systems, surveillance system control/display unit or in railway diagnostics and communications applications.The DMI-1210 is an EN 50155 certified, cost-effective COTS driver interface that offers train radio display, electronic timetable, and diagnostic display functions and additional functionality such as train data recorder. The DMI-1210 accepts full range DC power input from +16.8V to 137.5VDC. Optional GNSS, 3G/LTE, WLAN, and Bluetooth give system integrators the necessary tools to expand use case possibilities. With ADLINK’s built-in SEMA management (BMC inside), the DMI-1210 provides easy and effective health monitoring and system maintenance. Robustness and reliability are provided by careful component selection for extended temperature operation, isolated IOs, conformal coated circuit boards, and securable I/O connectors.
Offering
6th/7th Gen Intel® Core™ i7 Processors8x M12 GbE (4x PoE), 4x RS-422, 4x USB 3.0, 1x DVI-I, 4x DisplayPort with lockable connectorsMultiple storage options: 2x 2.5" SATA 6.0 Gb/s drive bays, 1x M.2 2280 slot, 1x CFast socketGNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slotsMVB/CAN bus support through Mini PCIe add-on moduleWide range DC input: 24VDC, 36VDC, 72VDC and 110VDCEN50155-compliant, rugged, fanless design for harsh operating environments
Offering
Intel® Atom® x5-E3930 processor, up to 1.8GHz10.4” color display: 4:3, 1024 x 768 pixels, high brightness 1000cd/m2, 5-wire resistive touch, auto dimming2GB DDR3L memory (up to 8GB optional)64GB eMMC storagePower Input Voltage: 24VDC, 36VDC, 72VDC and 110VDC (EN50155 compliant)-25°C to +70°C wide operating temperature range (EN50155 class OT3)IP65 front and IP20 rear ingress ratings
Offering
• Quad-core Intel® Xeon®/Core™ i7/i5/i3 processor (formerly Coffee Lake) • Up to 32GB DDR4-2133/2600 memory via two SO-DIMMs • Support 6 USB 3.0 port • Support 1 independent display • Support 3 independent GbE ports • Support 2 RS-232/422/485
Offering
To accelerate the development of smart devices, ADLINK’s Smart Panel is an all-in-one Open Frame Panel PC offering flexible configuration with a high level of modularization. Coupled with ADLINK’s unique Function Module (FM) design, Smart Panel speeds prototyping based on application requirements with reduced time, effort and cost. System integrators, integrated solution providers, and brand vendors can all achieve project success in transportation, retail, hospitality, industrial automation, healthcare, and gaming applications, and more. To accelerate TTM, lower TCO, and enhance design flexibility, ADLINK’s Smart Panel exceeds common application demands with a modular design, enabling custom selection of touch panel type, display size, mainboard, I/O interface, and heat sink. To empower application-specific features, function enhancement and I/O expansion are fully supported through ADLINK’s FM board or I/O boards from partners and clients. Values of ADLINK’s Smart Panel cross industries show as below: l Healthcare: Much time can be saved with a panel computer integrated in medical imaging equipment. With ADLINK’s Smart Panel, medical equipment manufacturers can quickly build different diagnostic imaging requirements, e.g. CT, X-Ray, and MRI, through ADLINK’s unique Function Module board, and greatly improve the efficiency of medical imaging technicians, the throughput of diagnostic imaging equipment, and patient experience. Transportation: With the advent of new technologies, airports are embracing a combination of contactless and self services, paving the way for a true reduction in manual assistance requirements and faster clearance of passengers. To build a streamlined self bag-drop service, ADLINK’s Smart Panel provides a clean solution for a straightforward installation with low validation effort with comprehensive I/O options on the mainboard to accommodate various device connectivity for integrated control. l Retail: With the steady rise of e-commerce, retailers are faced with an unprecedented growth in orders, which must be fulfilled as fast as possible. To fulfil different kiosk functionalities, ADLINK's Smart Panel provides a high level of modularization, allowing kiosk manufacturers to quickly build interactive kiosks, making streamlined service processes, personalized customer engagement, reliable real-time updates, and remote monitoring possible
Offering
The ADLINK cPCI-3520 Series is a 3U CompactPCI processor blade with dual channel DDR4-2133/2400 memory up to 32GB. The ADLINK cPCI-3520 features a 8th./9th generation Intel® Core™ i7 processor with Mobile Intel® CM246 Chipset. The ADLINK cPCI-3520 Series is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3520 Series provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring.
Offering
Low power quad-core Intel Atom® x7-E3950 Processor (formerly Apollo Lake I)Up to 8GB DDR3L-1600 ECC soldered memoryOnboard 32GB SSD support by optionSmart Embedded Management Agent (SEMA) for system health monitoringOptional additional GbE ports with MIL-STD M12 connectorsEN 50155 compliant for railway safety-critical applicationsThe ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.Available in single-slot (4HP) or dual-slot (8HP) width form factors, the cPCI-3630 Series utilizes various daughter boards to provide a broad range of I/O functionality. Faceplate I/O on the single-slot (4HP) version includes 1x USB 3.0, 2x RJ-45 GbE and 1x VGA port (common to all versions). Additional faceplate I/O on the dual-slot (8HP) versions include 2x USB 2.0, 1x COM, 1x PS/2 KB/MS and Line-in/Line-out on the cPCI-3630D; 2x DisplayPorts, 1x COM via RJ-45 connector, 1x KB/MS and USB 2.0 port on the cPCI-3630G; 2x GbE via MIL-STD M12 connectors and 1x COM on the cPCI-3630T; and 2x GbE in RJ-45 connectors and 1x COM on the cPCI-3630TR. Another dual-slot option is the cPCI-3630S with an additional XMC site on layer 2. There is also a cPCI-3630N single-slot option that provides LED indicators only with no I/O on the faceplate.The Intel Atom® SoC integrates the low-power 9th generation graphics engine and provide excellent graphics, media and display support. By using cPCI-3630G, it supports up to 4K HD resolution. Storage options include an onboard 32GB SSD (optional), mSATA socket or CFast and 2.5" SATA drive space on the layer 2 riser card (cPCI-3630D/G/T/TR). One optional PCI 32-bit/66 MHz PCIe x1 XMC site is available on the dual-slot cPCI-3630S version.Rear I/O signals to J2 include 2x GbE, 1x VGA, 1x USB 2.0, 2x COM, 1x SATA 3 Gb/s, providing for expansion with an optional Rear Transition Module (RTM).The cPCI-3630 is an ideal solution for transportation, military, factory automation and other industrial applications that require optimal computing performance for data transfer with lower power consumption. The ADLINK cPCI-3630 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.
Offering
Intel® Xeon® W-11000E Series processor (formerly Tiger Lake-H); up to 8 cores with 45 watt TDP SOSA-aligned and VITA 46/48/65 compliant for quick deployment DDR4-2666 soldered ECC SDRAM, up to 64GB Up to 1TB M.2 SSD optional One XMC expansion slot with PCIe x8 Gen3 Ethernet connectivity: 1x 2.5GBASE-T to P2; 2x 10GBASE-KR to P1; optional 2x 1GBASE-KX to P1 1x DisplayPort to P2, supports DP++ with resolution up to 8K/60Hz Supports VxWorks 7, Linux (kernel 5.4 and higher)
Offering
The ADLINK 5G Small Cell Solution integrates with 5G terminal devices to bring low latency and high-speed communication. The compact integrated 5G solution combines the ADLINK edge server series, Intel® Xeon® processors, and the SageRAN 5G RAN protocol stack (RAN/BBU and Core) - delivering a complete 5G network solution. The 5G Core Network software supports the 5G system architecture defined by the 3GPP R15, including access and mobility function nodes, session management function nodes, user plane function nodes, unified data management function nodes, authentication server function nodes, and policy control function nodes. The kit is also capable of integrating with other nodes that are connected to 5G NR independent networking base station systems and terminals to provide PDU session management, user mobility and access management, user data, and user plane routing and forwarding.
Offering
ADLINK cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom®, Pentium® and Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution. Integrated IntelR Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0; and support for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Up to three independent displays are available. The module has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. Featured IO include a single GbE port, USB 3.0 and USB 2.0 ports, SATA 6 Gb/s ports, and up to 5 PCIe x1 lanes. In addition, SD signals are muxed with GPIO. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer. An optional eMMC 5.0 (8/16/32 GB) is supported.
Offering
Intel® Core™ i7-7820EQ Processor and Mobile Intel ® CM236 Chipset NVIDIA Quadro ® GPU MXM 3.1 Type A/B module on PCIe x16 4x M12 GbE with PoE, 4x USB 3.0 Rich Storage Options: 2.5" SATA 6.0 Gb/s drive bay, 1x M.2 2280 slot, 1x CFast socket GNSS/3G/4G/WLAN support via 2x Mini PCIe slots and 2x USIM slots MVB/CAN bus support by Mini PCIe add-on module (BOM option) Nominal Voltage: 110VDC (EN50155 compliant)
Offering
Intel® Atom® x5-E3930 processor, up to 1.8GHz 4GB DDR3L memory (up to 8GB optional) 3x M12 GbE, 3x DB-9 Serial ports, 2x USB and 1x lockable DP port Power input voltage: 24VDC, 36VDC, 72VDC and 110VDC (EN 50155 compliant) -25°C to 70°C wide operating temperature range (EN 50155 class OT3 ST1) Storage: eMMC 5.0, 1x external accessible CFast slot
Offering
PICMG ® CPCI-S.0 CompactPCI ® Serial Processor Blade 14nm multi-core 9th Gen Intel ® processor Graphics engine integrated in processor supporting independent displays with DirectX 12, OpenGL 4.5 Max. 32GB DDR4-2666 by 2x SODIMM Supports 2x PCIe x8 Gen 3 and 2x PCIe x4 Gen 3 Up to 10x USB 2.0/3.0, up to 7x SATA to rear Supports Satellite mode operation as a standalone blade in peripheral slots
Offering
14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh) Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB Versatile storage: SSD, CFast, M.2 Dual PMC/XMC sites Remote management and TPM support