Offerings
Offering
NET-III 2I640DW is an extremely compact fanless DIN-Rail computer with dimensions measuring just 35 x 110 x 135 mm. It features Intel® Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, AIot , Edge computing and gateway.NET-III 2I640DW is equipped with multiple I/O, such as 2 x HDMI, 3 x 2.5 Gb Ethernet ports, 2 x USB 3.0 portsand 2 x COM ports for industrial communication and control. In addition, by adopting M.2 slot, the NET-III 2I640DW can fully harness the bandwidth of WiFi 6, 4G/5G wireless communications to provide wide-area coverage and real-time data transmission for AIoT and edge gateway applications. Intel® Elkhart Lake ATOM® x6413E / J64121 x DDR4 SODIMM Max 32GB3 x Intel 2.5 GbE 2 x USB 3.0, 2x RS232/422/4852 x HDMI (or OEM DP), 1 x M.2 B Key Type2242 / 3042 (PCIex2 / USB 3.0 / USB 2.0)1 x M.2 B Key Type2242 (PCIe x2 / USB 2.0 / SATA)TPM 2.0 (Firmware); optional to Hardware TPM 1 x Nano SIM Dimension: 135W x 110D x 35H mmWide range DC IN +9 to 24VOperating temperature：-40°C to + 60°C.
Offering
TERA 2I640DW is a compact fanless embedded computer with dimensions measuring just 56.5 x 102.4 x 145 mm. It features Intel® Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, AIot , edge computing and gateway. TERA 2I640DW is equipped with multiple I/O, such as 2 x HDMI, 3 x 2.5 Gb Ethernet ports, 2 x USB 3.0 ports, 2 x USB 2.0 ports and 2 x COM ports and optional isolated digital I/Os for industrial communication and control. In addition, by adopting M.2 slots, the TERA 2I640DW can fully harness the bandwidth of WiFi 6, 4G/5G wireless communications to provide wide-area coverage and real-time data transmission for AIoT and edge gateway applications. The attributes of low power consumption and lightweight mechanical design also make TERA 2I640DW an ideal solution for projects that require space-constrained edge computing applications for intelligent robotic control, smart traffic, smart medical, visual inspection and analysis. Intel® Elkhart Lake ATOM® x6413E / J64121 x DDR4 SODIMM Max 32GB3 x Intel 2.5 GbE 2 x USB 3.0, 2 x USB 2.02x RS232/422/4852 x HDMI (or OEM DP), 1 x M.2 B Key Type2242 / 3042 (PCIex2 / USB 3.0 / USB 2.0)1 x M.2 B Key Type2242 (PCIe x2 / USB 2.0 / SATA)TPM 2.0 (Firmware); optional to Hardware TPM 1 x Nano SIM ; DI/DODimension: 56.5 x 102.4 x 145 mmWide range DC IN +9 to 24VOperating temperature：-40°C to + 60°C.
Offering
SKY 2 2I640CW is a compact fanless DIN-Rail computer with dimensions measuring just 71.9 x 111.2 x 145 mm. It features Intel® Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, AIot , edge computing and gateway. SKY 2 2I640CW is equipped with multiple I/O, such as 2 x HDMI, 2 x 2.5 Gb Ethernet ports, 2 x USB 3.0 ports, 4 x USB 2.0 ports and 4 x COM ports and optional isolated digital I/Os for industrial communication and control. In addition, by adopting M.2 & Mini PCIe slots, the SKY 2 2I640CW can fully harness the bandwidth of WiFi 6, 4G/5G wireless communications to provide wide-area coverage and real-time data transmission for AIoT and edge gateway applications. The attributes of low power consumption and lightweight mechanical design also make SKY 2 2I640CW an ideal solution for projects that require space-constrained edge computing applications for intelligent robotic control, smart traffic, smart medical, visual inspection and analysis. Intel® Elkhart Lake ATOM® x6413E / J6412OnBoard LPDDR4 4/8GB2 x Intel 2.5GbE I225IT2 x USB 3.0, 4 x USB 2.0 1x RS232/422/485;3 x RS2322 x HDMI (or OEM DP)1 x M.2 B Key Type2242 / 3042 (SATA / USB 2.0 /USB 3.0-optional to PCIex2)1 x mini PCIe(PCIe/USB2.0 )TPM 2.0 (Firmware); optional to Hardware TPM 1 x Nano SIM DI/DODimension: 71.9 x 111.2 x 145mmWide range DC IN +9 to 24VOperating temperature：-40°C to + 60°C
Offering
TERA 2I640CW is a compact fanless embedded computer with dimensions measuring just 56.5 x 102.4 x 145 mm. It features Intel® Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, AIot , edge computing and gateway. TERA 2I640CW is equipped with multiple I/O, such as 2 x HDMI, 2 x 2.5 Gb Ethernet ports, 2 x USB 3.0 ports, 2 x USB 2.0 ports and 4 x COM ports and optional isolated digital I/Os for industrial communication and control. In addition, by adopting M.2 & Mini PCIe slots, the TERA 2I640CW can fully harness the bandwidth of WiFi 6, 4G/5G wireless communications to provide wide-area coverage and real-time data transmission for AIoT and edge gateway applications. The attributes of low power consumption and lightweight mechanical design also make TERA 2I640CW an ideal solution for projects that require space-constrained edge computing applications for intelligent robotic control, smart traffic, smart medical, visual inspection and analysis. Intel® Elkhart Lake ATOM® x6413E / J6412OnBoard LPDDR4to4/8GB2 x Intel® 2.5GbE I225IT2 x USB 3.0, 2 x USB 2.0to1x RS232/422/485;3 x RS2322 x HDMI (or OEM DP)1 x M.2 B Key Type2242 / 3042 (SATA / USB 2.0 /USB 3.0-optional to PCIex2)1 x mini PCIe(PCIe/USB2.0 )TPM 2.0 (Firmware); optional to Hardware TPMto1 x Nano SIM DI/DODimension: 56.5 x 102.4 x 145mmWide range DC IN +9 to 24VOperating temperature：-40°C to + 60°C
Offering
NET-III 2I640CW is an extremely compact fanless DIN-Rail computer with dimensions measuring just 40 x 110 x 135 mm. It features Intel® Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, AIot , edge computing and gateway.NET-III 2I640CW is equipped with multiple I/O, such as 2 x HDMI, 2 x 2.5 Gb Ethernet ports, 2 x USB 3.0 ports, 2 x USB 2.0 ports and 4 x COM ports for industrial communication and control. In addition, by adopting M.2 & Mini PCIe slots, the NET-III 2I640CW can fully harness the bandwidth of WiFi 6, 4G/5G wireless communications to provide wide-area coverage and real-time data transmission for AIoT and edge gateway applications. The attributes of low power consumption and lightweight mechanical design also make NET-III 2I640CW an ideal solution for projects that require space-constrained edge computing applications for intelligent robotic control, smart traffic, smart medical, visual inspection and analysis. Intel® Elkhart Lake ATOM® x6413E / J6412OnBoard LPDDR4 4/8GB2 x Intel®2.5GbE I225IT2 x USB 3.0, 2 x USB 2.0 1x RS232/422/485;3 x RS2322 x HDMI (or OEM DP)1 x M.2 B Key Type2242 / 3042 (SATA / USB 2.0 /USB 3.0-optional to PCIex2)1 x mini PCIe(PCIe/USB2.0 )TPM 2.0 (Firmware); optional to Hardware TPM 1 x Nano SIM Dimension: 40 x 110 x 135 mmWide range DC IN +9 to 24VOperating temperature：-40°C to + 60°C.
Offering
LEX SYSTEM 2I640HW is a 2.5” (102 x 88 mm) embedded board and base on Intel® Atom® x6000E Series and Celeron® J (formerly Elkhart Lake )Series processors. Running with Intel® UHD Graphics ,2I640HW provide high-performance and full –features with integrated 2 x GbE LAN, 6 x USB, 4 x COM Port , HDMI,LVDS and eDP display interface and 1 x M.2, 1 x Mini Card expansion slot offers the ideal platform for graphics performance with integrated IoT features, real-time performance, manageability, and security. 2I640HW's all wafer IO design delivers high flexibility toward expanded functions & and also provides user hassle-free solution of integrating the SBC board within various mechanical enclosures. The compact size feature makes 2I640HW well suited for many space-limited and thermally constrained embedded applications, such as In-Vehicle Infotainment, Intelligent Control, Factory Automation Industry 4.0,Internet of Things (IoT) and Edge Computing applications.
Offering
LEX SYSTEM 2I640CW is a 2.5” (102 x 88 mm) embedded board and base on Intel Atom® x6000E Series and Celeron® J (formerly Elkhart Lake )Series processors. Running with Intel® UHD Graphics ,2I640CW provides high-performance and full –features with integrated 2 x 2.5 GbE LAN, 7 x USB, 4 x COM Port , 2 x HDMI(or DP) and eDP display interface and 1 x M.2, 1 x Mini Card expansion slot offers the ideal platform for graphics performance with integrated IoT features, real-time performance, manageability, and security. The compact size feature makes 2I640CW well suited for many space-limited and thermally constrained embedded applications, such as In-Vehicle Infotainment, Intelligent Control, Factory Automation Industry 4.0,Internet of Things (IoT) and Edge Computing applications.
Offering
SUPER-Fanless, Bezel-free, Resistor/Capacitor Touch Panel PCLEX SUPER Panel PC integrate LEX 3.5" 3I385CW motherboard into a space optimized plastic frame housing attached behind the touch screen panel and front bezel then covered by the front and back plastic frames. SUPER series Panel PC manage to incorporate internal antenna (WiFi / 3G / 4G / RFID) into the panel frame. And such design will be the ideal for user to install the panel pc within the wall or mount inside the machine. It is an all-in-one & Bezel-free panel pc which providing user friendly interfaces and standard 75 x 75 mm VESA mountable installation. Each size (7"/10.4"/15.1"/10.1") panel pc will have both 2 & 3 tier of back IO connectors. The flexible extension IO and Intel Bay Trail low-power processor onboard providing fanless solution especially ideal for retails, transportation, museums and hospitals. Bezel-free Super 7" Dimension: 66.1H x 225.3W x 166.87D mm Bezel-free Super 10.4" Dimension: 66.79H x 296W x 250.4D mm Bezel-free Super 15.1" Dimension: 68.7H x 404.1W x 335D mm
Offering
3I393NX- Integrated PoE IP and Networking Applications with Intel® SoC Processor (Formerly Apollo Lake)LEX Computech released of the next generation 3.5” motherboard with wide range 9 to36V DC power input: 3I393NX is based on the latest Intel® processor (Formerly Apollo Lake), integrated 5 x GbE (4 x PoE), 6xUSB, 2 x COM Port & VGA, HDMI, DP, eDP display interface that offers the ideal platform for high performance applications in surveillance, networking, automation, military & industrial facilities. Integrated PoE IP and Networking Applications. Intel® N4200 / N3350 / E3950 SoC CPU / chipset (Formerly Apollo Lake)1 x DDR3L 1866 Mhz SODIMM, Max up to 8GB, Display Interface: HDMI, DP, VGA & eDP5 x Intel® i210IT GbE LAN (4 x PoE)6 x USB (2 x USB 3.0 + 4 x USB 2.0), HD Audio, 2 x Mini PCIe, 2 x COM (RS232/422/485), Wide Range DC IN +9 to36V, Wide temperature support of -20°C to 70°C, Support 4K UHD resolution content
Offering
LEX Computech has released the next generation 3.5” motherboard with a wide range 9~36V DC power input. The 3I390NX is based on the latest Intel® processor, integrated 5 x GbE (4 x PoE), 6xUSB, 2xCOM Port & VGA, HDMI, DP, eDP display interfaces that offer the ideal platform for high performance applications in surveillance, networking, automation, and military & industrial facilities. ● Intel® N4200 / N3350 / E3950 SoC CPU / chipset● On Board 4GB DDR3L Memory● Display Interface: HDMI, DP, VGA & eDP● 5 x Intel i211AT GbE LAN (4 x PoE) (optional to i210IT LAN Chipset)● 6 x USB (2 x USB 3.0 + 4 x USB 2.0), HD Audio, 2 x COM, 2 x Mini PCIe● Wide Range DC IN +9~36V● Wide temperature support of -40°C ~ 70°C● Support 4K UHD resolution content
Offering
LEX Computech has released the next generation 3.5” motherboard with a wide range 9~36V DC power input. The 3I390AW is based on the latest Intel® processor, integrated 2 x GbE LAN, 6 x USB, 6 x COM Port and VGA, DVI display interfaces that offer the ideal platform for high performance applications in Digital Signage, medical devices, gaming machines, automation, and military & industrial facilities.● Intel® N4200 / N3350 / E3950 SoC CPU / chipset● 1 x DDR3L SODIMM socket, max. Up to 8GB● Display Interface: VGA & DVI● 2 x Intel GbE, 2 x Mini PCIe, 1 x SIM● 6 x USB (4 x USB 3.0 + 2 x USB 2.0), HD Audio, 6 x COM● Wide Range DC IN +9~36V● Wide temperature support of -40°C ~ 70°C● Supports 4K UHD resolution content
Offering
LEX SYSTEM ultra compact (102 x 83 mm) motherboard with wide range 9 to36V DC power input & 3 x Intel GbE: 2I610DW is based on the 6th/7th generation Intel® Core™ i3/i5/i7 or Intel® Celeron® processor (formerly SkyLake-U/Kaby Lake-U), integrated 3 x GbE LAN, 6 x USB, 2 x COM Port and VGA display interface that offer the ideal platforms for high performance applications in Networking, Smart Automation, Machine Vision, In-vehicle , Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.2I610DW –Compact solution for Networking & IoT Applications 6th/7th generation Intel® Core™ i3/i5/i7 or Intel® Celeron® SoC CPU / chipset1 x DDR4 SODIMM socket, max. up to 32 GB Display Interface: VGA3 x Intel (I210 IT) GbE, 2 x Mini PCIe, 4DI/4DO6 x USB (3 x USB 3.0/2.0 + 3 x USB 2.0), 2 x COM (RS232/422/485)Wide Range DC IN +9 to36V Wide temperature support of -20°C to 60°C
Offering
LEX Computech released of the next generation 3.5” motherboard with wide range 9 to36V DC power input: 3I170NX is based on 6th/7th generation Intel® processor (formerly Skylake-S/Kaby Lake-S), integrated 5 x GbE (4 x PoE), 10xUSB , 2x COM Port & VGA, HDMI display interface that offers the ideal platform for high performance applications in surveillance, networking, automation, military & machine vision applications. 3I170NX - Integrated PoE IP and Networking Applications Intel® Core™ i3/i5/i7 or Intel® Celeron® CPU / chipset (formerly Skylake-S / Kaby Lake-S)2 x DDR4 2133 Mhz SODIMM, Max up to 64 GB Display Interface: HDMI& VGA5 x Intel® GbE LAN (4 x PoE)10 x USB (2 x USB 3.0 + 8 x USB 2.0) , SIM socket, 2 x Mini PCIe2 x COM (RS232/422/485)Wide Range DC IN +9 to 36VWide temperature support of -20°C to 60°CSupport 4K UHD resolution content
Offering
Embedded Fanless Computer· Intel® Apollo Lake CPU:AtomTM E3950, Pentium® N4200, Celeron® N3350· 1 x DDR3L SODIMM socket, Max. 8GB· Independent display: VGA & DVI· 2 x Intel GbE LAN, 4 x USB 3.0, 6 x COM· 2 x Mini PCIe, 1 x SIM·
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Integrated PoE IP and Networking Applications· Intel® Apollo Lake CPU: AtomTM E3950, Pentium® N4200, Celeron® N3350· On Board DDR3L 2 / 4GB· Independent display: VGA / DP (share same signal), HDMI· 4 x PoE, 1 x Intel GbE LAN, 2 x USB 3.0, 2 x USB 2.0· 2 x COM, 2 x Mini PCIe
Offering
PM170DW is based on the 6th/7th generation Intel® CPU, integrated 5 x GbE LAN, 10 x USB, 4 x COM Port, VGA ,HDMI, & LVDS (option) display interface that offer the ideal platforms for high performance applications. PM170DW's highly configurability(PCIe x16, PCIe x8, PCIe x 4 & PCIe x1 extension) provide integrators an ideal solution at combination Graphics processing unit (GPU card), Networking(PoE/LAN expansion module), USB connection module & CANBus modules.PM170DW –LEX CPU board with 6th/7th generation Intel® CPU platform (formerly Skylake-S/Kaby Lake-S)Embedded Intel® Core™ i7/i5/i3 or Intel® Celeron® CPU (formerly Skylake-S Kaby Lake-S)Intel® Q170 chipset2 x DDR4 SODIMM socket, Max up to 32GB,Multiple Independent display: HDMI, VGA & LVDS (option)5 x Intel® GbE LAN, 4 x USB 3.0 ,6 x USB 2.0, 4 x COM, Touch Screen(Option),1 x M.22 x Mini PCIe, 2x SIM card socket, HD Audio, 16 DI/ 16DO, Intel® vPro™ @ TPM2.0PCIe x16 / x 8 golden finger (PCIe x 16 + PCIe x 4 Signal)Wide temperature support of -20°C ~ 70°C
Offering
SUPER-Fanless, Bezel-free, Resistor/Capacitor Touch Panel PCLEX SUPER Panel PC integrate LEX 3.5" 3I385CW motherboard into a space optimized plastic frame housing attached behind the touch screen panel and front bezel then covered by the front and back plastic frames. SUPER series Panel PC manage to incorporate internal antenna (WiFi / 3G / 4G / RFID) into the panel frame. And such design will be the ideal for user to install the panel pc within the wall or mount inside the machine. It is an all-in-one & Bezel-free panel pc which providing user friendly interfaces and standard 75 x 75 mm VESA mountable installation. Each size (7"/10.4"/15.1"/10.1") panel pc will have both 2 & 3 tier of back IO connectors. The flexible extension IO and Intel Bay Trail low-power processor onboard providing fanless solution especially ideal for retails, transportation, museums and hospitals.Bezel-free Super 7" Dimension: 66.1H x 225.3W x 166.87D mmBezel-free Super 10.4" Dimension: 66.79H x 296W x 250.4D mmBezel-free Super 15.1" Dimension: 68.7H x 404.1W x 335D mm
Offering
LEX 2I385A/CW SBC with Intel Atom® (dual core / quad core) processor to give users fast, convenient and simplified solutions for industrial and embedded applications. The compact size feature makes this platform well suited for many space-limited and thermally constrained embedded applications, such as Digital Signage Machines, Visual inspection instruments and POS/Kiosk solution. 2I385A/CW is enclosed in a compact chassis with low power consumption and is with special design to withstand high vibration, extreme temperature variation, and dynamic power supply voltage vehicle working environment.
Offering
LEX launches ST385W Computer on Modules with Intel Atom® Bay Trail (Dual Core / Quad Core) processor to give users flexible, reliable and cableless solution for configuring the customized system in the shortest time. By connecting with MXM-3 connectors (314-pin expansion), users can adopt a carrier board with suitable I/O interfaces. With more flexible and complete functions than COM Express® and SMARC 2.0 options, LEX's SMART-ST385W provide customer the maximize potential with their carrier boars to build their own compact, high-performance system designed in a shortened development time. ST385W’s design is also the ideal solution for embedded application developers to get up and running quickly on their customized carrier boards for different OEM/ODM projects.More functions than COMe and SMARC 2.0 ,Save your time and money to develop evalution boardLEX SMART Computer on ModulesST385WDDR3 SO-DIMM, max up to 8GBVGA, HDMI or LVDS 24 bit / 2CHResister Touch Screen Controller2 x Intel GbE i210 LAN1 x USB 3.0, 7x USB 2.04 x COM RS232 / 422 / 485 Auto2 x PCIe2 x SATA8 x DI / 8DOHD Audio with Amplifier9~36V DC-Input5V, 12V DC-OutputLPCWatch Dog Timer 0-255 secondDimension: 82 x 88 mmOperation Temp.: -40°C~75°COperation Humidity: 5~95%,
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LEX 2I380A :Embedded Thin Client/Digital Signage /Network applicationIntel Atom® Single /Quad Core E3815/E3845 CPU / ChipsetFeaturesFeatures‧ Embedded Intel Atom® E3815/E3845 CPU/ Chipset‧ on Board 2G/4G DDR3L, VGA, HDMI, HD Audio, 1 x COM‧ 1 x Intel GbE LAN, 1 x USB 3.0; 3 x USB 2.0‧ 2 x Mini PCle
Offering
Intelligent network Appliance with Single/Quad Core Intel Atom® E3815/3845 LEX launches 3I380D series SBC with built-in 4 x Intel® i210 GB LAN ports as a high-performance, reliable and flexible platform to develop Network solution as Server, VPN, Firewall, Gateway, NAS, NAD and Enhanced Thin Clients applications. LEX 3I380D provides customers a robust and compact computing system with an industrial design and built-in I/O to handle diverse applications.3I380D Specs:Intel Atom® E3815 1.46GHz (Single core) / E E3845 1.91GHz (Quad core) CPU/ chipsetMB size 3.5” 146 x 102mmGraphic: Intel® Integrated Graphics chipsetMemory: DDR3L 2G/4G OnboardFeatures ; VGA, HDMI, 4 x Intel® i210 Gb Ethernet, 7 x USB, 2 x COM, 2 x Mini PCIe, 1 x SIM card socket
Offering
LEX Computech released of the next generation 3.5” motherboard with wide range 9 to 36V DC power input: 3I610NX is based on the 6th/7th generation Intel® processor (formerly Skylake-U/Kaby Lake-U), integrated 5 x GbE( 4 x PoE ), 8xUSB , 2x COM Port & VGA, HDMI display interface that offers the ideal platform for high performance applications in surveillance, networking, automation, military & machine vision applications. 3I610NX - Integrated PoE IP and Networking Applications Intel® Core™ i3/i5/i7 or Intel® Celeron® CPU / chipset (formerly Skylake-U / Kaby Lake-U)2 x DDR4 2133 Mhz SODIMM, Max up to 64 GB Display Interface: HDMI& VGA5 x Intel® GbE LAN (4 x PoE)8 x USB (2 x USB 3.0 + 6 x USB 2.0) , SIM socket, 2 x Mini PCIe2 x COM (RS232/422/485)Wide Range DC IN +9 to 36V Wide temperature support of -20°C to 60°CSupport 4K UHD resolution content
Offering
LEX System ultra compact Pico-ITX motherboard with wide range 9 to 36V DC power input & 3 x Intel GbE: 2I610DW is based on the Intel Gen 6 & 7 SkyLake-U Kaby Lake-U processor, integrated 3 x GbE LAN, 6 x USB, 2 x COM Port and VGA display interface that offer the ideal platforms for high performance applications in Networking, Smart Automation, Machine Vision, In-vehicle, Industry 4.0 and any compact high-performance Internet of Things applications.
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LEX Computech released of the next generation Pico-ITX SBC with optional LEX eIO( 2 x PCIe +USB ) expansion function: 2I390CW is based on the latest Intel® Apollo Lake processor, integrated 2 x GbE LAN, 5 x USB, 2 x COM Port and HDMI, DVI display interface that offer the ideal platforms for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities 2I390CW –Compact solution with Rich Expansion for vertical application Intel® Pentium® N4200/ Celeron® N3350/ Atom® E3950 SoC CPU/ chipset (Formerly Apollo Lake)On board DDR3L 4GB Display: eDP, HDMI & DVI2 x GbE, 2 x Mini PCIe,2 x USB 3.0,3 x USB 2.04DI/4DO, HD audio , 2 x COM, Lex eIO: 2 x PCIe + USBWide Range DC IN +9~36VWide temperature support of -40°C ~ 70°CSupport 4K UHD resolution content LEX eIO Rich Expansion for Vertical Applications LEX’s innovative eIO Extension MBs: /2I390CW are all feature flexible and integrated various IO cards to help aid efficient development, reduce resources, and assist integrators to provide optimized solutions to their customers more quickly. Through the eIO interface, the additional functions with eIO MB can be: 5-port GbE, 4-port GbE plus Fiber, 4 x PoE with Fiber , 2x PoE with Fiber,4 x SIM card socket & 4 x mini card PCIe, and power board/power supply module:
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A complete solution for IoT & Industry 4.0 ApplicationsLEX Computech released CI170A/C series motherboard supporting the 6th Generation Intel® Core™ i processor with Intel® Q170 chipset. CI170A/C is specifically designed for customers who need high-level processing and graphics performance in various application sectors. It’s standout features include 10 x RS-232/422/485 serial ports, 5 x 10/100/1000 Mbps Ethernet ports, 4 x USB 3.0, 5 x USB 2.0 ports, DVI, LVDS and 1 x DP, 1 x HDMI that offer the ideal platform for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities.Features:6th generation Intel® Core™ I processor + Intel® Q170DDR4 SO-DIMM x 2, Max up to 32GBDisplay: 1 x DP, 1 x HDMI, DVI & LVDS5 x Intel® GbE LAN, 4 x USB 3.0 & 2.0 ; 5 x USB 2.0, Line-out, Mic-in, 10 x COM2 x Mini PCIe, 1 x PCIe 16X / 8X / 4X / 1X, 1 x SIM card socket, 1 x M.2 (B key SATA, type 22110)Supports 4K UHD resolution content
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LEX 2I385A/CW SBC with Intel® Atom™ Bay Trail (Dual Core / Quad Core) processor to give users fast, convenient and simplified solutions for industrial and embedded applications. The compact size feature makes this platform well suited for many space-limited and thermally constrained embedded applications, such as Digital Signage Machines, Visual inspection instruments and POS/Kiosk solution. 2I385A/CW is enclosed in a compact chassis with low power consumption and is with special design to withstand high vibration, extreme temperature variation, and dynamic power supply voltage vehicle working environment.
Offering
6th/7th generation Intel® Core™ CPU, Q170 (Skylake-S/Kaby Lake-S)SODIMM DDR4 Max. 32GB2* Intel® Giga LAN4* Renesas uPD720202 USB 3.0 Host Controller withmax. 2A output current for vision camera,4*USB 3.0 with cable-lock design2*USB 3.0VGA, HDMI, DP2*COMMini card (PCIe/mSATA/USB 3.0/USB 2.0), 1*SIMMini card (USB/PCIe/mSATA)-half size1* M.28 DI / 8 DOSupport DIN-Rail MountDimension: 66.9 x 183 x 142.2 mmWide Range +9~36V DC inputOperating temperature: -20°C to +50°CExpansion: 4* COM, 2~4* PoE LAN, FSP, USB2.0/3.0, 8*DI/8*DO, RAID, CANbus.
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Maximizing performance SBC with 8th generation Intel® Core™ technology (formerly Coffee Lake-S) CI370D, with latest 8th generation Intel® Core™ CPU integrated with HDMI, DP & eDP independent display, 9 x GbE, 2 x Fiber, 4 x USB 3.1, 2 x COM,4 x SATA.Plus with 2 x Mini PCIe and 1 x PCIe x16, 2 x SIM & 1 x M.2 expansion, CI370DW is designed for harsh environments, automation, machine vision, industrial communication, military and intelligent transportation applications. CI370D –Completed solution for advanced communication & automation Applications8th generation Intel® Core™ i7/i5/i3, Pentium®, or Celeron® CPU (formerly Coffee Lake-S)Intel® Q370 Chipset2 x DDR4 SODIMM socket, Max.64 GB, Multiple Independent display: HDMI, DP & eDP9 x Intel® GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 7 x USB 2.0, SPI, TPM2.02 x COM, 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe, 1 x PCIe x16 (PCIex16+PCIe x4 Signal) DC IN + 24V
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LEX Computech released super compact (102 x 83 mm) motherboard with wide range 9~36V DC power input: 2I380NX is based on Intel® Quad Core processor (formerly Bay Trail), integrated 2 x PoE, 1 x Intel® GbE LAN, 4xUSB , 2x COM Port & VGA display interface that offers the smallest platform for applications in surveillance, networking, automation, military & machine vision applications.2I380NX - Integrated PoE IP and Networking Applications Intel Atom® E3845 1.91GHz CPU / chipset (formerly Bay Trail-I)On board DDR3L 1333 MHz 4GB Display Interface: VGA2 x PoE Intel® i210 + 1 x LAN Intel® i2104 x USB (1x USB 3.0 + 3 x USB 2.0) , Micro SIM socket, 2 x Mini PCIe2 x COM (RS232/422/485)Wide Range DC IN +9~36VWide temperature support of -20°C ~ 70°C
Offering
TWIN2I380A-Palm Size Intel Atom® E3815/E3845 for Thin Client/Digital Signage/Networking Application Embedded Thin Client/Digital Signage/Networking Application Features Embedded Intel Atom® E3815/E3845 CPU/ Chipset‧ on Board 2G/4G DDR3L, VGA, HD Audio, 1 x COM‧ 1 x Realtek GbE LAN, HDMI, 1 x USB 3.0; 3 x USB 2.0‧ 2 x Mini PCle
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PM610DW is based on the 6th/7th generation Intel® CPU, integrated 3 x GbE LAN, 7 x USB, 2 x COM Port, VGA ,HDMI, & LVDS (option) display interface that offer the ideal platforms for high performance applications. PM610DW's highly configurability (PCIe x8, PCIe x 4 & PCIe x1 extension) provide integrators an ideal solution at combination Graphics processing unit (GPU card), Networking(PoE/LAN expansion module), USB connection module & CANBus modules.PM6100DW – LEX CPU board with 6th/7th generation Intel® CPU platform (formerly Skylake-S/Kaby Lake-S)Embedded Intel® Core™ i7/i5/i3 or Intel® Celeron® CPU (formelry SkyLake-U)2 x DDR4 SODIMM socket, Max up to 32GBMultiple Independent display: HDMI, VGA & LVDS (option)3 x Intel® GbE LAN, 4 x USB 3.0 ,3 x USB 2.0, 2 x COM, Touch Screen (option)2 x Mini PCIe ,1 x SIM card socket ,HD Audio, 8 DI/ 8DO,vPro @ TPM2.0PCIe x 8 golden finger (PCIe x 4 + PCIe x 1 Signal)Wide temperature support of -20°C ~ 70°C
Offering
LEX Computech released of the innovative Pico-ITX SBCs which are with fantastic flexibility and integration with optional eIO( 2 x PCIe +USB ) expansion function: 2I385EW is based on the Intel® processors (Formerly Bay Trail), integrated 2 x GbE LAN, 4 x USB, 4 x COM Port, VGA display interface that offer the ideal platforms for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities. 2I385EW –Compact solution with Rich Expansion for vertical application Intel® Atom® E3825/ Atom® E3845/ Celeron® J1900 (Dual Core/Quad Core )SoC CPU / chipset (Formerly Bay Trail)On board DDR3L 2GB/ 4GB Display: VGA2 x GbE, 2 x Mini PCIe, 4 x USB 2.04DI/4DO, HD audio , 4 x COM, Lex eIO: 2 x PCIe + USBWide Range DC IN +9~36VWide temperature support of -40°C ~ 70°C LEX eIO Rich Expansion for Vertical ApplicationsLEX’s innovative eIO Extension MB: 2I385EW is all feature flexible and integrated various IO cards to help aid efficient development, reduce resources, and assist integrators to provide optimized solutions to their customers more quickly. Through the eIO interface, the additional functions with eIO MB can be: 5-port GbE, 4-port GbE plus Fiber, 4 x PoE with Fiber , 2x PoE with Fiber,4 x SIM card socket & 4 x mini card PCIe, and power board/power supply module:
Offering
LEX Computech has released the TASK 3I610DW which is based on the latest Intel® processor, and integrates 10 x GbE, 4xUSB, wide range DC-in, 2x COM Port & HDMI, DP display interfaces that offer the ideal platform for high performance applications in surveillance, networking, automation, and military & industrial facilities. Display Interface: HDMI & DP10 x Intel® GbE LAN (5 x LAN-L2L001)2 x DDR4 SODIMM, support up to 32GB4 x USB 3.0 , 2 x COM, 2 x Mini PCIe, Nano SIMWide Range DC IN +9~36VWide temperature support, DI/O supportedSupports 4K UHD resolution contentTechnical Data :Dimensions: 77H x 210W x 125D mm .Material: AluminumColor: BlackVESA Mounting (optional): 75 x 75 mm .Weight: 1.9 Kg (Incl. M/B) .Storage Space: mSATA / 2.5" HDD
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Industrial Ethernet Appliance with Intel Atom® Dual / Quad Core CPU (Formerly Bay-Trail)LEX launches 2I380D series SBC with built-in 3 x Intel Giga LAN & 4 x USB ports as an economic and flexible hardware platform for industrial communication solution. A reliable and efficient communication network which connects all the components of the factory to work together effectively plays an important role of success industrial automation. LEX 2I380D provides customers a robust, wide range power input and compact computing system with an industrial design and built-in I/O to handle diverse applications.2I380D Spec:1. Intel® Dual/Quad Core CPU / chipset (Formerly Bay Trail)2. MB size 76.25 x 90.8 mm3. Graphic: Intel® Integrated Graphics chipset (Formerly Bay Trail)4. Memory: DDR3L 2GB / 4GB Onboard5. Features: Super compact SBC, On Board DDR3L Memory,3 x GbE, 1 x USB 3.0, 2 x RS232/422/485, 3 x USB 2.0 , VGA,1 x Full size Mini card for PCIe / USB / mSATA,1 x M.2 Mini card socket (B Key for SSD)6. Wide temperature support of -40°C ~ 70°CTechnical Data :Dimensions: 30H x 106W x 85D mm .Material: AluminumColor: SilverWeight: 410g (Incl. M/B) .Storage Space: mSATA
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Battery Charger function & Flexible IO expansion with 3.5” 6th and 7th generation Intel® SoC platform (Formerly Skylake-U / Kaby Lake-U)LEX launches 3I610BW/3I610HW SBC with 6th and 7th generations Intel® SoC processor (Formerly Skylake-U / Kaby Lake-U) to give users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis.The battery charger feature makes this platform well suited for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, ATM machines, medical / hospital station and warehouse solution.6th and 7th generation Intel® i7 /i5 /i3 /Celeron SoC CPU / chipset (Formerly Skylake-U/Kaby Lake-U)2 x DDR4 SODIMM socket, max. up to 64GB Display Interface: HDMI, VGA & LVDS 3 x Intel® (2 x I210 IT + 1 x I219LM) GbE, 2 x Mini PCIe, 1 x SIM7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0), HD Audio,6 x COM (RS232/422/485)16DI/16DO, HD audio Battery Charger function Wide Range DC IN +9 to 36VWide temperature support of -20°C to 70°C
Offering
LEX MIRO2-2I390CW/TERA2I385EW which are based on the Intel® processor (Formerly Apollo Lake / Bay Trail), and integrated 2 x GbE LAN, 4~5 x USB, 2~4 x COM Port, VGA, HDMI, eDP & DVI display interface that offer the ideal platforms for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities.LEX’s innovative eIO Extension MBs: 2I385EW /2I390CW are all feature flexible and integrated various IO cards to help aid efficient development, reduce resources, and assist integrators to provide optimized solutions to their customers more quickly. Through the eIO interface, the additional functions with eIO MB can be: 5-port GbE, 4-port GbE plus Fiber, 4 x PoE with Fiber, 2x PoE with Fiber, 4 x SIM card socket & 4 x mini card PCIe, and power board/power supply module.Technical Data :Dimensions: 72H x 140W x 92D mm (1 x eIO card) 93.6H x 140W x 92D mm (2 x eIO card)Material: AluminumColor: SliverWeight: 0.95/1.27 Kg (Incl. M/B) .Storage Space: mSATA/2.5" HDD
Offering
LEX Computech released of the next generation 3.5” motherboard with wide range 9~36V DC power input 3I170DW is based on the 6th and 7th generation Intel® Core™ i7/i5/i3 and Intel® Celeron® (Formerly Skylake-S /Kaby Lake-S) processor, Intel® Q170 Chipset, integrated 5 x GbE LAN, 10 x USB, 2 x COM Port and HDMI, VGA display interface that offer the ideal platforms for high performance applications in Networking, Smart Automation, Point-Of-Information (POI), Self-Services, In-vehicle, Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.Completed solution for Networking & IoT Applications6th/7th generation Intel® Core™ i7/i5/i3 and Intel® Celeron® CPU /Q170 chipset (Formerly Skylake-S/Kaby Lake-S)1 x DDR4 SODIMM socket, max. up to 16GBDisplay Interface: HDMI & VGA5 x Intel® (4 x I210 IT + 1 x I219LM) GbE, 2 x Mini PCIe, 1 x SIM10 x USB ( 2 x USB 3.0/2.0 + 8 x USB 2.0), HD Audio,2 x COM (RS232/422/485)8DI/8DO, HD Audio, Audio AMPWide Range DC IN +9~36VWide temperature support of -20°C ~ 70°C
Offering
LEX Computech TASK 3I170DW which is based with 6th/7th generation Intel® processor (formerly Skylake-S/Kaby Lake-S), and integrates 5 x GbE, 4xUSB, wide range DC-in, 2x COM Port, VGA & HDMI display interfaces that offer the ideal platform for high performance applications in surveillance, networking, automation, and military & industrial facilities. Display Interface: HDMI & VGA5 x Intel® GbE LAN1 x DDR4 SODIMM, support up to 32 GB 2 x USB 3.0 , 2 x USB 2.0 ,2 x COM, 2 x Mini PCIe, Wide Range DC IN to +36V Wide temperature support, DI/O supported, Supports 4K UHD resolution content. TASK Technical Data :Dimensions: 77H x 210W x 125D mm . Material: Aluminum Color: BlackVESA Mounting (optional): 75 x 75 mm .Weight: 1.9 Kg (Incl. M/B) .Storage Space: mSATA / SSD
Offering
Industrial Ethernet Appliance 3.5” Single Board Computer with Intel® SoC Processor (Formerly Skylake-U)LEX Computech released of the next generation 3.5” motherboard with wide range to 36V DC power input & fantastic flexibility and integration with optional eIO (PCIe + USB ) expansion Function: 3I610DW is based on the Intel®Core™ i7/i5/i3, or Celeron™ processor (Fomrerly SkyLake-U), integrated 5 x GbE LAN, 7 x USB, 2 x COM Port and HDMI, DP display interface that offer the ideal platforms for high performance applications in Networking, Smart Automation, Point-Of-Information (POI), Self-Services, In-vehicle, Industry 4.0 and any compact high-performance Internet of Things (IoT) applications. 3I610DW - Complete solution for Networking & IoT Applications Intel® Core™ i7/i5/i3, or Celeron® SoC CPU / chipset (Formerly Skylake-U)2 x DDR4 SODIMM socket, max. up to 64GB, Display Interface: HDMI, DP & eDP, 5 x Intel® (4 x I210 IT + 1 x I219LM) GbE, 2 x Mini PCIe, 1 x Nano SIM, 7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0)HD Audio2 x COM (RS232/422/485), 4DI/4DO, HD audio, Lex eIO: PCIe + USB, Wide Range DC IN +9 to 36VWide temperature support of -40°C to 70°CTPM 2.0 / vPro
Offering
3I612DW is based on the Intel® Core™ i7/i5/i3 or Intel® Celeron® processor (formerly SkyLake-U/Kaby Lake-U), integrated 2 x SFP Fiber, 5 x GbE LAN, 8 x USB, 2 x COM Port and HDMI,DP display interface that offer the ideal platforms for high performance applications in Networking, Automation, Machine Vision, In-vehicle , Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.3I612DW - hard-hitting connectivity via Fiber & Ethernet NetworkIntel® Core™ i7/i5/i3 or Intel® Celeron® SoC CPU / chipset (formerly Skylake-U/Kaby Lake-U)2 x DDR4 SODIMM socket, max. up to 32GBDisplay Interface: HDMI, DP & eDP5 x Intel® (4 x I210 IT + 1 x I219LM) GbE, 2 x SFP Fiber,8 x USB (4 x USB 3.0/2.0 + 4 x USB 2.0), HD Audio, 2 x COM (RS232/422/485)4DI/4DO, 2 x Mini PCIe, 1 x Micro SIMWide Range DC IN +12~48V
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6th/7th generation Intel® Core™ CPU (formerly Skylake-U/Kaby Lake-U)SODIMM DDR4 Max. 64GB, 5x Intel® Giga LAN, 2x SFP Fiber, 4xUSB 3.0,1xDP, 1xHDMI,2xCOM Mini card (PCIe/USB3.0), 1xNano SIM, Mini card (PCIe/USB/mSATA) 2x SATA,4 DI / 4 DO, Dimension: 44 x 230 x 215 mm, Wide Range +12 to 48V DC input Operating temperature: -20°C to +60°CExpansion: COM, PoE LAN, Mini Card slot, Fiber, USB2.0/3.0, DIO, RAID, CANbus
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LEX Computech released the next generation 2.5" (102 x 88 mm) motherboard 2I610HW powered with 6th/7th generation Intel® processor (Formerly Skylake-U / Kaby Lake-U) & offered the ideal platform for high performance applications. 2I610HW's all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board within various mechanical enclosures. The compact size feature makes 2I610HW well suited for many space-limited and thermally constrained embedded applications, such as Automation Control, In-Vehicle, Military, Smart Factory, Industry 4.0 and Robot Technology solution. Ideal solution for space-limited embedded Applications6th/7th generation Intel® Core™ i7/i5/i3 or Intel® Celeron® SoC (Formerly Skylake-U/Kaby Lake-U) CPU / chipset1 x DDR4 SODIMM socket, max. up to 32 GB Display Interface: HDMI, VGA & LVDS2 x Intel® (I210 IT) GbE, 2 x Mini PCIe, 4 DI/4DO,Touch Screen7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0),2 x COM (RS232/422/485)Wide Range DC IN +9 to36VWide temperature support of -20°C to 70°C
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SKY 3 3I170NX 6th/7th generation Intel® Core™ CPU (formerly Skylake-S/Kaby Lake-S), Q170 ,SODIMM DDR4 Max. 64GB, 4 x PoE, 1x Intel® Giga LAN, 2x USB 3.0, VGA, HDMI, 2x COM, Mini card (USB/PCIe/mSATA) , Mini card (USB/PCIe/mSATA)-half size, 1x SIM,1x SATA, 8 DI / 8 DO, Support DIN Rail Mount, Dimension: 66.9H x 183W x 142.2D mm, Wide Range +12 to 36V DC input, Operating temperature: -20°C to +50°C, Expansion: COM, PoE LAN ,Mini Card slot, Fiber, USB2.0/3.0, DIO, RAID, CANbus.
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8th generation Intel® Core™ CPU (formerly Whiskey Lake-U) SODIMM DDR4 Max. 32GB 4 x Intel® Giga LAN 3 x USB 3.01, VGA,1 x HDMI, 2x COM Mini card (PCIe/mSATA/USB3.0/USB2.0) Mini card (PCIe/mSATA/USB3.0/USB2.0)-half size1 , SATA4 DI / 4 DOLine-out / Mic-in Support DIN Rail Mount Dimension: 71.9 H x 141W x 111.2D mm+12V DC inputOperating temperature: -20°C to +60°C Expansion: COM, PoE LAN, Mini Card slot, Fiber, USB2.0/3.0, DIO
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Industrial Ethernet Appliance with Intel Atom® Bay-Trail Dual / Quad Core CPULEX launches 2I380D series SBC with built-in 3 x Intel Giga LAN & 4 x USB ports as an economic andflexible hardware platform for industrial communication solution. A reliable and efficient communication networkwhich connects all the components of the factory to work together effectively plays an important role of successindustrial automation. LEX 2I380D provides customers a robust, wide range power input and compact computingsystem with an industrial design and built-in I/O to handle diverse applications.2I380D Spec:1. Intel® Dual/Quad Core CPU / chipset (Formerly Bay Trail)2. MB size 76.25 x 90.8 mm3. Graphic: Intel Integrated Graphics chipset (Formerly Bay Trail)4. Memory: DDR3L 2GB / 4GB Onboard5. Features: Super compact SBC, On Board DDR3L Memory,3 x GbE, 1 x USB 3.0, 2 x RS232/422/485, 3 x USB 2.0 , VGA,1 x Full size Mini card for PCIe / USB / mSATA, 1 x M.2 Mini card socket (B Key for SSD)
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LEX 3I170HW SBC with Intel® processor (formerly Skylake-S / Kaby Lake-S) to give users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions & and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, military and IP surveillance solutions.3I170HW –ideal solution for Industry 4.0 ApplicationsIntel® Core™ i7/i5/i3 or Intel® Celeron® CPU (formerly Skylake-S/Kaby Lake-S)Intel® Q170 chipset2 x DDR4 SODIMM socket, max. up to 32GBDisplay Interface: HDMI, VGA & LVDS5 x Intel® (4 x I210 IT + 1 x I219LM) GbE, 1 x Mini PCIe, 1 x SIM9 x USB (2 x USB 3.0/2.0 + 7 x USB 2.0), 2 x COM (RS232/422/485)8DI/8DO, HD audio, 1 x M.2 B key, Touch Screen controllerWide Range DC IN +9~36VOperation temperature 0°C ~ 60°C
Offering
LEX launches ST610W Computer on Modules with 6th/7th generation Intel® Core™ i3/i5/i7 or Intel® Celeron® (formerly Skylake-U / Kaby Lake-U) processor to give users flexible, reliable and cableless solution for configuring the customized system in the shortest time. By connecting with MXM-3 connectors (314-pin expansion), users can adopt a carrier board with suitable I/O interfaces.More functions than COMe and SMARC 2.0 ,Save your time and money to develop evaluation boardST610W spec :DDR4 SO-DIMM, max up to 32GBVGA, HDMI & LVDS 24 bit / 2CHResister Touch Screen Controller2 x Intel® GbE i210 LAN2 x USB 3.0, 5x USB 2.04 x COM RS232 / 422 / 485 Auto4 x PCIe2 x SATA8 x DI / 8DOHD Audio with Amplifier9~36V DC-Input5V, 12V DC-OutputLPCWatch Dog Timer 0-255 secondDimension: 110 x 88 mmOperation Temp.: -40°C~70°COperation Humidity: 5~95%,
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6th/7th Intel® Core™ CPU, Q170 (formerly Skylake-S/Kaby Lake-S)SODIMM DDR4 Max. 64GB, 2x Intel® Giga LAN, 4 x Renesas uPD720202 USB 3.0 Host Controller with max. 2A output current for vision camera , 4 x USB 3.0 with cable-lock design, 2 x USB 3.0, VGA, HDMI, DP, 2 x COM, Mini card (PCIe/mSATA/USB 3.0/USB 2.0),1x SIM, Mini card (USB/PCIe/mSATA)-half size, 1x M.2, 2 x SATA, 8 DI / 8 DO, Line-out /Mic-in, Dimension: 160 x 122 mm Wide Range +9 to 36V DC input Operating temperature: -20°C to +70°C Expansion: 4 x COM, 2 to 4 x PoE LAN , FSP, USB2.0/3.0, 8DI/8DO, RAID, CANbus.
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Maximizing performance 3.5” Single Board Computers with 6th generation Intel® SoC Processor LEX Computech released of the next generation 3.5” motherboard with wide range 9 to 36V DC power input: 3I610AW/3I610CW is based on the Intel® Core™ i7 /i5/ i3/ and Intel® Celeron® processors, integrated 2 x GbE LAN, 7 x USB, 6 x COM Port and VGA, DVI display interface that offer the ideal platforms for high performance applications in Healthcare Service, Smart Automation, Point-Of-Information (POI), Self-Services, In-vehicle Infotainment, Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.6th generation Intel® Core™ i7/ i5/ i3/ and Intel® Celeron® CPU / chipset1 x DDR4 SODIMM socket, max. up to 32GB, Display Interface: VGA & DVI, LVDS (Touch Screen controller)2 x Intel® GbE, 2 x Mini PCIe, 1 x SIM7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0)6 x RS232 / 422 / 485 (COM 1 to 4 provide 5V/12V jumper option)Storage: 2 x SATA, 1 x mSATA, Wide Range DC IN +9 to 36V, Wide temperature support of -20°C to 70°C
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Star Panel PC with the compact size feature makes this platform well suited for many space-limited and thermally constrained embedded applications, such as Digital Signage Machines, Visual inspection instruments and POS/Kiosk solution. Star Panel PC with 2I385A/CW SBC 's low power consumption and equipped with special design to withstand high vibration, extreme temperature variation, and dynamic power supply voltagevehicle working environment. · LCD panel with resistivetouch screen· Intel® Atom™ BayTrailE3825 / E3845 SoC· DDR3L 2GB / 4GB on board· 2 x GbE, 4 x COM, VGA, 4 xUSB, Audio· Wide Range 9 to36V DC input· Aluminum housing
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LEX System 2I385HW SBC equips with Intel Atom® (dual core / quad core) processor & offers users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis. The compact size feature makes this platform well suited for many space-limited and thermally constrained embedded applications, such as Automation Control, Transportation, Military, Aquaculture industry, Oceanographic research and POS/Kiosk solution.
Offering
LEX Computech has released the TASK 3I390NX which is based on the latest Intel® processor, and integrates 5 x GbE( 4 x PoE ), 4xUSB, wide range DC-in, 2x COM Port & VGA(share DP), HDMI, display interfaces that offer the ideal platform for high performance applications in surveillance, networking, automation, and military & industrial facilities. Display Interface: HDMI, VGA(share DP) ,5 x Intel® i210IT GbE LAN (4 x PoE)1 x DDR3L SODIMM, support up to 8GB, 4 x USB (2 x USB 3.0 + 2 x USB 2.0) , 2 x COM, 2 x Mini PCIe, Wide Range DC IN +9 to 36VWide temperature support, DI/O supported, Technical Data :Dimensions: 77H x 210W x 125D mm .Material: Aluminum Color: Black VESA Mounting (optional): 75 x 75 mm .Weight: 1.9 Kg (Incl. M/B) .Storage Space: mSATA / 2.5" HDD
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LEX Computech released of the next generation Pico-ITX SBC with optional LEX eIO (2 x PCIe +USB) expansion function: 2I392CW is based on the latest Intel® Apollo Lake processor, integrated 2 x GbE LAN, 6 x USB, 2 x COM Port and 2 x HDMI, LVDS display interface that offer the ideal platforms for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities.2I392CW- Compact solution with Rich Expansion for vertical application. Intel® Pentium® N4200 / Intel® Celeron® N3350 / Intel Atom® E3950 SoC CPU / chipset (Formerly Apollo Lake)1 x DDR3L 1600 Mhz SODIMM, Max up to 8GB, Display: LVDS & 2 x HDMI, 2 x GbE, 2 x Mini PCIe, 4 x USB 3.0, 2 x USB 2.0, 4DI/4DO, HD audio, 2 x COM, Lex eIO: 2 x PCIe + USB expansion, Wide Range DC IN +9 to 36V ,Wide temperature support of -20°C to 70°C
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LEX SYSTEM 1I386H comes with ultra small Femto-ITX (1.8”) size 56 x 90 mm ideally combines the processor advantages at the smallest footprint board. 1I386H provides ideal solution for maximizing computer performance at many space-limited and thermally constrained embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating embedded systems.1I386H Specification :Intel Atom® E3825 1.33GHz (Dual core) CPU (formerly Bay Trail-I) MB size: Femto-ITX (1.8”) 55 x 90 mm Memory: DDR3L 2GB Onboard Storage: mSATA/M.2 B Key for SSD Features (wafer IO): VGA, 1 x Intel GbE, 1 x USB 3.0, 2 x USB2.0, 1 x COM, eDP, Touch Screen, DIO, Audio, 1 x M.2 B Key (SSD) 1 x Mini PCIe Power: DC-IN 12V Operation Temperature: -20∘C to 70 ∘C
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PM390CW is based on Intel® processors (formerly Apollo Lake), integrated 2 x GbE LAN, 5 x USB, 5 x COM Port, VGA, HDMI, & eDP (Option) display interface that offer the ideal platforms for high performance applications. PM series's highly configurability (PCIe x8, PCIe x 4 & PCIe x1 extension) provide integrators an ideal solution at combination Graphics processing unit (GPU card), Networking (PoE/LAN expansion module), USB connection module & CANBus modules.Intel® N4200 / N3350 / E3950 SoC CPU / chipset (formerly Apollo Lake)Intel® N4200 / N3350/ E3950 CPU (formerly Apollo Lake)1 x DDR3L 1600 Mhz SODIMM, max up to 8GBMultiple Independent display: HDMI, VGA & eDP (option)2 x Intel® GbE LAN, 2 x USB 3.0, 3x USB 2.0, 5x COM, 1x M.22 x Mini PCIe, 1x SIM card socket, HD Audio, 8 DI/ 8DO, Touch Screen (option)PCIe x 8 golden finger (PCIe x 4 + PCIe x 1 Signal)Wide temperature support of -20°C ~ 70°C
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2I810D : ultra compact (102 x 108 mm) motherboard with 8th Gen. Intel® Core™ i7/i5/i3 or Celeron® processor (formerly Whiskey Lake-U), integrated 4 x GbE LAN, 7 x USB, 2 x COM Port and HDMI,VGA display interface that offer the ideal platforms for high performance applications in Networking, Smart Automation, Machine Vision, In-vehicle , Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.2I810D –Compact solution for Networking & IoT Applications8th generation Intel® Core™ i7/i5/i3 or Celeron® SoC CPU / chipset (formerly Whiskey Lake-U),1 x DDR4 SODIMM socket, max. up to 16GB, Display Interface: VGA & HDMI, 4 x Intel® (1x I219LM+3xI210 IT) GbE, 2 x Mini PCIe, 4DI/4DO, 7 x USB (3 x USB 3.0/2.0 + 4 x USB 2.0), 2 x COM (RS232/422/485), DC IN +12V, Wide temperature support of -20°C to 70°C
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LEX 2I385BW SBC with Intel® BayTrail SoC processor to give users fast, convenient and simplified solutions for industrial and embedded applications. The battery charger feature makes this platform well suited for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, ATM machines, medical / hospital station and warehouse solution.2I385BW –highly mobility solution for Industry 4.0 ApplicationsIntel Atom® E3825 /E3845 CPU (formerly Bay Trail)On Board DDR3L2GB /4 GBDisplay Interface: Mini HDMI, VGA & LVDS1 x Intel® (I210 IT ) GbE, 1 x Mini PCIe, 1 x Micro SIM, 1 x Micro SD3 x USB (1 x USB 3.0/2.0 + 2 x USB 2.0), HD Audio, 1 x COM (RS232/422/485)4DI/4DO, 1 x M.2 B Key , Battery Charger functionDC IN +12VWide temperature support of -20°C ~ 70°C
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Maximizing performance 3.5” Single Board Computers with Intel® Bay Trail SoC ProcessorLEX Computech released of the next generation 3.5” motherboard with wide range 9~36V DC power input: 3I385AW is based on the Intel® Quad core processor (Formerly Bay Trail), integrated 2 x GbE LAN, 5 x USB, 6 x COM Port and VGA,DVI display interface that offer the ideal platforms for high performance applications in Digital Signage, medical devices, POS/Kiosk, gaming machines, automation, military & industrial facilities.3I385AW/CWCompleted solution for IoT & Industry 4.0 ApplicationsIntel® J1900/E3845 SoC CPU (Formerly Bay Trail)• 1 x DDR3L SODIMM socket, max. up to 8GB• Display Interface: VGA & DVI• 2 x Intel GbE, 2 x Mini card (1 x USB/PCIe/mSATA, 1 x USB/PCIe), 1 x SIM• 5 x USB (4 x USB 2.0/3.0 + 1 x USB 2.0 wafer), HD Audio (option)• 6 x COM (2 x RS232, 4 x 232/422/485 - option 5/12V)• Wide Range DC IN +9~36V• Wide temperature support of -40°C~70°C for Intel E3845 CPU
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LEX SYSTEM APOLLO PM170DW is with 6th/7th generation Intel® Core™ CPU, Q170 chipset SODIMM DDR4 Max. 64GB, 4 x Intel® Giga LAN, 4 x USB 3.0, 6 x USB 2.0 VGA, HDMI, 3 x COM Mini card (USB/PCIe/mSATA) Mini card (USB/PCIe), 1x PCIe x16 , 1x PCIe x4, 2 x SIM, 1x M.2 B Key, 4 x SATA, Line-out /Mic-in Dimension: 260 W x 142.5D x 173H mm Wide Range +12 to 24V DC input Operating temperature: -20°C to +50°C Expansion: COM, PoE LAN , Mini Card slot, Fiber, USB2.0/3.0, DIO, RAID, CANbus.
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8th /9th generation Intel® Core™ CPU (formerly Coffee Lake-S), Q370SODIMM DDR4 Max. 64GB, 9 x Intel® Giga LAN, 2x SFP Fiber, 4 x USB 3.1, 1 x DP, 1x HDMI, 2x COM, Mini card (USB/PCIe/mSATA), 1 x SIM, Mini card (USB/PCIe/mSATA), 1 x SIM, 1 x PCIe x16, 1 x M.2 B Key (SATA/PCIe), SATA, 8 DI / 8 DO, Dimension: 85H x 300W x 262D mm, DC IN +24V, Operating temperature: -20°C to +50°C , Expansion: COM, PoE LAN, Mini Card slot, Fiber, USB2.0/3.0, DIO, RAID, CANbus.
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LEX SYSTEM 3I470DW, with latest Intel® 10th Gen Comet Lake-S Core™ i CPU, equipped with 5 x GbE, 4x RS232/RS422/485 serial ports, 8 x USB, 8 DI /8 DO, DP, HDMI & eDP and PCIe/mPCIe/M.2 expansion slots, is ideal platform to integrate diagnostic test tools and control equipment for video surveillance, vehicle communication and industrial IoT automation applications. 3I470DW provides horizontal type memory SODIMM socket for flexible implementing with heat-spreading requirement. Furthermore, APOLLO-S & APOLLO-RS 3I470DW mechanical design provide rugged and scalable computing platforms that support installing graphics card which benefit the implementation of advanced AI applications such as machine learning, autonomous vehicle, intelligent video analytics, facial recognition.
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10th Gen Intel® Core™ CPU (35W), Q470 chipset DDR4 SODIMM, Max 64 GB 5 x Intel® GbE 2 x COM RS232/422/485 4 x USB 3.1 , 4 x USB 2.0 1 x HDMI,1 x DP Mini card (PCIe / mSATA / USB 3.0/ USB 2.0) 1 x Nano SIM 1 x M.2 B Key, Type 3042 / 3052 (mSATA / PCIe / USB 3.0 / Wide Range DC IN+12 to 36V, Dimension: 230 x 89 x 173 mm
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LEXSYSTEM 2I110D combines 11th Intel® Core™ SoC Processor processor and new graphics architecture with up ot 32GB DDR4 memory to ensure the enhancement of graphics performance. 2I110D also delivers high-speed I/O ports, including 4 x GbE ,3 x USB 3.0, 2 x serial port and M.2 B-key with Nano SIM, M.2 M-key supports NVMe . The compact 2.5” form-factor also makes 2I110D as small, rugged and ideal platform for implementing users’ AI solutions of smart transportation, factory automation and telemedicine applications. Specification 11th Intel® Core™ SoC Processor CPU 1 x DDR4 SODIMM Max. 32GB Multiple Independent display: HDMI, eDP 4 x Intel® GbE i219LM/i210IT LAN,3 x USB 3.0 (Type A), 6 x USB 2.0, 2 x COM RS232/422/485, 4DI/4DO, 1 x M.2 B key Type 3042 (PCIe x2 / SATA / USB 3.0 / 2.0), 1 x Nano SIM 1 x M.2 M key Type 2242 (PCIe x4 / SATA), Supports NVMe SSD TPM 2.0 (Optional) DC IN +12V
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LEXSYSTEM 2I640DW is with Intel Atom® processors. 2I640DW integrated 3 x GbE LAN, 6 x USB, 2 x COM Port , 2 x HDMI(or DP) display interface and 2 x M.2 expansion slot offers the ideal platform for graphics performance with integrated IoT features, real-time performance, manageability, and security. Specification Intel Atom® X6413E / J6412 CPU 1 x DDR4 SODIMM socket, max. up to 32GB Display Interface: : 2 x HDMI / DP, 1 x eDP 3 x Intel® GbE I210IT or I211AT, 2 x COM (RS232/422/485) 6 x USB (2 x USB 3.0/2.0 + 4 x USB 2.0), 2 1 x M.2 B Key Type2242 / 3042 (PCIex2 / USB 3.0 / USB 2.0) 1 x M.2 B Key Type2242 (PCIex2 / USB 2.0) 1 x Nano SIM (option) Wide Range DC INPUT(+9 to 36V)
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LEX SYSTEM AI Box : SKY 3 3I110HW is with 11th Gen. Intel® Core™ processor and rugged DIN Rail mechanical chassis . In addition to its adequate functional I/O options, LEX AI Box offers users a powerful and flexible solution for AI Appliance and Edge Video Analytics. SKY 3 3I110HW Hardware key features: 11th Gen Intel® Core™ CPU 2 x DDR4 SODIMM , Max up to 64GB 3 x Intel® GbE i219LM/i210IT 4 x RS232/422/485 4 x USB 2.0 VGA, HDMI 1 x Mini PCIe (PCIe/ USB 2.0) 1 x M.2 B Key Type 3042 (PCIe x 2 / mSATA/USB3.0/2.0) 1 x M.2 M Key Type 2280 (PCIe x 4), support NVMe 1 x SIM 4 DI/4DO Line-out / Mic-in Wide Range DC IN 9-36V Dimension 183 W x 141 D x 98.9 Hmm
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LEX SYSTEM latest 3.5” SBC 3I110HW/BW is with 11th Intel® Core™ Processor processor which offers users powerful and flexible solution for industrial and embedded applications. The battery charger feature makes this platform well suited for reliability and mobility constrained embedded applications, such as Automation Control, Transportation, ATM machines, medical / hospital station and warehouse solution Specification: 11th Gen Intel® Core™ i7 / i5 / i3 / Intel® Celeron® CPU 2 x DDR4 SODIMM (Max. 64GB) Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS 3 x Intel® GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM 1 x M.2 B Key, 1 x M.2 M Key TPM 2.0 (Optional) Battery Charger Function (3I110BW)
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Intel 8th Gen Coffee Lake-S Core I CPU, Q370 Chipset DDR4 SODIMM, Max. 32 GB 5 x Intel GbE i219LM/i210IT 4 x COM RS232/422/485 4 x USB 3.1 1 x HDMI,1 x DP, eDP Mini card (PCIe / mSATA / USB3.0/2.0) 1 x M.2(PCIe / mSATA / USB3.0/2.0) 1 x PCIe x16 SSD/ HDD/ M.2/ mSATA /2 x CRAST (option) TPM 2.0 (Option) 16DI/16DO (Optional to COM port) Line-Out/Mic-In Wide Range DC IN+12~36V, Dimension: 230 x 109 x 173 mm Operation Temp.：-20°C~ + 60°C
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Intel 6th/7th Gen Skylake-U/Kaby Lake-U Core i CPU DDR4 SODIMM, Max.16GB 2 x Intel GbE i210IT 4 x USB 3.0 2 x COM RS232/422/485 2 x HDMI (or 2*DP) Mini Card (USB/PCIe/mSATA) Mini Card (PCIe/USB3.0/USB2.0) TPM (Option), 4 DI /4 DO (Option), 2.5" HDD/ SSD Dimension: 145 x 106.2 x 56.5mm Wide Range DC IN +9~36V Operation Temp.：-20°C~ + 60°C
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Intel 6th/7th Skylake-U/Kaby Lake-U Core i CPU On board 8GB (option 16GB) + SODIMM Max 16GB 4*PoE, 1* Intel GbE i219LM/i210IT 2*USB 3.0, 2* USB 2.0 VGA, HDMI 2*COM RS232/422/485 Mini card (PCIe/USB3.0/USB 2.0) Mini card (PCIe/USB/mSATA)-half size 1 x M.2 NVME (PCIe/mSATA/USB3.0/USB2.0) HDD / SSD*, Mobile Rack (Option) TPM (Option) 16 DI / 16 DO (Option) Dimension:183W x 142.2D x 83.9H mm Wide Range +9~48V DC input CPC-Car ignition Power Control Operating temperature: -20°C to +60°C
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"Intel 8th Gen Whiskey Lake-U Core I CPU, DDR4 SODIMM, Max.32 GB 5 x Intel GbE i219LM/i210IT 2 x COM RS232/422/485 4x USB 3.1 2 x HDMI Mini card (PCIe / USB) 1 x Nano SIM 1x M.2 2242 B Key (PCIex2/mSATA/USB2.0 ) 1x M.2 3042 B Key (USB3.0/USB2.0 ) 2.5" HDD / SSD TPM2.0 (option) 8 DI/ 8DO (Option), Wide Range DC IN +9~36V Dimension:210 x 125 x 77 mm Operation Temp.：-20°C~ + 60°C
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Intel 6th/7th Gen Skylake-U/Kaby Lake-U Core i CPU DDR4 SODIMM, Max 16GB 2 x Intel GbE i210IT 4 x USB 3.0 2 x COM RS232/422/485 2 x HDMI (or 2*DP) Mini Card (USB/ PCIe / mSATA) Mini Card (PCIe / USB3.0 / USB2.0) TPM (Option), 4 DI /4 DO (Option), 2.5" HDD/ SSD Dimension: 141 x 111.2 x 71.9 mm Wide Range DC IN +9~36 V Operation Temp.：-20°C~ + 60°C
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Intel 8th Gen Coffee Lake-S Core I CPU, Q370 Chipset DDR4 SODIMM, Max. 32 GB 5 x Intel GbE i219LM/i210IT 4 x COM RS232/422/485 4 x USB 3.1 1 x HDMI,1 x DP, eDP Mini card (PCIe / mSATA / USB3.0/2.0) 1 x M.2(PCIe / mSATA / USB3.0/2.0) SSD/ HDD/ M.2/ mSATA /2 x CRAST (option) TPM 2.0 (Option) 16DI/16DO (Optional to COM port) Line-Out/Mic-In Wide Range DC IN+12~36V, Dimension: 230 x 99 x 173 mm Operation Temp.：-20°C~ + 60°C
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Intel BayTrail 3825/3845/J1900 On Board DDR3L 2GB/4GB 3* Intel Giga LAN i210IT/i211IT 1*USB 3.0, 3* USB 2.0 VGA 1*COM DB-9 RS232/422/485 1*COM Phoenix RS232/422/485 isolation Mini card (PCIe/USB/mSATA) 1*M.2 (B Key SATA) Type2242 Dimension : 110W x 90D x 30H mm Wide Range +12~36V DC input Operating temperature: -20°C to +60°C
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LEX SYSTEM 2I382DW SBC with built-in 3 x Intel Giga LAN, 4 x USB , 2 COM as a flexible hardware platform for industrial communication solution. A reliable and efficient communication network which connects all the components of the factory to work together effectively plays an important role of success industrial automation. 2I382DW provides customers a robust, wide range power input and compact computing system with an industrial design and built-in I/O to handle diverse applications. 2I382DW –ideal industrial networking solution • Intel® Bay Trail E3825 / E3845/J1900 CPU / chipset • On Board DDR3L 2GB / 4GB • Independent display: VGA • 3 x Intel GbE I210IT ,1 x USB 3.0, 3 x USB 2.0 • 2 x COM, RS232/422/485 (DB9+Phoenix isolation) • 1 x Full size Mini PCIe (PCIe / mSATA / USB) • 1 x M.2 B Key, Type 2242 (SATA) • 1 x Nano SIM (option) • 4 DI / 4DO • Wide Range +12~36V • Wide temperature support of -20°C ~ 70°C
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LEX SYSTEM 3I370DW, with latest Intel 9th/8th Gen Coffee Lake-S Core i CPU, equipped with 5 x GbE, 6 x RS232/RS422/485 serial ports, 8 x USB, 16 DI /16 DO, DP, HDMI & eDP and PCIe/mPCIe/M.2 expansion slots, is ideal platform to integrate diagnostic test tools and control equipments for video surveillance, vehicle communication and industrial IoT automation applications. 3I370DW provides the option of horizontal & vertical type memory SODIMM socket for flexible implementing with heat-spreading requirement. Furthermore, APOLLO-S & APOLLO-RS 3I370DW mechanical design provide rugged and scalable computing platforms that support installing graphics card which benefit the implementation of advanced AI applications such as machine learning, autonomous vehicle, intelligent video analytics, facial recognition. 3I370DW –Completed solution for AI & Industry 4.0 Applications • Intel® 9th /8th Gen Coffee Lake-S, i9(35W)/ i7 /i5 /i3 /Pentium/ Celeron CPU • Intel® Q370 Chipset • 2 x DDR4 SODIMM socket, Max. 32GB, • Multiple Independent display: HDMI, DP & eDP (eDP to VGA and DVI converter) • 5 x Intel GbE LAN, 4 x USB 3.1,4 x USB 2.0, TPM2.0 • 1 x Full size Mini PCIe (PCIe / mSATA / USB 3.0 / USB2.0) • 1 x M.2 B Key, Type 224 (Support NVME) • 1 x PCIe 16x golden finger • 6 x RS232/422/485 (internal) – Optional to DIO port • 16 DI/ 16 DIO-Optional to Serial Port Wide Range DC Input +12~36V • Wide Range temperature support -20 °C ~ 60°C
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LEX SYSTEM latest 3.5” SBC 3I810HW/BW is with 8th Gen. Intel® Whiskey Lake-U i7/i5/i3/Celeron/Pentium processor which offers users powerful and flexible solution for industrial and embedded applications. The battery charger feature makes this platform well suited fo reliability and mobility constrained embedded applications, such as Automation Control, Transportation, ATM machines, medical / hospital station and warehouse solution 3I810HW/BW –highly mobility solution for Industry 4.0 Applications • 8th Gen Intel® Whiskey Lake-U, i7 / i5 / i3 / Pentium / Celeron CPU • On board 8GB (Option 16GB) DDR4 + SODIMM Max.16GB • Multiple Independent display: VGA, HDMI, LVDS • 3 x Intel GbE i219LM/i210IT LAN,3 x USB 3.0, 4 x USB 2.0, • 6 x COM RS232/422/485, Touch Screen,16DI/16DO, • 1 x Mini PCIe (PCIe / mSATA / USB 2.0/3.0) • 1 x SIM, 1 x M.2 ( mSATA/USB/PCIe ) • TPM 2.0 (Optional) • Wide Range DC IN +9~36V , Battery Charger Function • Operation Temp.：-20°C~ + 70°C
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LEX System 3I610NM is based on Intel® 6th/7th Skylake / Kabylake U processor, integrated 4 x RJ45/M12 PoE, 7 x USB , 2 x COM Port , VGA, HDMI display interface, wide range 9~+48V input plus with ignition delay on/off control which could protect computing systems from damage causing by unexpected voltage and current and makes sure it operates normally. 3I610NM supports onboard memory and could expand extra memory via SODIMM, M12 PoE I/O and features comprehensive storage options including two 2.5” mobile rack Bays also make it the ideal for in-vehicle NVR applications. Main Features: • 6th /7th Gen Intel® Skylake/ Kabylake U, i7 / i5 / i3 / Celeron CPU • On board DDR4 8GB/16GB , expand extra 16GB (max) via SODIMM • Multiple Independent display: VGA & HDMI • 4 x RJ45/M12 PoE, 1 x Intel GbE LAN,2 x USB 3.0, 5 x USB 2.0 • 2 x COM, 16DI/16DO,2 x SIM • 1 x Full size Mini PCIe ( PCIe/USB 3.0/USB2.0 ) • 1 x Half size Mini PCIe ( PCIe/ mSATA/USB ) • 4G/5G LTE expand by M.2 (PCIex2/mSATA/USB2.0/USB3.0) • NVME M.2 • Wide Range 9~48V DC Input with ignition delay on/off control • TPM 2.0 (Optional) • Operation Temperature : -20°C~70°C • E-Mark /EN50155 Certified
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Pico-ITX 2.5" (110 x 92 mm) motherboard 2I612CW: powered with Intel® Skylake-U / Kaby Lake-U processor & offered the ideal platform for high performance applications. With 2 x Intel GbE LAN ports, 4 x USB 3.0 ports, and 3 x USB 2.0 ports, 2I612CW can be connected to a range of cameras and sensors and its 4 DI /4 DO enables it to control connected systems base on digital inputs. 2I612CW also has 2 x HDMI port ( could be OEM to DP) and eDP for display output for wide deployment in application specific environments, such as machine vision , automation, effect HMI related applications Main Features: • Intel® Skylake-U/Kaby Lake-U i7 /i5 /i3 /Celeron SoC CPU • 1 x DDR4 SODIMM socket, max. up to16GB • Display Interface: 2 x HDMI (OEM to DP), eDP • 2 x Intel ( I210 IT ) GbE • 1 x Full size Mini PCIe (PCIe / mSATA / USB) 1 x Full size Mini PCIe (PCIe / USB 3.0 / USB2.0) • 4 DI / 4 DO • 7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0) • 2 x COM (RS232/422/485) • TPM 2.0 (Option) • Wide Range DC IN +9~36V • Wide temperature support of -20°C ~ 70°C
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Completed Intelligent Appliance with 8th Intel® Whiskey Lake-U SoC Processor LEX SYSTEM latest 3.5” SBC 3I810DW is with 8th Gen. Intel® Whiskey Lake-U i7/i5/i3/Celeron processor, integrated 5 x GbE LAN, 7 x USB, 2 x COM and 2 x HDMI & eDP display interface & plus with wide range+9~36V DC input that offers the ideal platform for high performance applications in AI, Smart Automation, Machine Vision, In-vehicle , Industry 4.0 and any compact high-performance Internet of Things (IoT) applications Main Features: • 8th Gen Intel® Whiskey Lake-U, i7 / i5 / i3 / Pentium / Celeron CPU • 2 x DDR4 SODIMM socket, Max. 32GB • Multiple Independent display: 2 x HDMI, eDP • 5 x Intel GbE LAN, 4 x USB 3.1, 3 x USB 2.0 • 2 x COM, 8DI / 8DO, 1 x Mini PCIe,1 x Nano SIM • 2 x M.2 B Key, TPM 2.0 (Optional)
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LEXSYSTEM SKY 2 2I110D combines 11th Intel® Core™ SoC Processor processor and new graphics architecture with up ot 32GB DDR4 memory to ensure the enhancement of graphics performance. SKY 2 2I110D also delivers high-speed I/O ports, including 4 x GbE ,3 x USB 3.0, 2 x serial port and M.2 B-key with Nano SIM, M.2 M-key supports NVMe . The compact 2.5” form-factor also makes 2I110D as small, rugged and ideal platform for implementing users’ AI solutions of smart transportation, factory automation and telemedicine applications. Specification 11th Intel® Core™ SoC Processor CPU 1 x DDR4 SODIMM Max. 32GB Independent display: HDMI, eDP 4 x Intel® GbE i219LM/i210IT LAN, 3 x USB 3.0 (Type A), 2 x USB 2.0, 2 x COM RS232/422/485, 4DI/4DO, 1 x M.2 B key Type 3042 (PCIe x2 / SATA / USB 3.0 / 2.0), 1 x Nano SIM 1 x M.2 M key Type 2242 (PCIe x4 / SATA), Supports NVMe SSD TPM 2.0 (firmware; OEM optional to Hardware TPM) DC IN +12V