Shenzhen Seavo (China) Technology Co., Ltd.
Titanium Partner | Shenzhen Seavo (China) Technology Co., Ltd.'s Website
Offerings
Offering
4 Intel® GbE LAN, 8 USB 3.0, 4 COM. 2 SATA 3.0, 1 mSATA, 1 Mini-PCIe, 1 M.2. Supports Dual display of DVI-D and HDMI.
Offering
2 Intel® GbE LAN, 8 USB 3.0, 5 USB 2.0, 6 COM. 2 PCIe x16, 4 PCIe x4, 1 PCI. 1 VGA, 1 HDMI, 1 DVI, 1 eDP.
Offering
Support DDR5 memory, 2 SO-DIMM, up to 64GB. Provide 2 Intel® GbE, 5 USB 3.2. 3 M.2, support PCIe x4 NVMe, Wifi+BT, 4G/5G. 3 DP, 1 HDMI, 1 LVDS. CPU at the solder side, DC 12V power input.
Offering
6 COM, 3 USB 3.0, 7 USB 2.0, 2 Intel GbE LAN. 1 Mini-PCIe, 2 M.2, support mSATA, NVMe, 4G/5G. Supports Triple display of 2 HDMI and 1 LVDS/eDP. CPU at the solder side of M/B for fanless heat dissipation. 3.5'', DC 12V Power Input.
Offering
DDR5 memory, 2 SO-DIMM, up to 64GB. 2 Intel® GbE LAN, 6 USB 3.0, 7 USB 2.0, 6 COM. 1 PCIe x4, 3 M.2, support Wifi+BT, 5G, SATA, etc. Supports Triple display of 2 HDMI, 1 LVDS/eDP. Thin Mini-ITX, DC 12V Power Input
Offering
6 COM, 4 USB 3.0, 7 USB 2.0, 1 GbE LAN. 3 M.2, support Wifi+BT, 4G/5G, SATA. Supports Triple display of 1 HDMI, 1 eDP and 1 LVDS/eDP. Thin Mini-ITX, DC 12V Power Input.
Offering
6 DIMM, up to 6x64GB Memory, support ECC. BMC on board, support IPMI. 4 PCIe x16, 3 PCIe x4, 3 Intel® GbE LAN, 4 SATA 3.0, 1 Slim-SAS 8i, 1 Slim-SAS 4i
Offering
KPMU 2.0 (Kiosk Peripherals Management Utility). 6 USB 3.0, 7 USB 2.0, 10 COM, 2 GbE LAN. Supports Dual display of VGA and HDMI. 1 PCIe x16, 2 M.2 support Wifi/BT/SSD/4G/5G.
Offering
IEN (Industrial Edge Node) modular design type-F. 2 Intel GbE LAN, 6 USB 3.0, 6 COM, 2 HDMI, 2 CAN. 1 Mini-PCIe, 3 M.2. 2 HDMI, 1 LVDS/eDP. DC 9-36V Power Input
Offering
Flexibly select Seavo SCM-C computing module to meet the need of edge computing 2 GbE, 2 USB 3.0, 2 USB 2.0, 3 COM, 1 HDMI, 8 GPIO 3 M.2, support 5G/4G, WiFi+BT, SATA SSD Provide AI development Toolkit 143 96 43mm compact size, DC 12-28V input
Offering
6 COM, 4 USB 3.0, 5 USB 2.0, 2 Intel GbE LAN. 3 M.2, support 1 SATA, 1 Wifi/BT, 1 4G/5G. Supports Triple display of 2 HDMI and 1 LVDS/eDP. CPU at the solder side of M/B for fanless heat dissipation. 3.5'', DC 12V Power Input.
Offering
5 USB 3.0, 8 USB 2.0, 1 GbE LAN, 4 SATA 3.0. Supports Triple display of VGA, HDMI, DVI and DP. 1 PCIe x16, 1 PCIe x4, 1 PCIe x1, 1 M.2. Supports vPro, AMT, RAID, TPM 2.0.
Offering
4GB LPDDR4 Memory, 64GB eMMC on board. 1 GbE LAN, 1 Wifi+BT, 1 4G, 1 M.2 SATA. 2 USB 3.0, 9 USB 2.0, 6 COM, 1 RJ11 Cash Drawer Control. 1 MIPI, 2 LVDS/eDP, 1 HDMI+USB/eDP (Type-C/Header). DC 12/24V Power Input.
Offering
4 SATA 3.0, 1 mSATA, 1 CF. 1 PCIe x8, 4 PCIe x4. 4 GbE SFP, 2 RS232, 1 USB 3.0, 16 GPIO.
Offering
5 GbE LAN, support 4 POE. Up to 6 USB 3.0, 6 COM, 2 SATA 3.0, 1 Mini-PCIe. PCIe x16 gold finger for PCIe/PCI expansion module. Supports Dual display of VGA and HDMI.
Offering
3 PCIe x8, 2 SATA 3.0, 16 GPIO Provide a LAN module with 8 GbE LAN DC 12V Power Input
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16 DIMM, up to 2TB memory, support ECC. BMC on board, supports IPMI. 4 PCIe x16, 1 PCIe x8, 2x10G LAN. 14 SATA 3.0, 1 M.2.
Offering
2 GbE LAN, 6 USB 3.0, 6 COM, 2 HDMI. 2 M.2, 1 Mini-PCIe, Support WiFi/4G, SATA. 3.5'', CPU at the solder side of M/B, DC 12V Power Input.
Offering
2 GbE LAN, 6 USB 3.0, 7 USB 2.0, 6 COM. Supports Triple display of 1 VGA, 1 HDMI, 1 DVI, 1 eDP. 2 PCIe x16, 3 PCIe x4, 2 PCI. Supports vPro, AMT, RAID, TPM 2.0.
Offering
5 GbE LAN, support 4 POE. 4 USB 3.0, 2 COM, 1 HDMI, 1 LVDS/eDP. 3 M.2, PCIe x4 NVMe SSD, 4G/5G, WIFI+BT. Industrial Edge Node (IEN) design to help improve the flexibility and of I/O customization.
Offering
Support DDR5 memory, 2 SO-DIMM, up to 64GB. Provide 2 Intel® GbE, 5 USB 3.2 Gen2. Provide 3 M.2, support PCIe x4 NVMe, Wifi+BT, 4G/5G. Provide 3 DP, 1 HDMI, 1 LVDS.