Intel has announced plans to build a new state-of-the-art semiconductor assembly and test facility near Wrocław, Poland. The company plans to invest as much as $4.6 billion in the facility, which will help meet critical demand for assembly and test capacity.
Intel’s planned investment in Poland adds to Intel’s current and future plans for Europe, including its existing wafer fabrication facility in Leixlip, Ireland and its planned wafer fabrication facility in Magdeburg, Germany. Combined, these facilities will help create an end-to-end leading-edge semiconductor manufacturing value chain across Europe. It will also serve as a catalyst for additional ecosystem investments and innovation in Poland and the European Union.
Intel’s plans across Europe will help boost production to meet the surging demand for advanced semiconductors, powering a new generation of innovative products from Intel and serving the needs of foundry customers as part of Intel’s IDM 2.0 strategy.