Intel Celebrates Manufacturing Day

Today is Manufacturing Day, an annual celebration to showcase the promise of modern manufacturing locally, nationally and globally.

author-image

By

What’s New: Today is Manufacturing Day, an annual celebration to showcase the promise of modern manufacturing locally, nationally and globally. Since Intel’s founding more than 50 years ago, company leaders have been inspired by Moore’s Law to invent and manufacture world-changing technology that enables global progress and enriches the lives of every person on Earth. As Intel works to capitalize on the largest opportunity in its history, the company is investing in and expanding manufacturing facilities around the world.

“For decades, Intel has been a worldwide leader in semiconductor manufacturing. On this Manufacturing Day, I want to recognize the efforts of tens of thousands of Intel team members around the world who are going above and beyond every day to support the growing demands of our customers, while ensuring the highest safety and quality standards during this pandemic period. Their work is truly remarkable.”
–Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations

Why It Matters: Intel is one of only three companies manufacturing at the leading-edge of semiconductor technology. Intel’s integrated design and manufacturing model provides a competitive advantage because of the strong connection across manufacturing, architecture, process design and packaging technologies.

As a global leader in semiconductor R&D and manufacturing, Intel creates technology that is at the foundation of modern life — powering homes, vehicles, healthcare, communication networks and even other manufacturers.

How It Works: Today, Intel operates six wafer fabrication sites around the world, comprising 4 million square feet of “clean room.” Among the most modern and complex manufacturing operations ever built, these sites complete hundreds of steps to turn raw silicon wafers into discs of hundreds of ”dies,” or individual computer chips. These discs are sent to our four assembly test locations, where the dies are separated, tested and packaged in protective materials so customers can integrate them into their own products.