Semiconductor manufacturers need to optimize beyond traditional foundry models. Intel Foundry combines world-class process nodes, industry-leading packaging technologies, and a rich portfolio of semiconductor and systems IP. Here are a few reasons to work with Intel Foundry.
1. A systems foundry approach
Now you can work with one semiconductor provider that meets the full breadth of your needs. Intel Foundry is the world’s first “systems foundry”—a full-stack approach that integrates chip and systems IP, process nodes, and advanced packaging and test, plus Systems Acceleration Services for architecture and design to help bring it all together. We can take you from initial specifications to finished devices and deliver it all at global scale.
2. We’re flexible
Intel Foundry is open and flexible. Bring your own tooling, designers, and EDA partners. Mix and match our services with preferred vendors, or rely on us for your entire project. Work with us at any point in your process: design with us, fab with us, or send us dies to package and test.
40+ ecosystem partners
3. Design with any architecture or IP your business needs
Our fabs are ready to produce ARM, RISC-V, x86, and custom ASICs. We also partner with leading industry design firms to better support your existing processes and capabilities.
4. Equipped and optimized for the AI era
Our tooling, process nodes, and packaging technologies are optimized for the industrial production of complex system-on-chip designs, including those designed to run AI workloads across the performance spectrum.
5. Build on leading process technologies
Intel 18A process technology is ready for design and scheduled for volume production in 2025. Intel 18A introduces major process advances that expand performance beyond traditional node scaling.
Intel 18A advances
3D RibbonFET gate-all-around (GAA) transistors
New transistor architecture delivers faster switching speeds, improved performance per watt, enhanced electrostatic control, and greater efficiency compared to traditional FinFET designs.
PowerVia backside power
Moves power delivery to the backside of the die, reducing interconnect congestion, lowering IR drop, and improving power efficiency, enabling higher performance in advanced chips.
Omni MIM
Intel's differentiated high-density metal-insulator-metal capacitors, called Omni MIM, enable ultra-high-density on-die decoupling capacitance, significantly reducing inductive power droop and enhancing power stability—crucial for modern workloads like AI.
6. Advanced chiplet packaging
Intel Foundry is a leading producer of 2.5D packages with more than 100 2.5D products in volume production. Our advanced, 3D packaging techniques deliver complex systems of chips that increase density and performance for AI accelerators.
7. Rigorous testing, high yields
Advanced, multi-stage testing eliminates faulty dies early in the process, ensuring only known good dies advance to packaging and testing.
8. Resilient, secure supply chain
We maintain a robust, global pipeline for everything from raw silica to finished components. We have fabs on three continents, and we’re investing in capacity around the world.1 We help lead and shape industry best practices in securing our supply chain through contributions to numerous organizations and initiatives.
9. We're committed to sustainable semiconductor manufacturing
We’re committed and on track to reducing our environmental, energy, and waste footprints.
98% global renewable electricity
Intel reached 98% global renewable electricity across global operations in 2024.2
Net positive water in the United States, India, Mexico, and Costa Rica
In 2024, Intel helped conserve approximately 10.5 billion gallons of water and enabled restoration of 2.9 billion gallons.3
66% of our manufacturing waste is reused, recovered, or recycled
Intel upcycled approximately 87,100 tons of manufacturing waste in 2024.4
70% lower greenhouse gas emissions
Our greenhouse gas emissions peaked in 2006 and have dropped 70% since.5
10. A long legacy of innovation
Intel commercialized the semiconductor 50 years ago, and we haven’t stopped innovating and scaling since. Now we’re sharing all of our expertise and advancing Moore’s Law for the entire industry.