EDA Alliance
Electronic Design Automation (EDA) suppliers produce tools that assist in the specification, planning, design, verification, implementation, and test of electronic systems.
Accelerating Time to Market with Leading EDA Partners
EDA tools ensure the delivery of the required performance, power, area, and density, verify the designs will meet manufacturing process requirements, and help monitor the performance of the device from post-manufacturing test to deployment in the field.
The Intel Foundry Accelerator - EDA Alliance gathers the industry’s leading EDA partners. Our EDA Alliance partners get early access to Intel’s process technologies, allowing these partners to co-optimize tools and flows to best realize Intel’s technology capabilities. This enables customers to achieve their performance, power, and area (PPA) goals, and accelerate their time to market. Intel Foundry Accelerator EDA suites support a full spectrum of design activities, including DTCO (Design Technology Co-Optimization), STCO (System Technology Co-Optimization), design, simulation, library characterization, and signoff.
The EDA Alliance covers all aspects of designing modern SoCs, chiplets, tiles, and packages, and integrating them using advanced assembly technologies.
Latest Buzz
"Synopsys’ long-standing strategic collaboration with Intel provides our mutual customers with certified AI-driven EDA flows and IP to expedite their multi-die design success. The combination of Synopsys 3DIC Compiler, a unified exploration to signoff platform, and Synopsys UCIe IP solutions will power innovation utilizing Intel Foundry Services angstrom-scale 18A process and multi-die packaging technologies."
Shankar Krishnamoorthy
General Manager of the Synopsys EDA Group
"Ansys has collaborated with Intel Foundry Services at the leading edge of 3D manufacturing technology to solve complex multiphysics challenges and meet stringent thermal, mechanical, performance, and reliability requirements. Ansys’ multiphysics signoff platform gives our mutual customers the flexibility to adopt EMIB technology for their system architecture and assemble the best-in-class solutions for higher performance products and a smooth user experience.”
John Lee
Vice President and General Manager
of the electronics, semiconductor, and optics business unit at Ansys
“As IC design teams around the world turn to advanced packaging strategies to address increasingly stringent power, performance, and area footprint requirements, IFS’ EMIB platform delivers the kind of innovation the industry needs right now. Siemens EDA is proud that our Calibre® nmPlatform, Xpedition™, and HyperLynx™ software solutions are key components of IFS’ 3D-IC design flow. Moreover, the fact both Siemens EDA and IFS’ EMIB offering support the 3Dblox standard language is beneficial to the entire semiconductor ecosystem.”
Mike Ellow
Executive Vice President for Siemens EDA
“As more designers turn to multi-chiplet architectures and advanced packaging, there’s more emphasis put on having the right design tools and methodologies. The Cadence collaboration with Intel helps streamline this transition to heterogeneous integrated solutions by offering an EMIB-certified reference flow. This optimized flow empowers our joint customers to swiftly navigate the complexities of modern electronics design in the fast-paced tech market.”
Michael Jackson
Corporate Vice President of research and development,
Custom IC and PCB Group at Cadence
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