Overview
Intel® Trust Domain Extensions (Intel® TDX) is introducing new, architectural elements to help deploy hardware-isolated, virtual machines (VMs) called trust domains (TDs). Intel TDX is designed to isolate VMs from the virtual-machine manager (VMM)/hypervisor and any other non-TD software on the platform to protect TDs from a broad range of software. These hardware-isolated TDs include:
- Secure-Arbitration Mode (SEAM) – a new mode of the CPU designed to host an Intel-provided, digitally-signed, security-services module called the Intel TDX module.
- Shared bit in GPA to help allow TD to access shared memory.
- Secure EPT to help translate private GPA to provide address-translation integrity and to prevent TD-code fetches from shared memory. Encryption and integrity protection of private-memory access using a TD-private key is the goal.
- Physical-address-metadata table (PAMT) to help track page allocation, page initialization, and TLB consistency.
- Intel® Total Memory Encryption-Multi Key (Intel TME-MK) engine designed to provide memory encryption using AES-128- XTS and integrity using 28-bit MAC and a TD-ownership bit.
- Remote attestation designed to provide evidence of TD executing on a genuine, Intel TDX system and its TCB version.
Intel TDX White Papers and Specifications – Common
Document | Description | Date |
---|---|---|
Intel® Trust Domain Extensions (Intel® TDX) | An introductory overview of the Intel TDX technology. | February 2023 |
Intel® CPU Architectural Extensions Specification | A specification of Intel CPU architectural support for Intel TDX. | May 2021 |
Intel® TDX Loader Interface Specification | A specification of how a VMM loads the Intel TDX Module on a platform. | March 2022 |
Intel® TDX Virtual Firmware Design Guide | A design guide on how to design and implement a virtual firmware for a trust domain. | December 2022 |
Intel TDX 1.0 White Papers and Specifications
Document | Description | Date |
---|---|---|
Intel® TDX Module 1.0 Specification | Architecture and Application Binary Interface (ABI) Specification of the Intel TDX Module. | February 2023 |
Intel® TDX Guest-Hypervisor Communication Interface | Specification of the software interface between the Guest OS (Tenant) and the VMM required for enabling Intel® TDX 1.0 | March 2023 |
Intel TDX 1.5 White Papers and Specifications
Intel® TDX Version 1.5 extends TDX to introduce Live Migration and TD Partitioning for TD VMs and related support for Service TDs.
Document | Description | Date |
---|---|---|
Intel® TDX Module v1.5 Base Architecture Specification | Overview and base architecture specification of the Intel TDX Module version 1.5 | March 2023 |
Intel® TDX Module v1.5 TD Migration Architecture Specification | Overview and architecture specification of the TD Migration feature of the Intel TDX Module version 1.5 | March 2023 |
Intel® TDX Module v1.5 TD Partitioning Architecture Specification | Overview and Architecture Specification for TD partitioning of the TDX Module version 1.5 | March 2023 |
Intel® TDX Module v1.5 ABI Specification | Application Binary Interface (ABI) specification of the Intel TDX Module version 1.5 | March 2023 |
Intel® TDX Module Incompatibilities between v1.0 and v1.5 | Description of the incompatibilities between TDX 1.0 and TDX 1.4/1.5 that may impact the host VMM and/or guest TDs | March 2023 |
Intel® TDX Guest-Hypervisor Communication Interface v1.5 | Specification of the software interface between the Guest OS (Tenant and Service TD VMs) and the VMM required for enabling Intel TDX version 1.5 | March 2023 |
Intel® TDX Migration TD Design Guide | A design guide on how to design and implement a Migration TD for TDX 1.5 Live migration. | March 2023 |
Intel TDX Connect Whitepapers and Specifications
Intel® TDX Version 2.0 extends TDX to support Trusted Execution Environment for device I/O (TEE-IO).
Document | Description | Date |
---|---|---|
Intel® TDX Connect Architecture Specification | Overview and architecture specification for TDX Connect | March 2023 |
Intel® TDX Connect TEE-IO Device Guide | An introductory overview on how to build TEE-IO device for confidential computing compliant with PCIe TDISP 1.0 and compatible with Intel® TDX Connect | February 2023 |
Device Attestation Model in Confidential Computing Environment | An introductory overview of the device attestation in confidential computing. | February 2023 |
Software Enabling for Intel® TDX in Support of TEE-IO | White paper to introduce how to enable software for Intel TDX with TEE-IO device. | September 2022 |
Intel TDX Source Code
TDX Loader Source Code
Source Code | Version | Description | Date |
---|---|---|---|
Intel® TDX Loader | TDX 1.0 |
|
August 2022 |
Intel® TDX Loader | TDX 1.5 |
|
February 2023 |
TDX Module Source Code
Source Code | Version | Description | Date |
---|---|---|---|
Intel® TDX Module | TDX 1.0 |
|
August 2022 |
Intel® TDX Module | TDX 1.0.3 |
|
February 2023 |
Intel® TDX Module | TDX 1.5 Beta |
|
May 2023 |
Security issues should be responsibly disclosed to Intel PSIRT. See more info here
Intel TDX Security Guidance
Page | Date |
---|---|
Intel® TDX Guidance for Developers | March 2023 |
Intel® TDX Guest Kernel Hardening Documentation | March 2023 |