Package Ball Coordinates and Land Pattern Guidance for Agilex™ 5 E-Series B23B (795) Package

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Agilex™ 5 FPGA D-Series and E-Series Agilex™ 5 E-Series FPGA and SoC FPGA Support Printed Circuit Board Design Resources for FPGAs

838752
2025-05-06
Public

Description

Package Ball Coordinates are spreadsheet documents that provide the X and Y location of the balls for the stated package and are used to generate tool-specific PCB Footprints. Land Pattern and Stencil recommendations are also provided.

Usage instructions