AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices

Description

This application note provides guidelines for handling J-Lead, Quad Flat Pack (QFP), and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA packaging) devices to preserve the quality of these devices during storage, shipment, and transfer and to ensure easier soldering.