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Description
Intel Agilex® 7 I-Series and F-Series Device - Package Ball Coordinates are spreadsheet documents that provide the X and Y location of the balls for the stated package and are used to generate tool-specific PCB Footprints. For:
- AGIB022R31A,
- AGIB027R31A,
- AGIB019R31B, AGID019R31B,
- AGIB022R31B,
- AGIB023R31B, AGID023R31B,
- AGIB027R31B,
- AGIB041R31B, AGIC041R31B, AGID041R31B,
- AGFA019R31C, AGFB019R31C, AGFC019R31C, AGFD019R31C,
- AGFA022R31C, AGFB022R31C,
- AGFA023R31C, AGFB023R31C, AGFC023R31C, AGFD023R31C,
- AGFA027R31C, AGFB027R31C