White Paper: A team of Intel engineers presents a flow used to design and validate the microarchitecture of a packet-processing module for Intel® chipsets, based on models captured using Intel® CoFluent™ studio system-level modeling and simulation.
Gain SDN and NFV benefits on open, flexible, and high-performance infrastructure for evolving demands.
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Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
New features and capabilities help improve performance, energy efficiency, and security.