Processors
Desktop
ATX Install Instructions for Boxed Intel® Desktop Processors in the 775-Land pkg

The following overview and installation instructions are for professional system integrators building ATX form factor PCs that use Boxed Intel® processors in the 775-land package with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. An integration video is also available to help system integrators accurately build systems based on boxed Intel processors.

Table of contents

Handling procedures:
Boxed processor installation:
Boxed processor removal:



Motherboard handling
  1. Remove motherboard from ESD bag (if applicable).
  2. Make sure socket load lever and load plate are secured. Do not open socket at this time.
  3. Inspect to ensure socket protective cover is present and properly secured. Do not remove socket protective cover.
  4. Do not touch socket sensitive contacts (see image below).
    Motherboard handling image


Socket preparation
A. Opening the socket (see image below):

Opening socket image

Note Apply pressure to corner with right-hand thumb when opening or closing load lever - otherwise lever will bounce back (as a mouse trap) causing bent contacts.


  1. Disengage load lever by releasing down and out on the hook. This will clear retention tab.
  2. Rotate load lever to open position at approximately 135°.
  3. Rotate load plate to open position at approximately 100°.



B. Removing the socket protective cover (see image below):

Removing socket cover image

Note Do not hold the load plate as a lever, but rather hold tab with left hand while removing the protective cover with right.

  1. While supporting the load plate's edge with left-hand index finger and thumb, engage protective cover finger tab with right hand thumb. When removing, peel the cover from the LGA775 socket while pressing on center.
  2. Set protective cover aside. Always put cover back on if the processor is removed from the socket.
  3. Inspect protective cover for damage. If damage is observed, replace the cover.
  4. After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may be removed with compressed air.
Note Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.

C. Inspecting for bent contacts:

Inspect socket contacts from different angles to make sure none are damaged. If any are do not use motherboard. (Since labs use non-operational systems, damaged sockets can be used.)

Note If any socket or motherboard is suspected of being mishandled, the socket should be examined.


Five types of contact damage to look for (see Table 1 for potential causes and solutions):

  1. Contact is bent backwards upon itself (see Figure 1).
  2. Contact is bent forward or downward (see Figure 2).
  3. Contact is bent sideways (see Figure 3).
  4. Contact tip is bent up (see Figure 4).
  5. Contact tip is missing (same as Figure 4).
Figure 1. Contact is bent backwards upon itself
Figure 1
Figure 2. Contact is bent forward or downward
Figure 2
Figure 3. Contact is bent sideways
Figure 3
Figure 4. Contact tip is bent up or missing
Figure 4

Table 1: Bent Contact Causes and Corrective Actions

Failure Type Potential causes Possible Corrective Action
1,5
  • CPU tilted during installation or removal
  • Glove/finger snag
  • Verify CPUs are installed and removed vertically ONLY
  • Vacuum wands may be considered
  • Verify CPUs are being held by the substrate edge ONLY
1,5
  • Glove/finger snag
  • CPU capacitors dragging
  • Verify packages are held by substrate edges ONLY
  • Verify CPUs are lifted and placed vertically ONLY
  • Vacuum wands may be considered
2
  • CPU tilted during installation or removal
  • CPU dragged across contacts during installation or removal
  • CPU dropped during installation or removal
  • Socket protective cover dropped into socket
  • Verify packages are held by substrate edges ONLY
  • Verify CPUs are lifted and placed vertically ONLY
  • Vacuum wands may be considered
3
  • CPU tilted during installation or removal
  • CPU dragged across contact array
  • Glove/finger snag
  • Verify packages are held by substrate edges ONLY
  • Verify CPUs are lifted and places vertically ONLY
  • Vacuum wands may be considered
4
  • Socket supplier defect
  • Glove/finger snag
  • CPU capacitors dragging
  • Return motherboard to manufacture
  • Verify packages are held by substrate edges ONLY
  • Verify CPUs are lifted and places vertically ONLY
  • Vacuum wands may be considered


Boxed Intel® processor installation

  • Processor handling
  • Processor installation
  • Fan heatsink handling
  • Fan heatsink installation
    Install the processor and fan heatsink in the following manner. Use this in accompaniment with the manual provided.

    A. Processor handling:
    1. Open boxed processor packaging.
    2. Inspect to ensure processor protective cover is present and properly secured. Do not remove processor protective cover.

      Caution
      DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION (see image below).


      Processor handling image
    B. Processor installation:

    1. Lift processor package from shipping media by grasping the substrate.
    2. Position processor package so that the Connection 1 Indicator triangle mark is on bottom left. Both key notches should be on left side.
    3. Remove protective cover by pressing retention tab and peeling the cover away (see image below).

      Processor installation image
    4. Set protective cover aside. Keep the protective side-cover on the processor when not in the socket.
    5. Scan the processor package gold pads for any presence of foreign material. If necessary, the gold pads can be wiped clean with a soft lint-free cloth and isopropyl alcohol.
    6. Locate Connection 1 Indicator and the two Orientation Notches (see image below).

      Processor installation image
    7. Grasp the processor with thumb and index finger. (Do not touch the Orientation Notches.) The socket will have cutouts for your fingers to fit into (see image below).

      Processor installation image
    8. Carefully place the package into the socket body vertically (see image below).

      Caution
      Do not use a vacuum pen for installation.


      Processor installation image
    9. Verify that package is within the socket body and properly connected to orientation keys.
    10. Close the socket (see image below):

      Processor installation image

      1. Close the load plate.
      2. Press down lightly on load plate, while engaging the load lever.
      3. Secure load lever with load plate tab under load lever retention tab.
    C. Fan heatsink handling:
    1. To prevent damage, avoid setting the thermal solution with the prongs down.
    2. Set on side or with fan down (see image below).

      Fan heatsink handling image


    D. Fan heatsink installation:

    Note The thermal solution integration procedures should be performed with the motherboard in the chassis to provide proper clearance under the motherboard for the fastener mechanisms.
    1. Install the motherboard into the chassis.
      Note Thermal solutions that come with Boxed Intel® processor use preapplied thermal interface material (TIM) and do not need grease.


      Caution
      Do not to touch or disturb the TIM on the heatsink during installation. If the TIM is disturbed contact customer support.

    2. Remove heatsink from packaging.
    3. Place heatsink onto the LGA775 socket (see image below).
      Fan heatsink installation image

    4. Ensure fan cables are on side closest to fan header.
    5. Align fasteners with MB through-holes.
    6. Make sure fasteners are flush with motherboard with the following steps (see image below).
      Fan heatsink installation image

      1. Inspection 1:

        a. Ensure cables are not trapped or interfering with fasteners.
        b. Ensure fastener slots are pointing perpendicular to heatsink (see image below).
        Fan heatsink installation image

      2. Actuate fasteners (see image below):
        Fan heatsink installation image

        a. While holding heatsink, press down on fastener caps with thumb to install and lock.
        b. Repeat with remaining fasteners.
      3. Inspection 2 (see image below):
        Fan heatsink installation image

        a. Pull on fasteners to verify they are properly seated.
        b. Ensure both fastener cap and base are flush with spring and motherboard and MB.
    7. Connect fan cable to Board CPU header (see image below).



    8. Secure excess cable with tie-wrap to ensure cable does not interfere with fan operation or contact other components.


    Maintaining and upgrading systems based on Intel® processors in the 775-land package


    A. Boxed processor removal:

    Every time the heatsink is removed from the processor, it is critical that the thermal interface material be replaced, in order to ensure proper thermal transfer to the boxed processor fan heatsink.

    Note Be sure to take the proper electrostatic discharge (ESD) precautions (ground straps, gloves, ESD mats, or other protective measures) to avoid damaging the processor and other electrical components in the system.



    Caution
    If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands, and take care to keep your hands away from any metal edges on the chassis when removing components.

    B. Thermal interface material attached to the heatsink:

    Intel does not recommend the removal of the thermal interface material located on the bottom of the boxed processor fan heatsink. Removal of this material may cause damage to the processor and will void the boxed processor warranty. If you must remove and re-use the fan heatsink, it will require replacement. Also, if the thermal interface material is at all damaged, you must also replace the fan heatsink. Contact Intel Customer Support to receive a replacement fan heatsink.

    C. Removing the boxed processor fan heatsink:

    Follow these steps to remove the boxed processor fan heatsink from the system (see image below):

    1. Disconnect fan cable from motherboard header.
    2. Turn fastener caps (1) counter-clock wise 90° to the unlocked position. (You may need to use a flathead screwdriver to unlock the fasteners.)
    3. Pull up on fastener caps to unseat.
    4. Manually remove heatsink with gentle twisting motion.

      Removing heatsink image
    Note To reassemble the heatsink, reset the fastener caps to their original position with the slot perpendicular to the heatsink. Reattach cable to cable management clips. Then, follow the assembly instructions (see image below).


    Removing heatsink image 




    D. Removing the processor:

    1. Open the socket:

      • Disengage the load lever.
      • Open the load plate.

    2. Pick up FC-LGA4 processor package:
      Note You may use a vacuum pen to remove the processor.


      • By hand: Grasp processor with index finger to hold the load plate hinge side, while thumb presses load lever side (see image below).

        Removing processor image 

      • By vacuum pen: Place a minimum 9mm cup at the approximate center of the Integrated Heat Spreader (IHS). The IHS is the metal portion on top of the processor.

        Note a. Do not place vacuum pen on IHS edge, due to risk of dropping processor and causing bent contacts.
        b. Do not use vacuum pen for inserting CPU.


    3. Lift the package straight up and away.
    4. Assemble processor's protective cover immediately to prevent contamination:

      • While holding the processor by three corners (see left image below), with the other hand lift processor cover by grasping at the large retention tabs (see right image below). Ensure retention tabs and processor contacts are pointing to each other.

        Removing processor image Removing processor image

      • Orient so the protective cover chamfer is matching with package connection 1 location (see right image above).
      • Hook the first large retention tab on the processor substrate. Then press the opposite tab onto the processor.
      • Place processor with land side cover installed onto proper shipping media or other ESD approved work surface.


    5. Visually inspect socket contacts:

      • Inspection 1:

        a. Scan socket contact array at varying angles noting the presence of any foreign material.
        b. If foreign material can't be blown off by compressed air, or mechanical damage (see Five types of socket contact damage - types 1 and 4) observed, reject the motherboard for further evaluation or socket replacement.

      • Inspection 2:

        a. Look two more times down the rows and columns of each of the four sides of the socket to ensure all contacts within the array are inspected.
        b. Inspect for type 2, 3, and 5 failures (see Inspecting for bent contacts).


    6. Assemble LGA775 socket protective cover:

    7. Hook protective cover back onto load plate, attaching bottom first, then clip thumb tab (see image below).

      Removing processor image

    8. Close the socket load plate and engage the load lever (see image below).

      Removing processor image

    • This applies to:

      Intel® Celeron® Desktop Processor
      Intel® Core™2 Duo Desktop Processor
      Intel® Core™2 Extreme Processor
      Intel® Core™2 Quad Processor
      Intel® Pentium® 4 Processor Extreme Edition
      Intel® Pentium® 4 Processors
      Intel® Pentium® D Processor
      Intel® Pentium® Processor Extreme Edition

      Solution ID: CS-031426
      Last Modified: 23-Sep-2013
      Date Created: 22-Feb-2010
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