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System Memory Features The board has four DIMM sockets and supports the following memory features:
- 2.6 V (only) DDR SDRAM DIMMs with gold-plated contacts
- Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.
- 4 GB maximum total system memory
- Minimum total system memory: 128 MB
- Non-ECC DIMMs
- Serial Presence Detect
- DDR 400 MHz and DDR 333 MHz SDRAM DIMMs
Note To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Integrator's Note It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory, however, only 4 GB of address space is available.
Supported system bus frequency and memory speed combinations
| To use this type of DIMM... |
The processor's system bus frequency must be... |
| DDR 400 |
800 MHz |
| DDR 333 (Note) |
800 or 533 MHz | | Note: When using an 800 MHz system bus frequency processor, DDR 333 memory is clocked at 320 MHz. This minimizes system latencies to optimize system throughput.
Supported DIMM Configurations
| DIMM Capacity |
Configuration |
SDRAM Density |
SDRAM Organization Front-side/Back-side |
Number of SDRAM Devices |
| 128 MB |
SS |
256 Mbit |
16 M x 16/empty |
4 |
| 256 MB |
SS |
256 Mbit |
32 M x 8/empty |
8 |
| 256 MB |
SS |
512 Mbit |
32 M x 16/empty |
4 |
| 512 MB |
DS |
256 Mbit |
32 M x 8/32 M x 8 |
16 |
| 512 MB |
SS |
512 Mbit |
64 M x 8/empty |
8 |
| 512 MB |
SS |
1 Gbit |
64 M x 16/empty |
4 |
| 1024 MB |
DS |
512 Mbit |
64 M x 8/64 M x 8 |
16 |
| 1024 MB |
SS |
1 Gbit |
128 M x 8/empty |
8 |
| 2048 MB |
DS |
1 Gbit |
128 M x 8/128 M x 8 |
16 | | Note In the second column, "DS" refers to double-sided memory modules (containing two rows of SDRAM) and "SS" refers to single-sided memory modules (containing one row of SDRAM).
Tested Memory
Vendor Self Tested Memory Intel supplies the memory vendors that participate in this program with a common memory test plan to use as a basic checkout of the memory stability. Memory listed here was either tested by the memory vendor or by Intel using this test plan. These part numbers may not be readily available throughout the product life cycle.
The table below lists parts which passed testing conducted using Intel's Self Test program for Intel® Desktop Board D915GVWB. For a complete explanation of the self test see the Desktop Board Component Functional Testing Levels page.
Module Supplier Module Part Number |
Module Size (MB) |
Module Speed (MHz) |
Latency CL-tRCD-tRP |
ECC or Non-ECC? |
DIMM Organization |
Module Date Code |
Component Used Comp Part Number |
A-DATA* MDOEL6F3G31Y0D1E0Z |
256 MB |
400 |
3-4-4 |
Non-ECC |
SSx8 |
0527 |
Elpida* DDR-DD2508ARTA |
A-DATA MDOHY6F3G3X10BZE0Z |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
510A |
Hynix* DDR-HY5DU56822DT-D43 |
Infineon Technologies* HYS64D128320HU-5-B |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0445 |
Infineon Technologies HYB25D512800BE-5 |
Infineon Technologies HYS64D64320HU-5-C |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0436 |
Infineon Technologies HYB25D512800CE-5 |
Infineon Technologies HYS64D32300HU-5-C |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0432 |
Infineon Technologies HYB25D512800CE-5 |
Kingston Technology* KVR400X64C3A/1G |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0518 |
Infineon HYB25D512800BE-5 |
Kingston Technology KVR400X64C3A/1G |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
449 |
Samsung* K4H510838B-TCCC |
Kingston Technology KVR400X64C3A/512 |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0518 |
Micron* MT46V64M8-5B |
Kingston Technology KVR400X64C3A/512 |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0000 |
Samsung K4H560838F-TCCC |
Kingston Technology KVR400X64C3A/256 |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0000 |
Promos* V58C2256804SCT5B |
Micron MT16VDDT12864AY-40BD3 |
1024 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0528 |
Micron MT46V64M8P |
Micron MT16VDDF6464AY-40BG1 |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0540 |
Micron MT46V32M8BG |
Micron MT8VDDT6464AG-40BD1 |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0534 |
Micron MT46V64M8TG |
Micron MT16VDDT6464AG-40BG4 |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0508 |
Micron MT46V32M8TG |
Micron MT16VDDT6464AG-40BG5 |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0535 |
Micron MT46V32M8TG |
Micron MT8VDDT6464AG-40BD3 |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0523 |
Micron MT46V64M8TG |
Micron MT8VDDT6464AY-40BD3 |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0534 |
Micron MT46V64M8P |
Micron MT8VDDT3264AG-40BG6 |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0536 |
Micron MT46V32M8TG |
Micron MT8VDDT3264AG-40BG5 |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0533 |
Micron MT46V32M8TG |
Micron MT8VDDF3264AY-40BG1 |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0540 |
Micron MT46V32M8BG |
Samsung M368L2923DUN-CCC |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0540 |
Samsung K4H510838D-UCCC |
Samsung M368L2923CUN-CCC |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0509 |
Samsung K4H510838C-UCCC |
Samsung M368L6523DUD-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0549 |
Samsung K4H510838D-UCCC |
Samsung M368L6423ETN-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0509 |
Samsung K4H560838E-TCCC |
Samsung M368L6423FTN-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0506 |
Samsung K4H560838F-TCCC |
Samsung M368L6523CUS-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0503 |
Samsung K4H510838C-UCCC |
Samsung M368L3223FTN-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0506 |
Samsung K4H560838F-TCCC |
Samsung M368L3324CUS-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx16 |
0506 |
Samsung K4H511638C-UCCC |
Samsung M368L3223ETN-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0506 |
Samsung K4H560838E-TCCC |
Infineon Technologies HYS64D128320HU-6-B |
1 GB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0434 |
Infineon Technologies HYB25D512800BE-6 |
Infineon Technologies HYS64D64320HU-6-C |
512 MB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0436 |
Infineon Technologies HYB25D512800CE-6 |
Infineon Technologies HYS64D32300HU-6-C |
256 MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0436 |
Infineon Technologies HYB25D512800CE-6 |
Micron MT16VDDT12864AG-335D1 |
1024 MB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0537 |
Micron MT46V64M8TG |
Micron MT8VDDT6464AG-335D1 |
512 MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0450 |
Micron MT46V64M8TG |
Micron MT16VDDT6464AG-335G4 |
512 MB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0408 |
Micron MT46V32M8TG |
Micron MT8VDDT3264AG-33G4 |
256 MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0540 |
Micron MT46V32M8TG |
Micron MT8VDDT3264AG-335G4 |
256 MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0450 |
Micron MT46V32M8TG |
Micron MT8VDDT3264AG-335G6 |
256 MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0513 |
Micron MT46V32M8TG |
Samsung M368L5623MTN-CB3 |
2 GB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0508 |
Samsung K4H1G0838M-TCB3 | | Updated: November 30, 2006
This applies to:
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