Intel® Xeon® Processor 7000 SequenceTechnical Documents

This application note explains how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools. By taking advantage of the CPUID instruction, software developers can create software applications and tools that can execute compatibly across the widest range of Intel processor generations and models, past, present, and future.

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Intel® Socket Test Technology for LGA771 has been developed to provide solder-joint and pin contact coverage for LGA771 sockets that have been assembled onto motherboards. This integrated silicon technology dramatically improves coverage (up to 90%), and enables motherboard makers to improve overall product quality and assembly process performance. This document includes the theory on which Intel® Socket Test Technology is based, typical test methods and device specifications.

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This document describes electrical, mechanical and thermal specifications of the Intel® Xeon® Processor 7000 Series product, designed for high-performance multiprocessor server and workstation applications.

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This document describes electrical, mechanical and thermal specifications of the Intel® Xeon® Processor 7100 Series product, designed for high-performance multiprocessor server and workstation applications.

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This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 7000 sequence. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel® Xeon® Processor 7000 Sequence Datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.

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This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 7100 series. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel® Xeon® Processor 7100 Series Datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document

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This document defines DC-to-DC converters designed to help meet the power requirements of the Intel® Xeon® processor 5000 sequence CPUs.

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This document provides functional, quality, reliability, and material requirements and design guidelines for the 604-pin socket used with Intel® Xeon® processors.

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This document is an update to the specifications in the Intel® 64 and IA-32 Architectures Software Developers Manuals Documents. This document is a compilation of documentation changes. It is intended for hardware system manufacturers and software developers of applications, operating systems, or tools.

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Describes the architecture and programming environment of processors supporting IA-32 and Intel® 64 Architectures.

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Describes the format of the instruction and provides reference pages for instructions (from A to M). This volume also contains the table of contents for both Volumes 2A and 2B.

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Provides reference pages for instructions (from N to Z). VMX instructions are treated in a separate chapter. This volume also contains the appendices and index support for Volumes 2A and 2B.

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Describes the operating-system support environment of an IA-32 and Intel® 64 architectures, including: memory management, protection, task management, interrupt and exception handling, multi-processor support, and thermal and power management features. This volume also contains the table of contents for both Volumes 3A and 3B.

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Continues the coverage on system programming subjects begun in Volume 3A. Volume 3B covers debugging, performance monitoring, system management mode, and Intel® Virtualization Technology (Intel® VT). This volume also contains the appendices and indexing support for Volumes 3A and 3B.

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Intel® 64 and IA-32 Architectures Optimization Reference Manual provides information on Intel® Core™ processors, Intel NetBurst® microarchitecture and other recent Intel® microarchitectures.

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The latest generation of platforms based on Intel® Xeon® processors brings an exciting new era of performance, reliability, and value for multi-processor servers.

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Increase MP performance with platforms based on the Intel® Xeon® processor 7000 sequence.

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When combined with the Intel® E8501 chipset and DDR2-400 memory, the scalable performance of the Intel® Xeon® processor 7100 series and enhanced reliability features of the chipset and memory create the ideal MP platform for enterprise workloads and virtualization.

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This document is a compilation of errata, specification clarifications and changes. It is intended for hardware system manufacturers and software developers of applications, operating systems and tools.

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The Intel® Xeon™ processor family features highly scalable performance, powered by the Intel NetBurst® microarchitecture with Hyper-Threading Technology. These technologies allow server applications to support more features, increase transaction throughput and response times, and serve more concurrent users.

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It takes a comprehensive strategy to scale data center capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® processor-based servers provide a critical new resource, by delivering leading performance, price/performance and energy-efficiency for a broad range of business applications.

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It takes a comprehensive strategy to scale high performance computing (HPC) capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® and Intel® Itanium® processor-based servers offer a critical new resource, delivering dramatic increases in performance, price/performance and energy-efficiency across a broad range of HPC applications.

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