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Installation Instructions for boxed Intel® Thermal Solution BXTS13X


Last Reviewed: 07-Jun-2016
Article ID: 000005785

Intel® Thermal Solution BXTS13X (PDF) icon
This manual has illustrated installation instructions for the boxed liquid-cooled Intel® Thermal Solution BXTS13X. This thermal solution supports LGA115x, LGA1366, LGA2011, LGA2011-v3 sockets. 

LGA115x refers to the LGA1156, LGA1155, and LGA1150 sockets. Instructions are the same for these sockets since the sockets and thermal solution footprint are the same.

Two packets of Thermal Interface Material (TIM) are supplied with this thermal solution since the TIM is not pre-applied.

See the Installation video for LGA2011 Processors and the BXRTS2011LQ Thermal Solution.

File name: TS13X_liquid_cooling_thermal_solution.pdf
Size: 3,017 KB
Date: September 2014

 

Related topics
Installation and integration of LGA2011 processors
How to apply Thermal Interface Material (TIM)
BXRTS2011LC thermal solution installation manual (LGA2011)