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Intel® E7520 and E7320 Chipset

Intel® E7520 and E7320 Chipset

The Intel® E7520 and E7320 chipsets, with Intel® dual-processor (DP) server chipset technology, enable reduced power consumption and improved platform reliability and system manageability. These chipsets can deliver outstanding performance, dependability and value to enterprise front-end, small-medium business (SMB), or high performance computing (HPC) applications.

 

 

Product information

Related products
Processors
Chipsets
  • Intel® E7525 Chipset
Server Boards Intel® Server Boards SE7520AF2, SE7520BD2, SE7520JR2, and SE7320SP2
Server Chassis Intel® Server Chassis SR1400 and SR2400
RAID Controller Intel® RAID Controllers SRCU42E and SRCZCRX
Other
Features and benefits

Supports two Intel® Xeon® processors over an 800 MHz system bus for dual-processing workstation and server systems

Optimized performance for multiple DP market segments and price points, supporting a larger number of users/transactions with faster response times.

800 MHz system bus capability

Increased platform bus bandwidth (50% more than 533 MHz) delivers increased system performance.

PCI Express*

Serial I/O technology that provides a direct connection between the MCH and PCI Express* devices with bandwidth up to 4 GB/s on each PCI Express* x8 interface; PCI Express offers higher bandwidth, lower latency and less I/O bottlenecks than PCI-X.

DDR2-400 memory interface
  • Offers a maximum memory bandwidth of 6.4 GB/s.
  • Decreased power consumption—especially important on dense rack, HPC and blade configurations.
  • Increased DIMMs per system providing enhanced memory scalability for memory-intensive applications.
Intel® 6700PXH 64-bit PCI hub
  • Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility.
  • Supports two independent 64-bit, 133 MHz
    PCI-X segments and two hot-plug controllers (one per segment).

Intel® Hub Interface 1.5 connection to the Memory Controller Hub (MCH)

Point-to-point connection between the MCH and the Intel® 82801ER I/O controller hub or Intel® 6300ESB I/O controller hub provides 266 MB/s of bandwidth.

Advanced platform RAS
  • Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC), DIMM sparring, DIMM scrubbingand memory mirroring can improve system reliability.
  • 32-bit CRC on PCI Express*.
  • SMBus port hooks into Intel® E7520 and Intel® E7320 chipsets for remote management operation and support for variety of third-party Base Management Controller (BMC) and BIOS solutions.

Additional information: 1 2

Packaging information
Intel® E7520 Memory Controller Hub (MCH) 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® E7320 Memory Controller Hub (MCH) 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI Hub 567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 82801ER (ICH5R) 460 Micro Ball Grid Array (µBGA)
Intel® 6300ESB I/O Controller Hub 689 Plastic Ball Grid Array (PBGA)

Videos

View More Videos
  • Intel and IBM at NAB 2010
    Intel and IBM at NAB 2010

    Showcases Intel technology in broadcast equipment and servers at the National Association of Broadcasters. (2:06)

  • Intel and AIC at NAB 2010
    Intel and AIC at NAB 2010

    Intel® Xeon® technology in broadcast equipment and servers at the National Association of Broadcasters. (2:20)

  • Intel and EMC at NAB 2010
    Intel and EMC at NAB 2010

    Video: Intel and EMC at the National Association of Broadcasters Show, 2010 (6:09)

Product and Performance Information

open

1. PCI Express* reduced power-state "L0s" is not supported.


2. In an x4 DDR memory device, the Intel® x4 Single Device Data Correction (x4 SDDC) provides error detection and correction for 1 to 4 data bits within a single device and provides error detection for up to 8 data bits within two devices.