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Intel® E8500 Chipset North Bridge/XMB Thermal Guide

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB): Thermal/Mechanical Design Guide, March 2005

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heat sinks. The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® E8500 chipset North Bridge (NB) component and the Intel® E8500 chipset eXternal Memory Bridge (XMB) component.
• Describe two reference thermal solutions that meet the specifications of the E8500 chipset NB component.
• Describe a reference thermal solution that meets the specifications of the E8500 chipset XMB component.

Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die temperatures at or below thermal specifications. This is accomplished by providing a low local ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset.

Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heat sink can be varied to balance size and space constraints with acoustic noise.

Read the full Intel® E8500 Chipset North Bridge/XMB Thermal Guide.

Intel® E8500 Chipset North Bridge/XMB Thermal Guide

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB): Thermal/Mechanical Design Guide, March 2005

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heat sinks. The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® E8500 chipset North Bridge (NB) component and the Intel® E8500 chipset eXternal Memory Bridge (XMB) component.
• Describe two reference thermal solutions that meet the specifications of the E8500 chipset NB component.
• Describe a reference thermal solution that meets the specifications of the E8500 chipset XMB component.

Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die temperatures at or below thermal specifications. This is accomplished by providing a low local ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset.

Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heat sink can be varied to balance size and space constraints with acoustic noise.

Read the full Intel® E8500 Chipset North Bridge/XMB Thermal Guide.

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