Intel E7520/E7320 Chipset MCH/Intel 6700PXH 64-Bit PCI Hub
Thermal/mechanical design guide for embedded applications
As the complexity of computer systems increases, so does the power dissipation of the components. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve head dissipation include selective use of ducting and/or passive heat sinks.
The goals of this document: To specify the operating limits of the Intel® E7520/E7329 Chipset Memory Controller Hub and the Intel® 6700PXH 64-bit PCI Hub components.
Properly designed thermal solutions provide adequate cooling to maintain the Intel® E7520/E7329 Chipset Memory Controller Hub and the Intel® 6700PXH 64-bit PCI Hub die temperatures at or below thermal specifications. This is accomplished by ensuring adequate local airflow and minimizing the die to local-ambient thermal resistance. By maintaining the Intel® E7520/E7329 Chipset Memory Controller Hub and the Intel® 6700PXH 64-bit PCI Hub die temperature at to below the specified limits, a system designer can ensure the proper functionality, performance and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
Read the full Intel® E7520/E7320 Chipset MCH/Intel® 6700PXH 64-Bit PCI Hub Guide.