Intel® 5520/5500 Chipset: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to
ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive
heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 5520 and Intel®
5500 Chipsets.
• Describe reference thermal solutions that meet the specifications of the Intel® 5520 and Intel® 5500 Chipsets.
Properly designed
thermal solutions provide adequate cooling to maintain the Intel 5520 and Intel 5500 chipsets' case temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By
maintaining Intel 5520 and Intel 5500 chipsets’ case temperatures at or below the specified limits, a system designer can ensure the proper functionality,
performance, and reliability of the IOH. Operation outside the functional limits can cause data corruption or permanent damage to the component.
The
simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel
5520 and Intel 5500 chipsets' component only. For thermal design information on other chipset components, refer to the respective component TMDG. For the ICH9,
refer to the Intel® I/O Controller Hub 9 (Intel® ICH9) Family Thermal and Mechanical Design Guidelines.
Read the full Intel® 5520/5500 Chipset Thermal Guide.
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Intel® 5520/5500 Chipset: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to
ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive
heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 5520 and Intel®
5500 Chipsets.
• Describe reference thermal solutions that meet the specifications of the Intel® 5520 and Intel® 5500 Chipsets.
Properly designed
thermal solutions provide adequate cooling to maintain the Intel 5520 and Intel 5500 chipsets' case temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By
maintaining Intel 5520 and Intel 5500 chipsets’ case temperatures at or below the specified limits, a system designer can ensure the proper functionality,
performance, and reliability of the IOH. Operation outside the functional limits can cause data corruption or permanent damage to the component.
The
simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel
5520 and Intel 5500 chipsets' component only. For thermal design information on other chipset components, refer to the respective component TMDG. For the ICH9,
refer to the Intel® I/O Controller Hub 9 (Intel® ICH9) Family Thermal and Mechanical Design Guidelines.
Read the full Intel® 5520/5500 Chipset Thermal Guide.
