For the Intel® Pentium® 4 processor on 90nm process in the 775-Land LGA package supporting Hyper-Threading Technology† with PRB = 1 and for the Intel® Pentium® 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land LGA Package.

Suppliers of support components have developed products for Intel® Pentium® 4 processor-based system designs. The listed vendors supply support components for processors in 775-Land LGA package. Some vendor products may follow design guidelines listed on the Design Guide page.

Also available: Suppliers of support components for processors in 423-pin package and in 478-pin package.

This section includes supplier information for Intel-enabled vendors for the Pentium 4 processor on 90nm process in the 775-Land LGA package supporting Hyper-Threading Technology† with PRB = 1 and the Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package. These suppliers may produce both Intel-enabled and non-Intel-enabled solutions.

Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and System Integrators are responsible for thermal, mechanical, and environmental validation of these solutions.

The following suppliers have developed cooling solutions for the Intel® Pentium® 4 processor on 90nm process in the 775-land LGA package supporting Hyper-Threading Technology† and the Pentium® 4 Processor Extreme Edition on 0.13 Micron Process in the 775-Land Package. These solutions were independently tested by an Intel-enabled, third-party test house. These suppliers may produce both compliant and non-compliant solutions in addition to what is listed below. Please regularly consult this page for updated information on heatsink vendor status.

For Intel® Pentium® 4 Processor 6x1Δ Sequence D-stepping or beyond please see thermal solutions at www.intel.com/go/thermal_Core2Duo

Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and System Integrators are responsible for thermal, mechanical, and environmental validation of these solutions.