Article ID: 000079914 Content Type: Troubleshooting Last Reviewed: 04/22/2015

Does the exposed pad of an EQFP package contribute to thermal dissipation?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description

The exposed pad on EQFP packages is a ground pad that must be connected to the ground plane on your PCB. This exposed pad is used for electrical connectivity only and not for thermal purposes. 

 

Related Products

This article applies to 3 products

MAX® V CPLDs
Cyclone® III FPGAs
Cyclone® IV E FPGA

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