Supported Modules for Intel® Server System D50TNP Family
Content Type: Product Information & Documentation | Article ID: 000058489 | Last Reviewed: 09/05/2025
The Intel® Server System D50TNP Family offers a variety of modules to meet different workload requirements in today's data centers. These modules can fit within the same 2U system chassis and share resources such as power and cooling.
Module Configuration
The table below describes the different ways that an Intel® Server System D50TNP can be configured. For additional information regarding configuration options, see Configuration Guide for the Intel® Server D50TNP Product Family.
| Module Type | iPC | Height | Width | Cooling | Max Processor Thermal Design Power (TDP)* | Modules Per Chassis |
| Compute | D50TNP1MHCPAC | 1U | Half width | Air cooled | 205W | Up to four |
| D50TNP1MHCRAC | ||||||
| D50TNP1MHCRLC | 270W | |||||
| Liquid cooled | ||||||
| Management | D50TNP2MHSVAC | 2U | Air cooled | 270W | Up to two | |
| Storage | D50TNP2MHTAC | 205W | ||||
| Accelerator | D50TNP2MFALAC | Full width | 270W | One |
| Note | See Appendix E of Technical Product Specification for the Intel® Server D50TNP Product Family for detailed information on Thermal Design Power (TDP). |
Mixing of different modules within the same system chassis can be done as follows:
| Important: | Mixing of air cooled and liquid cooled compute modules within a single system is not supported. |
Additional Information
The Intel® Server Board D50TNP1SB is at the heart of all the different modules within the product family, supporting the 3rd Generation Intel® Xeon® Scalable Processors.
Each different module type supports a different feature set in terms of:
| Note: | For more information about available Intel® Server System D50TNP Family, please access Intel® Server D50TNP Family Product Specifications |