System Memory for Intel® Desktop Board D2550MUD2





System memory features
The board has two 204-pin DDR3 SO-DIMM sockets and supports the following memory features:

  • DDR3 SDRAM SO-DIMMs with gold-plated contacts
  • Unbuffered, single-sided, or double-sided DIMMs
  • 4 GB maximum system memory
  • Minimum system memory: 256 MB
  • Non-ECC DIMMs
  • Serial presence detect
  • DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs (DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)

Because of passively-cooled thermal constraints, system memory must have an operating temperature rating of 85°C. The board is designed to be passively cooled in a properly ventilated chassis. We recommend chassis venting locations above the system memory area for maximum heat dissipation.

If you're installing only one SO-DIMM, it must be installed in the bottom socket (SO-DIMM 1).

To be compliant with DDR3 SDRAM memory specifications, populate the board with SO-DIMMs that support the serial presence detect (SPD) data structure. The BIOS can then read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, performance and reliability can be impacted or the SODIMMs might not function under the determined frequency.

Supported memory configurations
System memory configurations are based on availability and are subject to change. Support for one 4 GB SO-DIMM installed in slot 1. Slot 0 must be left empty.

Raw Card Version SO-DIMM Capacity DRAM Device Technology DRAM Organization # of DRAM Devices
B 1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
F 2 GB 1 Gb 128 M x 8 16
4 GB1 2 Gb 256 M x 8 16

Tested memory

Computer Memory Test Labs* (CMTL) tests third-party memory for compatibility with Intel® boards as requested by memory manufacturers. See the CMTL Advanced Tested Memory List* for this Intel® Desktop Board.

The table below lists parts which passed testing during development. Part numbers might not be readily available throughout the product life cycle.

Module manufacturer Module part number Module size Module speed ECC or Non-ECC Component manufacturer Component part number
Hynix HMT125S6TFR8C-G7N0 2 GB 1066 MHz Non-ECC Hynix HMT125S6TFR8C-G7N0
HMT125S6BFR8C-H9N0 2 GB 1333 MHz Non-ECC Hynix HMT125S6BFR8C-H9N0
Micron MT8JSF12864HZ-1G4F1 1 GB 1333 MHz Non-ECC Micron MT8JSF12864HZ-1G4F1
MT16JSF25664HY-1G1D1 2 GB 1066 MHz Non-ECC Micron MT16JSF25664HY-1G1D1
MT8J25664HZ-1G4D1 2 GB 1333 MHz Non-ECC Micron MT8J25664HZ-1G4D1
Samsung M471B2873FHS-CF8 1 GB 1066 MHz Non-ECC Samsung M471B2873FHS-CF8
M471B2873EH1-CH9 1 GB 1333 MHz Non-ECC Samsung M471B2873EH1-CH9
M471B5673EH1-CF8 2 GB 1066 MHz Non-ECC Samsung M471B5673EH1-CF8
M471B5773CHS-CH9 2 GB 1333 MHz Non-ECC Samsung M471B5773CHS-CH9