Physical Damage Due to External Causes on Intel® Desktop Processors

Documentation

Warranty & RMA

000007223

02/14/2020

Information on physical damage of processor (damage to due to external causes)

  • If performed improperly, the following can damage the product:
    • Integration
    • Installation
    • Usage outside design specifications
    • Packaging, if shipping or returning the product
  • Upon receipt of the returned product, we visually inspect for externally caused damage. We screen products using the naked eye or a 3X magnification scope without applying any mechanical or electrical pressure to the products.
Note
  • Damage to the product indicates the product changed from its originally shipped condition. Tampering with the product violates the Three Year Limited Warranty for Intel® Boxed Processors.
  • Motherboard sockets may leave marks under normal use. We do not consider this damage to the product due to external causes.

Possible physical damage to the product due to external causes

Defect Symptom Description Examples
Components missing or damaged
  • The component is missing from the required location.
  • Evidence of crack, chips, and damages to the components.

Missing component

Picture above: Missing component
Heat spreader damages, cracks, and scratches
On the heat spreader, reject if there are:
  • Cracks
  • Breaks
  • Chips
  • Smashed corners
  • Peeling
  • Blistering
Reject if scratches are exposing the base metal.
Indicates a deep scratch on the heat spreader

Picture above: Indicates a deep scratch on the heat spreader
Damaged or deformed package
(the package is also known as a substrate)
Package has:
  • Cracks
  • Trace cuts
  • Expose trace
  • Masking peel-offs caused by dropping or misusing product
Cracked or Bent corner

Picture above: Cracked or Bent corner
Contamination or foreign material
Presence of foreign material on:
  • Package
  • Land pads
Approved cleaning solvent could not remove foreign materials.


Foreign material on the processor's land pads

Picture above: Foreign material on the processor's land pads
Deep Scratches Deep scratches to any part of the processor

Deep scratches

Picture above: Deep scratches
Markings are not visible
  • Markings are sanded off.
  • 2D matrix has been damaged or altered.
Markings are sanded off
Picture above: Markings are sanded off
Thermally damaged processor Thermal damage (burn mark) on the processors:
  • Package
  • Components
  • Land pads

Thermally damaged processor

Picture above: Thermally damaged processor
Delidding or capping processor The upper part which is the Integrated Heat Spreader (IHS) is removed:
  • The cap (IHS) has separated from the substrate.
  • The cap (IHS) is loose.
  • The cap (IHS) is obviously re-glued.
 

Refer to the image below for acronyms used in the table.

Acronyms used in the table