On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations to enable its advanced semiconductor packaging technology, Foveros. The Rio Rancho site currently develops and manufactures Intel® Optane™ technology, embedded multi-die interconnect bridge, and Intel® silicon photonics technology. These technologies play an important role in optimizing semiconductor memory, packaging and connectivity.
Intel New Mexico Running on All Cylinders
Two sprawling fabs, advanced packaging, silicon photonics and Intel Foundry products. Intel New Mexico lies at the leading edge of semiconductor innovation, producing Intel’s advanced packaging, silicon photonics and products for Intel Foundry customers. Take a quick video tour of Intel New Mexico. (Credit: Intel Corporation)
News
- News Release: Intel and Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act | Intel New Mexico: Silicon Mesa (Fact Sheet)
- News Byte: Intel Opens Fab 9 in New Mexico
- News Byte: Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations
- Tech Policy@Intel Blog: Intel Expands Advanced Packaging Capabilities and Brings Jobs to New Mexico
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Intel in New Mexico
- Fact Sheet: Intel in New Mexico
- Corporate Responsibility Report: Intel New Mexico RISE Report: Our Commitment to Our Community
Advanced Design Explainers
B-Roll Videos
Intel Advanced Packaging in New Mexico’s Fab 9, Manufacturing in Fab 11X (B-Roll)
Video footage from January 2024 shows Intel New Mexico’s Fab 9 and Fab 11X in Rio Rancho. In January 2024, Intel celebrated the opening of Fab 9, part of the company’s previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. The Fab 9 and Fab 11X facilities represent the first operational site for mass production of Intel’s Foveros 3D advanced packaging technology. The site is also Intel's first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process and allowing for a more efficient supply chain from demand to final product. (Credit: Intel Corporation)
Download video: "Intel Advanced Packaging in New Mexico’s Fab 9, Manufacturing in Fab 11X (B-Roll)"
Intel New Mexico (B-Roll)
On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. The investment is expected to create at least 700 high-tech jobs, 1,000 construction jobs and support an additional 3,500 jobs in the state. Technologies developed and manufactured at the site play a unique role in Intel’s new era of innovation by simplifying and optimizing semiconductor packaging, memory and connectivity. The following footage includes comments from Intel CEO Pat Gelsinger, as well as footage from the interior fabrication facility (or “fab”) footage and the exterior of Intel’s Rio Rancho campus in New Mexico. (Credit: Intel Corporation)
Download video: "Intel New Mexico (B-Roll)"