On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations to enable its advanced semiconductor packaging technology, Foveros. The Rio Rancho site currently develops and manufactures Intel® Optane™ technology, embedded multi-die interconnect bridge, and Intel® silicon photonics technology. These technologies play an important role in optimizing semiconductor memory, packaging and connectivity.
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Intel in New Mexico
- Fact Sheet: Intel in New Mexico
- Corporate Responsibility Report: Intel New Mexico RISE Report: Our Commitment to Our Community