On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations to enable its advanced semiconductor packaging technology, Foveros. The Rio Rancho site currently develops and manufactures Intel® Optane™ technology, embedded multi-die interconnect bridge, and Intel® silicon photonics technology. These technologies play an important role in optimizing semiconductor memory, packaging and connectivity.
Intel Invests $3.5 Billion in New Mexico Operations
Intel’s investment will support advanced semiconductor packaging technology.