On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations to enable its advanced semiconductor packaging technology, Foveros. The Rio Rancho site currently develops and manufactures Intel® Optane™ technology, embedded multi-die interconnect bridge, and Intel® silicon photonics technology. These technologies play an important role in optimizing semiconductor memory, packaging and connectivity.
News
News Conference
New Mexico Gov. Michelle Lujan Grisham (left) and Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, display a plaque with a processor wafer on Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During a news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
U.S. Sen. Ben Ray Luján, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
U.S. Rep. Teresa Leger Fernandez, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Katie Prouty, Intel vice president, Manufacturing and Operations, Fab 11x plant manager and Intel New Mexico site leader, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham is interviewed by media Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. At an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Keyvan Esfarjani, (second from left) Intel senior vice president and general manager of Manufacturing and Operations, and New Mexico by Gov. Michelle Lujan Grisham bump elbows Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. In the background: Mindy Koch (left), Intel New Mexico Corporate Services site manager, and Erika Edgerly (right), Intel New Mexico director of public affairs. During an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Images
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
The Intel Rio Rancho campus in New Mexico develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
Workers at Fab 11x at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
Workers at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
Intel in New Mexico
- Fact Sheet: Intel in New Mexico
- Corporate Responsibility Report: Intel New Mexico RISE Report: Our Commitment to Our Community