MAX® 10 General Purpose I/O User Guide

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ID 683751
Date 3/17/2025
Public
Document Table of Contents
Document Table of Contents x
1. MAX® 10 I/O Overview 2. MAX® 10 I/O Architecture and Features 3. MAX® 10 I/O Design Considerations 4. MAX® 10 I/O Implementation Guides 5. GPIO Lite Intel® FPGA IP References 6. MAX® 10 General Purpose I/O User Guide Archives 7. Document Revision History for the MAX® 10 General Purpose I/O User Guide
1. MAX® 10 I/O Overview x
1.1. MAX® 10 Devices I/O Resources Per Package 1.2. MAX® 10 I/O Vertical Migration Support
2. MAX® 10 I/O Architecture and Features x
2.1. MAX® 10 I/O Standards Support 2.2. MAX® 10 I/O Elements 2.3. MAX® 10 I/O Buffers 2.4. I/O Standards Termination
2.1. MAX® 10 I/O Standards Support x
2.1.1. MAX® 10 I/O Standards Voltage and Pin Support
2.2. MAX® 10 I/O Elements x
2.2.1. MAX® 10 I/O Banks Architecture 2.2.2. MAX® 10 I/O Banks Performance 2.2.3. MAX® 10 I/O Banks Locations
2.3. MAX® 10 I/O Buffers x
2.3.1. Schmitt-Trigger Input Buffer 2.3.2. Programmable I/O Buffer Features
2.3.2. Programmable I/O Buffer Features x
2.3.2.1. Programmable Open Drain 2.3.2.2. Programmable Bus Hold 2.3.2.3. Programmable Pull-Up Resistor 2.3.2.4. Programmable Current Strength 2.3.2.5. Programmable Output Slew Rate Control 2.3.2.6. Programmable IOE Delay 2.3.2.7. PCI Clamp Diode 2.3.2.8. Programmable Pre-Emphasis 2.3.2.9. Programmable Differential Output Voltage 2.3.2.10. Programmable Emulated Differential Output 2.3.2.11. Programmable Dynamic Power Down
2.4. I/O Standards Termination x
2.4.1. Voltage-Referenced I/O Standards Termination 2.4.2. Differential I/O Standards Termination 2.4.3. MAX® 10 On-Chip I/O Termination
2.4.3. MAX® 10 On-Chip I/O Termination x
2.4.3.1. OCT Calibration 2.4.3.2. RS OCT in MAX® 10 Devices
3. MAX® 10 I/O Design Considerations x
3.1. Guidelines: VCCIO Range Considerations 3.2. Guidelines: Voltage-Referenced I/O Standards Restriction 3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers 3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules 3.5. Guidelines: I/O Restriction Rules 3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin 3.7. Guidelines: Analog-to-Digital Converter I/O Restriction 3.8. Guidelines: External Memory Interface I/O Restrictions 3.9. Guidelines: Dual-Purpose Configuration Pin 3.10. Guidelines: Clock and Data Input Signal for MAX® 10 E144 Package 3.11. Guidelines: MultiVolt Input for I/O Banks with 3.3 V, 3.0 V, 1.8 V, or 1.5 V VCCIO 3.12. Guidelines: LVTTL/LVCMOS I/O Utilization for MAX® 10 FPGA Package B610
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin x
3.6.1. Calculating the Total Inductance for 1.0 V Pin Placement
4. MAX® 10 I/O Implementation Guides x
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP 4.2. Verifying Pin Migration Compatibility 4.3. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP x
4.1.1. GPIO Lite Intel® FPGA IP Data Paths
4.1.1. GPIO Lite Intel® FPGA IP Data Paths x
4.1.1.1. DDR Input Path 4.1.1.2. DDR Output Path with Output Enable
4.3. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 x
4.3.1. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Parameters 4.3.2. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Result Analysis 4.3.3. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Result Mitigation
5. GPIO Lite Intel® FPGA IP References x
5.1. GPIO Lite Intel® FPGA IP Parameter Settings 5.2. GPIO Lite Intel® FPGA IP Interface Signals
1. MAX® 10 I/O Overview
2. MAX® 10 I/O Architecture and Features
3. MAX® 10 I/O Design Considerations
4. MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for the MAX® 10 General Purpose I/O User Guide

2.4.3.1. OCT Calibration

The OCT calibration circuit compares the total impedance of the output buffer to the external resistors connected to the RUP and RDN pins. The circuit dynamically adjusts the output buffer impedance until it matches the external resisters.

Each calibration block comes with a pair of RUP and RDN pins.

During calibration, the RUP and RDN pins are each connected through an external 25 Ω, 34 Ω, 40 Ω, 48 Ω, or 50 Ω resistor for respective on-chip series termination value of 25 Ω, 34 Ω, 40 Ω, 48 Ω, and 50 Ω:

  • RUP—connected to VCCIO.
  • RDN—connected to GND.

The OCT calibration circuit compares the external resistors to the internal resistance using comparators. The OCT calibration block uses the comparators' output to dynamically adjust buffer impedance.

During calibration, the resistance of the RUP and RDN pins varies. To estimate of the maximum possible current through the external calibration resistors, assume a minimum resistance of 0 Ω on the RUP and RDN pins.

Level Two Title