Intel® MAX® 10 General Purpose I/O User Guide

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ID 683751
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 I/O Overview 2. Intel® MAX® 10 I/O Architecture and Features 3. Intel® MAX® 10 I/O Design Considerations 4. Intel® MAX® 10 I/O Implementation Guides 5. GPIO Lite Intel® FPGA IP References 6. Intel® MAX® 10 General Purpose I/O User Guide Archives 7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide
1. Intel® MAX® 10 I/O Overview x
1.1. Intel® MAX® 10 Devices I/O Resources Per Package 1.2. Intel® MAX® 10 I/O Vertical Migration Support
2. Intel® MAX® 10 I/O Architecture and Features x
2.1. Intel® MAX® 10 I/O Standards Support 2.2. Intel® MAX® 10 I/O Elements 2.3. Intel® MAX® 10 I/O Buffers 2.4. I/O Standards Termination
2.1. Intel® MAX® 10 I/O Standards Support x
2.1.1. Intel® MAX® 10 I/O Standards Voltage and Pin Support
2.2. Intel® MAX® 10 I/O Elements x
2.2.1. Intel® MAX® 10 I/O Banks Architecture 2.2.2. Intel® MAX® 10 I/O Banks Performance 2.2.3. Intel® MAX® 10 I/O Banks Locations
2.3. Intel® MAX® 10 I/O Buffers x
2.3.1. Schmitt-Trigger Input Buffer 2.3.2. Programmable I/O Buffer Features
2.3.2. Programmable I/O Buffer Features x
2.3.2.1. Programmable Open Drain 2.3.2.2. Programmable Bus Hold 2.3.2.3. Programmable Pull-Up Resistor 2.3.2.4. Programmable Current Strength 2.3.2.5. Programmable Output Slew Rate Control 2.3.2.6. Programmable IOE Delay 2.3.2.7. PCI Clamp Diode 2.3.2.8. Programmable Pre-Emphasis 2.3.2.9. Programmable Differential Output Voltage 2.3.2.10. Programmable Emulated Differential Output 2.3.2.11. Programmable Dynamic Power Down
2.4. I/O Standards Termination x
2.4.1. Voltage-Referenced I/O Standards Termination 2.4.2. Differential I/O Standards Termination 2.4.3. Intel® MAX® 10 On-Chip I/O Termination
2.4.3. Intel® MAX® 10 On-Chip I/O Termination x
2.4.3.1. OCT Calibration 2.4.3.2. RS OCT in Intel® MAX® 10 Devices
3. Intel® MAX® 10 I/O Design Considerations x
3.1. Guidelines: VCCIO Range Considerations 3.2. Guidelines: Voltage-Referenced I/O Standards Restriction 3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers 3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules 3.5. Guidelines: I/O Restriction Rules 3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin 3.7. Guidelines: Analog-to-Digital Converter I/O Restriction 3.8. Guidelines: External Memory Interface I/O Restrictions 3.9. Guidelines: Dual-Purpose Configuration Pin 3.10. Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin x
3.6.1. Calculating the Total Inductance for 1.0 V Pin Placement
4. Intel® MAX® 10 I/O Implementation Guides x
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP 4.2. Verifying Pin Migration Compatibility
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP x
4.1.1. GPIO Lite Intel® FPGA IP Data Paths
4.1.1. GPIO Lite Intel® FPGA IP Data Paths x
4.1.1.1. DDR Input Path 4.1.1.2. DDR Output Path with Output Enable
5. GPIO Lite Intel® FPGA IP References x
5.1. GPIO Lite Intel® FPGA IP Parameter Settings 5.2. GPIO Lite Intel® FPGA IP Interface Signals
1. Intel® MAX® 10 I/O Overview
2. Intel® MAX® 10 I/O Architecture and Features
3. Intel® MAX® 10 I/O Design Considerations
4. Intel® MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. Intel® MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide

3.8. Guidelines: External Memory Interface I/O Restrictions

These I/O rules are applicable if you use external memory interfaces in your design.

Two GPIOs Adjacent to DQ Pin Is Disabled

This limitation is applicable to Intel® MAX® 10 10M16, 10M25, 10M40, and 10M50 devices, and only if you use DDR3 and LPDDR2 SDRAM memory standards.

Table 23.  DDR3 and LPDDR2 Memory Interface Widths and Device Packages Where Two GPIOs Adjacent to DQ Pins Are DisabledThis table lists the combination of Intel® MAX® 10 10M16, 10M25, 10M40, and 10M50 device packages, and DDR3 and LPDDR2 memory interface widths where you cannot use two GPIO pins that are adjacent to the DQ pins.
Device Package Memory Interface Width (DDR3 and LPPDR2 only)
F256 x8, x16
U324 x8, x16
F484 x8, x16, x24
F672 x8, x16, x24

Total I/O Utilization in Bank Must Be 75 Percent or Less in Some Devices

If you use DDR3 or LPDDR2 SDRAM memory interface standards, you can generally use a maximum of 75 percent of the total number of I/O pins available in a bank. This restriction differs from device to device. In some devices packages you can use all 100 percent of the I/Os. The Intel® Quartus® Prime software will output an error message if the I/O usage per bank of that device is affected by this rule.

If you use DDR2 memory interface standards, you can assign 25 percent of the I/O pins as input pins only.

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