Video: Intel EMIB Technology Explained

Key Points

  • EMIB technology leads the industry as the first 2.5D embedded bridge solution.

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Intel's embedded multi-die interconnect bridge (EMIB) is an approach to in-package high-density interconnect of heterogeneous chips.

Instead of using a large silicon interposer typically found in other approaches, EMIB uses a very small bridge die with multiple routing layers. EMIB technology leads the industry as the first 2.5D embedded bridge solution.

Learn more from Intel’s “Intel Accelerated” Event ›