Intel Press Release

First Multi-Band OFDM-Based UWB Technology Interoperability Over Wireless USB Demonstrated

INTEL DEVELOPER FORUM, SAN FRANCISCO, Sept. 8, 2004 - Intel Corporation, NEC Corporation, Texas Instruments and Wisair today showed their products exchanging data with each other in the world's first multi-vendor interoperability demonstration of the Wireless USB and ultra-wideband (UWB) specifications.

The demonstration at the Intel Developer Forum was a major milestone for the MBOA as it marks the first time that MACs from different companies have communicated with each other using a common PHY and prototype Wireless USB application stack.

The Wireless USB Promoter Group and the Multi-Band OFDM Alliance are committed to producing specifications that will become the wireless interconnect of choice between desktop and mobile PCs, handhelds, and consumer electronic devices, allowing easy connection and high-speed data exchange.

UWB technology will bring the convenience and mobility of wireless communications to the high-speed interconnects used in devices throughout the digital home and office. Designed for short-range communications over wireless personal area networks (WPANs), UWB is the leading technology for enabling the transmission of video, audio and other high-bandwidth data.

"This demonstration shows the reality of WUSB and Multi-Band OFDM-based UWB technology, and that these technologies are on track for introduction into the market in 2005," said Jeff Ravencraft, WUSB Promoter Group chairman and Intel technology strategist.

The WUSB Promoter Group, consisting of Agere Systems, HP, Intel, Microsoft, NEC, Philips Semiconductor Division and Samsung, are committed to preserving the existing USB devices, class driver infrastructure and investment, look-and-feel and ease-of-use of wired USB. WUSB will maintain the same scalable device performance and capability while also addressing new consumer electronics requirements.

Wireless USB has a targeted bandwidth of 480 Mbps at launch, which is comparable to the current wired USB 2.0 standard, and will feature wireless high-data throughput with low power consumption for distances less than 10 meters. The Wireless USB interface will deliver the benefits of high-speed wireless connectivity, security, ease-of-use and backward compatibility to customers.

The first Wireless USB implementations will be in the form of discrete silicon that will be introduced in a number of form factors. These include add-in cards and dongles along with embedding into specific solutions to support the technology's introduction and subsequent rapid ramp-up.

Joining the seven promoter group companies as key contributors were Appairent Technologies, Alereon Inc., Staccato Communications, STMicroelectronics, Texas Instruments and Wisair.

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