Intel Advancing Modular Communication Platforms With New Standards-Based Building Blocks
NEC Building Wireless Solutions for Service Providers
TELECOM WORLD, GENEVA, Switzerland, Oct. 13, 2003 - Intel Corporation today announced a suite of Intel® NetStructure products based on the Advanced Telecom Computing Architecture* (AdvancedTCA*) specification and featuring Intel microprocessors and network processors. The new products are designed to deliver the high performance and high availability required in wireless and wireline carrier-grade telecommunication infrastructure applications, with significantly improved time to market and cost.
"The new line of AdvancedTCA solutions from Intel provides equipment manufacturers and service providers performance densities required to meet the demands of networks with ever-increasing network traffic at lower operational costs," said Howard Bubb, vice president, Intel, general manager, Communications Infrastructure Group. "By adopting open standards-based platforms, they will reduce time to market, ensure access to the latest technologies, and enable rapid implementation of new value-added services."
NEC, a leading telecommunication equipment provider, chose to use the new suite of AdvancedTCA building blocks from Intel in their core 3G platforms for mobile operators.
"Modular communication platforms based on Intel microprocessors and Intel NetStructure AdvancedTCA building blocks, coupled with our technologies and know-how in developing carrier grade equipment enabled us to provide our high performance and reliable products to service provider customers such as NTT DoCoMo Inc.," said Yoshitake Matsuo, associate senior vice president, NEC. "These products with high reliability, usability, cost performance and operability help our customers to offer advanced services in a timely manner."
AdvancedTCA is the result of a new series of industry standard specifications for the next generation of carrier grade communications equipment. These specifications were developed by more than 100 companies of the PCI Industrial Computers Manufacturing Group* (PICMG) and provide a common platform for many different types of telecom equipment from manufacturers worldwide.
"Huawei is pleased with the progress of AdvancedTCA technology," said Wei Ai, senior vice president, Huawei Technologies. "It is a standards-based platform that addresses the needs of a wide range of networking and telecommunications equipment. We see the potential for significant value to our customers from Intel processor-based AdvancedTCA network infrastructure solutions."
Huawei Technologies is a fast-growing and active global telecom equipment provider with headquarters in China.
New Modular Communication Building Blocks from Intel
The new suite of AdvancedTCA-based products include the Intel® NetStructure MPCHC0001 14U Shelf, the Intel® NetStructure MPCBL0001 High Performance Single Board Computer (SBC) running Dual Intel LV Xeon processors and the Intel® NetStructure MPCMM0001 Chassis Management Module (CMM). These products are designed for 3G core network applications and enhanced services platforms (video on demand, push-to-talk servers), among others. The Intel® LV Xeon processor provides the support to address the high- performance needs of these communications applications.
Because these new products are based on a standard platform architecture, equipment providers can use the products to reduce their hardware development time and more rapidly meet the demands of their customers by using Intel building blocks or building blocks from members of the Intel® Communications Alliance. Together, these products deliver high availability by eliminating single points-of-failure, offering bandwidth scalability and redundancy and by providing a single point of administration. All products are designed to withstand continual use over the 5-10-year lifespan typical of most telecommunications equipment.
Intel also disclosed technical details for a suite of data plane telecom boards based on AdvancedTCA. These data plane boards for radio network controllers are designed for 3G wireless applications and will be introduced in the first half of 2004. The IXB 3G boards incorporate the Intel® IXP2400 and the Intel® IXP2800 network processors together with integrated, standards-based data plane software. The solution provides a flexible, modular approach for manufacturers building RNC equipment and reduces time to market by 12 to18 months and development costs by 40 percent.**
Pricing and Availability
Per unit pricing for each product is as follows: The Intel NetStructure MPCHC0001 14U Shelf MSRP is $8,100; the Intel NetStructure MPCBL0001 High Performance Single Board Computer (with Fibre Channel and Dual Xeon processors- 1.6 GHz is $3,266; and the Intel NetStructure MPCMM0001 Chassis Management Module is $1,222. All three products will be shipping in early first quarter of 2004 and will be available for order in December 2003.
Intel, IXP, XScale, Xeon and NetStructure are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
**Based on study by Yankee Group