The Intel® XMM™ 6255M modem delivers robust 3G connectivity in challenging environments and at a size of only 245 mm2, it succeeds the Intel XMM 6255 modem as a small standalone 3G modem. The Intel XMM 6255M modem is designed for IoT applications benefiting from both the widespread coverage provided by 3G networks, combined with the need for reliable signal retention even in difficult conditions. ...The modem’s reduced footprint comes from new System in Package (SiP) design improvements that combine the baseband processor and memory dies in a single package. The new SiP design gives the Intel XMM 6255M modem an ultra-tiny PCB footprint for smaller form factors, as well as reduced complexity and BOM cost. This provides a simplified, low-cost path to integrating 3G connectivity into very small IoT devices.