Intel® Docea™ Thermal Profiler (TP)
Accelerate thermal simulations.
Accelerate thermal simulations.
Intel® Docea™ Thermal Profiler (TP) is an easy to use software solution for thermal modeling and simulation that enables system architects, designers, and thermal experts to run dynamic, coupled power and thermal simulations.
With Intel® Docea™ Thermal Profiler, system architects and design teams won’t need to be experts in computational fluid dynamics modeling and simulation to benefit from a compact thermal model that simulates a device’s thermal response over time to power stimuli. Compact thermal models—generated from a 3D representation of the device—embed the expertise and validation of your thermal modeling teams.
Addressing major needs in the industry, the Intel® Docea™ Thermal Profiler provides design teams and thermal experts with a collaborative tool that helps shorten the lead time to get thermal simulation results for given power inputs and floorplans. Moreover, the Intel® Docea™ Thermal Profiler fulfills a growing need to manage packaging and assembly over-design costs by simulating realistic worst-case scenarios which take into account both power variations over time and the coupling between leakage power and temperature.
Explore more design space and perform highly accurate “what if” analyses with fast simulations. Go beyond steady state and step response thermal simulations by simulating more realistic use cases to secure the design behavior. Save costs by avoiding over designs as well as device recalls caused by undetected thermal issues.
Simplify collaboration between system architects and thermal experts by coupling compact thermal models with power models. Compact models generated by thermal experts can be used by non-experts to get immediate simulation results for new workloads and floorplans.
Don’t leave performance on the table: prototype and simulate thermal mitigation algorithms to assess how much power budget is available for optimizing the execution of key use cases.
Delve into the capabilities of Intel® Docea™ Power Analytics (PA)
The Intel® Docea™ Thermal Profiler is a system-level thermal modeling and simulation solution, composed of a graphic user interface and an application programmable interface. It also includes a 3D modeler to capture device geometries, material properties, and environment conditions (heat transfer coefficients on the system boundaries); steady state and step-response thermal solvers on the 3D model; a compact thermal model generator; and a transient simulation environment for dynamic thermal analysis. Generate compact thermal models with the Intel® Docea™ Thermal Profiler, and use them in the Intel® Docea™ Power Simulator (PS) tool for coupled, use-case-based power and thermal simulations.
Intel® Docea™ Thermal Profiler features an extensive application programmable interface (API) to automate model imports from computational fluid dynamics (CFD) tools, parameterized model constructions, and a batch simulation mode. Our support team can help you setup the flow.
Acquire the skills and knowledge needed to efficiently model and simulate systems using training programs and courses
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks.
Test and System Configurations: public presentation from Samsung, published at DAC and is available on http://www2.dac.com/events/designertrackarchivesearch.aspx.