Intel® Docea™ Thermal Profiler (TP)

Accelerate thermal simulations.

Extending Thermal Validation Coverage

Intel® Docea™ Thermal Profiler (TP) is an easy to use software solution for thermal modeling and simulation that enables system architects, designers, and thermal experts to run dynamic, coupled power and thermal simulations.

With Intel® Docea™ Thermal Profiler, system architects and design teams won’t need to be experts in computational fluid dynamics modeling and simulation to benefit from a compact thermal model that simulates a device’s thermal response over time to power stimuli. Compact thermal models—generated from a 3D representation of the device—embed the expertise and validation of your thermal modeling teams.

Addressing major needs in the industry, the Intel® Docea™ Thermal Profiler provides design teams and thermal experts with a collaborative tool that helps shorten the lead time to get thermal simulation results for given power inputs and floorplans. Moreover, the Intel® Docea™ Thermal Profiler fulfills a growing need to manage packaging and assembly over-design costs by simulating realistic worst-case scenarios which take into account both power variations over time and the coupling between leakage power and temperature.

Capabilities

Delve into the capabilities of Intel® Docea™ Power Analytics (PA)

Thermal Modeling for Compact Devices

With the Intel® Docea™ Thermal Profiler, you can create a thermal model for a device that is assumed to be a conductive system. The convection and radiation effects are modeled with heat transfer coefficients at the boundaries of the system. These assumptions are valid for very compact devices. The 3D thermal model can be automatically imported from Computational Fluid Dynamics (CFD) tools that are standards on the market for better productivity.

Verify Static and Dynamic Thermal Behavior and Time-to-Threshold

Perform fast steady-state and step-response simulations on unreduced 3D models with the Intel® Docea™ Thermal Profiler. You can also generate a compact thermal model that can generally be up to 3 orders of magnitude1 smaller in size and faster to simulate than un-reduced models. Compact thermal models simulate the temperature response to a dynamic power profile, providing key insights on time to thresholds and the effectiveness of thermal mitigation policies.

Enable Thermal Mitigation Modeling and Simulation

Model thermal mitigation algorithms using the Python*-based application programmable interface in the Intel® Docea™ Thermal Profiler. Thermal throttling effectiveness can be simulated for key use cases to get more realistic insights on the maximum allowed power budget for given applications. Export compact thermal models to the Intel® Docea™ Power Simulator (PS) for workload-based dynamic use cases or secure your time-to-market with early debug and optimization of thermal mitigation software.

Product and Performance Information

1

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks.

Test and System Configurations: public presentation from Samsung, published at DAC and is available on http://www2.dac.com/events/designertrackarchivesearch.aspx.