Article ID: 000086877 Content Type: Troubleshooting Last Reviewed: 05/05/2017

Which Intel FPGA device packages are vented?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description


Some device packages are vented, allowing moinsture to escape during bakeout. Other packages do not require venting.

Resolution

All lidless flip chip and wire bond packages are non-vented packages. All other/lidded flip chip packages are vented packages.

Related Products

This article applies to 1 products

Intel® Programmable Devices

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