Article ID: 000084867 Content Type: Product Information & Documentation Last Reviewed: 02/13/2006

How is the junction-to-ambient thermal resistance (Theta JA), and the junction-to-case thermal resistance (Theta JC) measured for Altera's packages?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description Theta JA and Theta JC values are measured following the JEDEC standard. The position of the thermocouple with respect to the FineLine BGA™ package is as follows:

  • Theta JA: in still air, the thermocouple is placed within two inches of the package's surface; in forced air, it is placed within the laminar flow, typically within two inches of the board.
  • Theta JC: the thermocouple is on the center of the top surface of the package.

Thermal resistance measurements at various points on the FineLine BGA package should not vary significantly because of the following:

  • The package consists of mostly homogeneous material.
  • The thermal resistance is measured only after the part is at equilibrium.

For these reasons, the location of the die in the package does not greatly affect the thermal resistance measurements.

Related Products

This article applies to 1 products

Intel® Programmable Devices

1

Need more help?

Contact support

Disclaimer

1

All postings and use of the content on this site are subject to Intel.com Terms of Use.