Article ID: 000083769 Content Type: Troubleshooting Last Reviewed: 08/13/2019

Why the package temperature is higher than die temperature on Intel® FPGA PAC N3000 card?

Environment

  • Intel® Quartus® Prime Pro Edition
  • BUILT IN - ARTICLE INTRO SECOND COMPONENT
    Description

    When reading temperature by fpgainfo temp command on Intel® FPGA PAC N3000 card, the package temperature may be higher than die temperature.
    It's expected behavior.

    The package temperature and die temperature are both temperature of the Intel® Arria® 10 FPGA.

    The die temperature is the temperature value read by on-board sensor component via the TEMPDIODE pins of Intel® Arria® 10 FPGA.
    The accuracy is /-1C.

    The package temperature is the temperature value read by internal TSD (Temperature Sensing Diode) of Intel® Arria® 10 FPGA.
    The accuracy is /- 5C.

    Related Products

    This article applies to 2 products

    Intel® Arria® 10 GT FPGA
    Intel® FPGA PAC N3000

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