Article ID: 000083502 Content Type: Troubleshooting Last Reviewed: 02/13/2006

Do Altera "thermally-enhanced ball-grid array (BGA) cavity up" (previously called flip chip) devices use a "fin" or "ceramic lid?"

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Description

Currently, all Altera "thermally-enhanced BGA cavity up" devices use a "ceramic lid." You can add a fin to improve thermal resistance. Fin dimensions, thermal resistance, and improvements are listed in the packaging data sheet.

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